212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Bump structure having a side recess and semiconductor structure including the same
#602SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
#603Stacked semiconductor packages
#604Method of making an integrated circuit for a single-molecule nucleic-acid assay platform
#605Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#606Transistor devices and methods for producing transistor devices
#607Apparatuses comprising semiconductor dies in face-to-face arrangements
#608Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package
#609Vertical gallium nitride Schottky diode
#610Semiconductor device and electronic apparatus
#611Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit
#612Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#613Flat no-lead packages with electroplated edges
#614Semiconductor device with sealed semiconductor chip
#615Fault tolerant memory systems and components with interconnected and redundant data interfaces
#616Magnetically coupled galvanically isolated communication using lead frame
#617Semiconductor packages
#618Grid array connection device and method
#619Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#620Flexible fan-out wafer level process and structure
#621Semiconductor package and method for fabricating the same
#622Integrated chip scale packages
#623Semiconductor Devices and Methods of Manufacture Thereof
#624Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
#625Semiconductor device and manufacturing method of the same
#626Computer modules with small thicknesses and associated methods of manufacturing
#627Microelectronic die stack having at least one rotated microelectronic die
#628Power semiconductor module
#629Monitoring accesses to a region of an integrated circuit chip
#630Current sensor isolation
#631Image pickup module and endoscope
#632Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#633Method of manufacturing package-on-package device and bonding apparatus used therein
#634Semiconductor package having singular wire bond on bonding pads
#635Semiconductor package and method of manufacturing the same
#636Method and apparatus used for testing a device under test
#637Thin film light emitting diode
#638Semiconductor packages and methods of forming same
#639Semiconductor device including a re-interconnection layer and method for manufacturing same
#640Method of determining curing conditions, method of producing circuit device and circuit device
#641Active element, high-frequency module, and communication device
#642Semiconductor component and method of manufacture
#643Scalable phased array package
#644Semiconductor package structure
#645Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
#646Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#647Pad design for reliability enhancement in packages
#648Molding structure for wafer level package
#649Electronic substrate and electronic apparatus
#650Integrated circuit package pad and methods of forming
#651Illumination device
#652Electronic device, method of manufacturing electronic device, and electronic apparatus
#653Stacked integrated circuits with redistribution lines
#654Methods of manufacturing an integrated circuit having stress tuning layer
#655Cascode semiconductor package and related methods
#656Power module and power convertor
#657Packaged semiconductor components having substantially rigid support members
#658Method for transferring micro device
#659Power device integration on a common substrate
#660Low warpage high density trench capacitor
#661SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#662Electronic system having increased coupling by using horizontal and vertical communication channels
#663Semiconductor packages
#664Semiconductor Devices and Methods of Manufacture Thereof
#665Methods of forming connector pad structures, interconnect structures, and structures thereof
#666Semiconductor device and method of inspecting the same
#667Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
#668Semiconductor device
#669Packaged semiconductor devices and methods of packaging thereof
#670Method for singulating packaged integrated circuits and resulting structures
#671Photonics fabrication process performance improvement
#672Package structure and manufacturing method thereof
#673Semiconductor device having multiple gate pads
#674Silicon carbide power module
#675Semiconductor package having chip stack
#676Direct selective adhesion promotor plating
#677Integrated circuit (IC) package with a solder receiving area and associated methods
#678Physical quantity sensor, inertial measurement unit, electronic apparatus, portable electronic apparatus, and vehicle
#679Pressure sensor, in particular a microphone with improved layout
#680Surface mount device stacking for reduced form factor
#681Apparatus and method related to sensor die ESD protection
#682Semiconductor device
#683Semiconductor package
#684Packaged RF power amplifier having a high power density
#685Memory packages and related semiconductor packages
#686Compensating for memory input capacitance
#687Package with metal-insulator-metal capacitor and method of manufacturing the same
#688Semiconductor device and method for manufacturing semiconductor device
#689Semiconductor device and method of manufacturing the same
#690Semiconductor device
#691High reliability wafer level semiconductor packaging
#692Memristor based sensor
#693Light emitting device package
#694Light emitting apparatus, illumination apparatus and display apparatus
#695Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
#696Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device
#697Semiconductor device
#698Bond pad structure for bonding improvement
#699Substrate-with-support
#700Module installation on printed circuit boards with embedded trace technology
#701Multi-die memory device
#702Light emitting device
#703Mobile terminal
#704Electronic package
#705REDUCTION OF STRESS IN VIA STRUCTURE
#706Low loss substrate for high data rate applications
#707Semiconductor device containing integrated circuit communicating with external apparatus via two terminals
#708Interconnect structure with varying modulus of elasticity
#709Gas sensor package and sensing apparatus including the same
#710Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
#711Magnetic shielding package structure for MRAM device and method for producing the same
#712Display apparatus and manufacturing method thereof
#713Semiconductor package
#714Semiconductor device assemblies including multiple stacks of different semiconductor dies
#715Integrated circuit packaging
#716Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#717Semiconductor memory chip, semiconductor memory package, and electronic system using the same
#718Power semiconductor device
#719Multi-die integrated circuit packages and methods of manufacturing the same
#720Wire bond clamp design and lead frame capable of engaging with same
#721Integrated circuit packages with wettable flanks and methods of manufacturing the same
#722Semiconductor device
#723Testing method for testing wafer level chip scale packages
#724DRAM memory chips quick optical erasure
#725Memory device comprising programmable command-and-address and/or data interfaces
#726Transmission line optimization for multi-die systems
#727Chip-on-film and display including the same
#728Gas sensor package
#729Thermal conductivity for integrated circuit packaging
#730High voltage monolithic LED chip with improved reliability
#731Detector architecture using photodetector arrays on thinned substrates
#732Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#733Bonding apparatus and method for using the same
#734Location displacement detection method, location displacement detection device, and display device
#735Compensation device for transistors
#736Radio-frequency isolation cavities and cavity formation
#737Topside radio-frequency isolation cavity configuration
#738Printed wiring board
#739Methods of embedding magnetic structures in substrates
#740Wafer level flat no-lead semiconductor packages and methods of manufacture
#741Wafer level flat no-lead semiconductor packages and methods of manufacture
#742Wafer level flat no-lead semiconductor packages and methods of manufacture
#743Method of manufacturing a package having a power semiconductor chip
#744Semiconductor device and measurement device
#745Chip ESD protection circuit
#746Light emitting element including adhesive member containing particles
#747Vertical type light emitting diode die and method for fabricating the same
#748Vertical type light emitting diode die and method for fabricating the same
#749Structure with micro device
#750Semiconductor chip and method for forming a chip pad
#751Laser package having multiple emitters configured on a support member
#752Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
#753Mainboard assembly including a package overlying a die directly attached to the mainboard
#754Film-like adhesive and method for producing semiconductor package using film-like adhesive
#755Packaged RF power amplifier
#756Chip package structure
#757Compact wirebonding in stacked-chip system in package, and methods of making same
#758Power module substrate, power module, and method for manufacturing power module substrate
#759Switching device and electronic circuit
#760Semiconductor packages
#761Semiconductor module
#762PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#763Method of making a wire support leadframe for a semiconductor device
#764Recessed lead leadframe packages
#765Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#766Semiconductor package with a wire bond mesh
#767Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#768Radio frequency isolation structure
#769Semiconductor chip package having optical interface
#770Semiconductor device and method of manufacturing the same
#771Semiconductor apparatus and equipment
#772Semiconductor device
#773Conductor design for integrated magnetic devices
#774Systems and methods for semi-flexible eutectic bonder piece arranegments
#775Semiconductor package structure and semiconductor module including the same
#776Semiconductor chip module and semiconductor package including the same
#777LED light bulb with two sets of filaments
#778Electronic device and mounting structure of the same
#779Systems and methods for electromagnetic interference shielding
#780Chip package and manufacturing method thereof
#781Package structures
#782Semiconductor device and method for manufacturing semiconductor device
#783Semiconductor device
#784Integrated circuit package mold assembly
#785Method of manufacturing a semiconductor device
#786Semiconductor device
#787Semiconductor device
#788Optical module
#789Multiple plated via arrays of different wire heights on same substrate
#790Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#791Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#792Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
#793Power semiconductor module, electronic device, and method for controlling power semiconductor module
#794Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#795Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
#796Folded semiconductor package architectures and methods of assembling same
#797Planarization of semiconductor packages and structures resulting therefrom
#798METHOD FOR PRODUCING A 3D MEMORY DEVICE
#799Component and method of manufacturing a component using an ultrathin carrier
#800Pixel inspection method, pixel inspection device, and display device
#801Electronic device
#802Package-on-package (PoP) semiconductor package and electronic system including the same
#803SEMICONDUCTOR PACKAGE
#804Microelectronic device stacks having interior window wirebonding
#805Detection of foreign particles during wire bonding
#806Corrosion resistant aluminum bond pad structure
#807Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#808Semiconductor arrangement with reliably switching controllable semiconductor elements
#809Packaging structure with recessed outer and inner lead surfaces
#8103D SEMICONDUCTOR DEVICE AND SYSTEM
#811Galvanic signal path isolation in an encapsulated package using a photonic structure
#812Receiver optical module and process of assembling the same
#813Package structure and manufacturing method thereof
#814Micro-LED display panel and manufacturing method thereof
#815Package on package structure and method for forming the same
#816Warpage control in package-on-package structures
#817Method of fabricating integrated fan-out packages
#818Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#819Heterojunction semiconductor device for reducing parasitic capacitance
#820Phosphor and light-emitting equipment using phosphor
#821Power semiconductor module
#822Acoustic management in integrated circuit using phononic bandgap structure
#823Amplifier module
#824Optical-semiconductor device including a wavelength converting member and method for manufacturing the same
#825Method of manufacturing power semiconductor module including a power semiconductor chip and a control chip formed according to different process rules, and power semiconductor module
#826Package-on-package (PoP) structure including stud bulbs
#827Integrated circuit package assembly
#828Package assembly
#829Bump on pad (BOP) bonding structure in semiconductor packaged device
#830Semiconductor device
#831Integrally formed bias and signal lead for a packaged transistor device
#832Semiconductor device and manufacturing method thereof
#833Packaging devices and methods for semiconductor devices
#834Semiconductor structure
#835Leadless semiconductor packages, leadframes therefor, and methods of making
#836Semiconductor device and process for fabricating the same
#837Thermal management in integrated circuit using phononic bandgap structure
#838Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
#839Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#840Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#841Semiconductor device
#842Semiconductor packages and methods of forming the same
#843Package structure and method of forming the same
#844Chip package structure and method for manufacturing the same
#845Method of manufacturing semiconductor devices, corresponding device and circuit
#846Method and system for mass arrangement of micro-component devices
#847Pressure sensor devices and methods for manufacturing pressure sensor devices
#848Inverted leads for packaged isolation devices
#849Power MOSFET device and manufacturing process thereof
#850Seal ring structures and methods of forming same
#851Package substrate processing method and protective tape
#852Packages with Si-substrate-free interposer and method forming same
#853Integrated circuit package having a raised lead edge
#854Semiconductor chip and semiconductor device
#8553D SEMICONDUCTOR DEVICE AND SYSTEM
#856Integrated circuit packages and methods of forming same
#857Semiconductor die assemblies with heat sink and associated systems and methods
#858Smart packaging for improved medication regimen compliance
#859Method for manufacturing package, and method for manufacturing light emitting device
#860Method of manufacturing multi-chip package
#861Methods of forming joint structures for surface mount packages
#862Package with UBM and methods of forming
#863Method for fabricating an electronic device and a stacked electronic device
#864Electronic package with passive component between substrates
#865Semiconductor device including conductive spacer with small linear coefficient
#866Semiconductor apparatus
#867Non-magnetic package and method of manufacture
#868Memory Module and Memory System
#869Current leakage and charge injection mitigating solid state switch
#870Aluminate fluorescent material, light emitting device, and method for producing aluminate fluorescent material
#871Opening in the pad for bonding integrated passive device in InFO package
#872Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#873FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING LAYER
#874HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
#875Semiconductor packages and methods of manufacturing the same
#876Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#877Semiconductor package having a high reliability
#878Semiconductor device having stacked chips
#879ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
#880Anisotropic conductive film with conductive particles forming repeating units of polygons
#881Method of forming a semiconductor device comprising top conductive pads
#882Substrate-less stackable package with wire-bond interconnect
#883Dense redistribution layers in semiconductor packages and methods of forming the same
#884Tapeless leadframe package with underside resin and solder contact
#885Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
#886Electrically testable integrated circuit packaging
#887Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#888Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#889Package and light-emitting device
#890Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#891Semiconductor device having a junction portion contacting a Schottky metal
#892Camera module having support member with extension structure
#893Semiconductor package, semiconductor device and method of forming the same
#894Integrated circuit stacking approach
#895Multichip modules and methods of fabrication
#896Method for forming semiconductor device structure with conductive shielding structure
#897Reducing or eliminating nanopipe defects in III-nitride structures
#898Optical sensor module and a wearable device including the same
#899Member for semiconductor device
#900Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices