Micro-electro mechanical systems (MEMS) device using silicon on insulator (SOI) wafer, and method of fabricating and grounding the same

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Laminated sheet

Interlayer dielectric and pre-applied die attach adhesive materials

Optical module including a Peltier device therein and having a co-axial type package

IC module and IC card

Methods for forming a high performance capacitor

Method, system, and apparatus for authenticating devices during assembly

Power semiconductor module with detector for detecting main circuit current through power semiconductor element

Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

[BONDING PAD STRUCTURE]

Packaging assembly and method of assembling the same

Substrate-less microelectronic package

Manufacturing method for multichip module

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Semiconductor device with improved design freedom of external terminal

Bump electrodes having multiple under ball metallurgy (UBM) layers

Method for packaging electronic modules and multiple chip packaging

Package structure compatible with cooling system

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Multiple chip semiconductor package

Fabrication method for stacked multi-chip package

Stacked-type semiconductor device

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

Substrate-based chip package

Semiconductor packages for enhanced number of terminals, speed and power performance

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Die package

Bonding pad for a packaged integrated circuit

Lead frame and semiconductor device using the same

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Surface mount multichip devices

Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other

Method of fabricating semiconductor memory device and semiconductor memory device driver

Light emitting diode utilizing a discrete wavelength-converting layer for color conversion

Light emitting diode mounting structure

Circuit board with built-in electronic component and method for manufacturing the same

Circuit board with at least one electronic component

Method for opening the plastic housing of an electronic module

Method, system, and apparatus for high volume transfer of dies

Method and apparatus for low temperature copper to copper bonding

Method and apparatus for low temperature copper to copper bonding

Process of forming bonding columns

Semiconductor device and manufacturing method thereof

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

Manufacturing method of a semiconductor device

Method of manufacturing an enhanced thermal dissipation integrated circuit package

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Micro lead frame package

Semiconductor device and method of manufacturing the device

Thin stacked package and manufacturing method thereof

Stacked chip semiconductor device and method for manufacturing the same

Imaging system

Semiconductor package production method and semiconductor package

Semiconductor device manufacturing method

Radiation emitting semiconductor device

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Optical module, method of manufacturing the same, optical communication device and electronic device using the same

Light source having blue, blue-green, orange and red LED's

Microelectronic package

Liquid crystal display device, electronic device having the same, and semiconductor device

Combination radio frequency identification transponder (RFID tag) and magnetic electronic article surveillance (EAS) tag

System and method for controlling integrated circuit die height and planarity

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Dual chips stacked packaging structure

Semiconductor device, method for manufacturing the same, circuit substrate and electronic device

Corrosion-resistant copper bond pad and integrated device

Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument

Corrosion-resistant bond pad and integrated device

Method for assembling integral type electronic device, and integral type electronic device

Semiconductor device

Semiconductor device with under bump metallurgy and method for fabricating the same

Chip package with grease heat sink

Integrated circuit carrier

Stack package of semiconductor device

Chip scale package and method of fabricating the same

Method of manufacturing multi-chip stacking package

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Semiconductor package having multiple embedded chips

Substrate for semiconductor package and wire bonding method using thereof

Ultra wideband BGA

Adhesion enhanced semiconductor die for mold compound packaging

Leadless leadframe package substitute and stack package

Method for forming semiconductor device including stacked dies

Semiconductor device and lead frame

Method for fabricating a substrate, including a plurality of chip package substrates

Magnetic memory device

Optoelectronic component and method for the production thereof

Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components

Solid-state imaging device and method for manufacturing the same

Semiconductor device with pixel portion and driving circuit, and electronic device

Solid-state imaging device and method for manufacturing the same

Method of mounting electronic part and flux-fill

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Manufacturing method for a printed circuit board

High-speed RFID tag assembly using impulse heating

High-speed RFID tag assembly using impulse heating

Transparent light emitting device with light emitting diodes

Transparent light emitting device with light emitting diodes

Filament LED light bulb

Transparent light emitting diodes

Method of cable sensing data collection, and electronic apparatus and chip using the same

Coplanar load pull test fixture for wave measurements

Conductive routings in integrated circuits using under bump metallization

Method and system for solder shielding of ball grid arrays

Semiconductor device with leadframe configured to facilitate reduced burr formation

Flip chip cavity package

Molded leadframe substrate semiconductor package