212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#6302Semiconductor apparatus
#6303Semiconductor device and semiconductor device mounting structure
#6304Bonded Semiconductor Structure With Pyramid-Shaped Alignment Openings and Projections
#6305Mosfet package
#6306RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME
#6307Semiconductor light emitting device, semiconductor light emitting apparatus, and method for manufacturing semiconductor light emitting device
#6308LIGT EMITTING DEVICE
#6309CHIP LED
#6310Light emitting diode package and light emitting device having the same
#6311Electronic devices with yielding substrates
#6312IC card
#6313Determining intra-die wirebond pad placement locations in integrated circuit
#6314Methods of fabricating semiconductor devices
#6315Manufacturing method for LED package
#6316CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME
#6317SEMICONDUCTOR LASER DEVICE
#6318Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
#6319Light emitting diode package with reflective layer
#6320Component support and assembly having a MEMS component on such a component support
#6321Electrical component having an electrical connection arrangement and method for the manufacture thereof
#6322DISPLAY APPARATUS
#6323Light-emitting device with reflection layers
#6324Carbonitride and carbidonitride phosphors and lighting devices using the same
#6325Wiring pattern having a stub wire
#6326Semiconductor device, manufacturing method of semiconductor device, and power source device
#6327Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#6328Semiconductor device, method for manufacturing the same, and power supply unit
#6329Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same
#6330Semiconductor device and method of forming WLCSP structure using protruded MLP
#6331Semiconductor device having agglomerate terminals
#6332Apparatus and methods for uniform metal plating
#6333Bump-on-lead flip chip interconnection
#6334Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package
#6335WAFER CHIP SCALE PACKAGE CONNECTION SCHEME
#6336Semiconductor device and method of confining conductive bump material with solder mask patch
#6337Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process
#6338Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate
#6339Semiconductor device with stacked semiconductor chips
#6340Semiconductor apparatus, manufacturing apparatus, and manufacturing method
#6341Solid-state imaging apparatus and method of manufacturing the same
#6342MRAM device and method of assembling same
#6343Semiconductor-on-insulator with back side connection
#6344POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE
#6345Low temperature high strength metal stack for die attachment
#6346LED Packaging Structure and Fabricating Method Thereof
#6347LIGHT EMITTING DEVICE PACKAGE
#6348LED PACKAGE STRUCTURE WITH A WIDE OPTICAL FIELD
#6349Led package module
#6350LED package for uniform color emission
#6351Semiconductor light-emitting device and manufacturing method
#6352Power converter
#6353IMAGE DISPLAY DEVICE AND LIGHT EMISSION DEVICE
#6354SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#6355SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT
#6356Imaging apparatus and imaging system
#6357MICROWAVE UNIT AND METHOD THEREFORE
#6358DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE
#6359Flexible circuit assembly without solder
#6360HEAT SINK AND METHOD OF MANUFACTURING THE SAME
#6361Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
#6362Biocompatible packaging
#6363Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings
#6364Manufacturing method of semiconductor device
#6365Method for mounting a semiconductor chip on a carrier
#6366Semiconductor device and manufacturing method therefor
#6367Passivation layer for semiconductor device packaging
#6368Process for forming an anti-oxidant metal layer on an electronic device
#6369Light emitting diode package and backlight unit having the same
#6370Sensor arrangement and chip comprising additional fixing pins
#6371Surface light-emitting unit and display device provided with the same
#6372White LED, backlight using the same, and liquid crystal display device
#6373Testing of semiconductor chips with microbumps
#6374Phosphor distribution in LED lamps using centrifugal force
#6375RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION
#6376MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#6377Semiconductor chip and fabricating method thereof
#6378Integrated circuit package system with post-passivation interconnection and integration
#6379Patterns of passivation material on bond pads and methods of manufacture thereof
#6380INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF
#6381PRINTED CIRCUIT BOARD AND FLIP CHIP PACKAGE USING THE SAME WITH IMPROVED BUMP JOINT RELIABILITY
#6382BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
#6383Semiconductor package and method for manufacturing the same
#6384Stacked package including spacers and method of manufacturing the same
#6385Semiconductor chip package structure, semiconductor chip and semiconductor chip group
#6386Semiconductor device including a lead frame
#6387SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6388Semiconductor device and a method of manufacturing the same
#6389PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6390MEMS microphone
#6391Device and associated semiconductor package for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#6392Semiconductor-on-insulator with back side strain inducing material
#6393Light-emitting device and method for manufacturing same
#6394Light emitting device
#6395LED module
#6396Light-emitting device package having a molding member with a low profile, and method of manufacturing the same
#6397LIGHT-EMITTING DIODE PACKAGE
#6398TWO-PHASE COOLING FOR LIGHT-EMITTING DEVICES
#6399Semiconductor light emitting device and method for manufacturing the same
#6400Light-Emitting Diode Package Device and Method for Making the Same
#6401Light-emitting device package and method of manufacturing the same
#6402LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
#6403LIGHT-EMITTING DIODE DEVICE
#6404Method of forming a light emitting diode emitter substrate with highly reflective metal bonding
#6405Narrow viewing angle plastic leaded chip carrier
#6406Light emitting devices
#6407Semiconducting sheet
#6408Semiconducting sheet
#6409Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus
#6410LED module
#6411Light emitting device having surface-modified silicate luminophores
#6412SEMICONDUCTOR CHIP MODULE AND SEMICONDUCTOR PACAKGE HAVING THE SAME
#6413RFID integrated circuit with integrated antenna structure
#6414LED PACKAGE MANUFACTURING SYSTEM
#6415SINGLE-PACKAGE WIRELESS COMMUNICATION DEVICE
#6416METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY
#6417Assembly jig for a semiconductor device and assembly method for a semiconductor device
#6418IC device having low resistance TSV comprising ground connection
#6419WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)
#6420FUNCTIONAL LAMINATE
#6421Method for determining the temperature of a power semiconductor
#6422Stacked semiconductor device
#6423Illumination device with semiconductor light-emitting elements
#6424Lighting apparatus providing increased luminous flux while maintaining color point and CRI
#6425Lighting device with flexibly coupled heatsinks
#6426Solid state lighting device with elongated heatsink
#6427Circuit assemblies including thermoelectric modules
#6428SURGE PROTECTION DEVICE
#6429Electronic component device and package substrate
#6430Light irradiating apparatus
#6431Filter having impedance matching circuits
#6432Semiconductor device
#6433High bandwidth passive switching current sensor
#6434Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing
#6435Power conversion apparatus and electric vehicle
#6436Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
#6437Semiconductor device and method for producing the same, and power supply
#6438CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF
#6439METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE
#6440Semiconductor device, method for manufacturing the same, and data processing device
#6441SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#6442Silicon-based thin substrate and packaging schemes
#6443Semiconductor device having a vertical interconnect structure using stud bumps
#6444Embedded semiconductor die package and method of making the same using metal frame carrier
#6445SEMICONDUCTOR DEVICE
#6446SEMICONDUCTOR PACKAGE
#6447Interconnection structure
#6448Elongated bump structure for semiconductor devices
#6449ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#6450Package-on-package using through-hole via die on saw streets
#6451Semiconductor package with cantilever leads
#6452SEMICONDUCTOR PACKAGES HAVING LEAD FRAMES
#6453WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
#6454Extended under-bump metal layer for blocking alpha particles in a semiconductor device
#6455Package carrier and manufacturing method thereof
#6456Semiconductor device
#6457Integrated shunt resistor with external contact in a semiconductor package
#6458Vertical discrete device with drain and gate electrodes on the same surface and method for making the same
#6459Semiconductor device and method for manufacturing the same
#6460Light emitting diode package structure
#6461Semiconductor relay
#6462High reflective board or substrate for LEDs
#6463Integrated microelectronic package temperature sensor
#6464Growth substrate and light emitting device
#6465Method for manufacturing printed wiring board and printed wiring board
#6466UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS
#6467Implantable capacitive pressure sensor apparatus and methods regarding same
#6468URETHANE RESIN COMPOSITION, CURED OBJECT, AND PHOTOSEMICONDUCTOR DEVICE USING CURED OBJECT
#6469Chip package structure with ENIG plating
#6470Single layer BGA substrate process
#6471Semiconductor device and method of forming stud bumps over embedded die
#6472Method for manufacturing semiconductor device including removing a resin burr
#6473Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device
#6474Rule-based semiconductor die stacking and bonding within a multi-die package
#6475Implementing multiple different types of dies for memory stacking
#6476Packaging method of wafer level chips
#64773D integrated circuit with logic
#6478Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer
#6479LED LIGHT SOURCES FOR IMAGE PROJECTION SYSTEMS
#6480Phosphor, light emitting apparatus, and liquid crystal display apparatus using the same
#6481Semiconductor device and liquid crystal display device containing the same
#6482Capacitive coupler packaging structure
#6483INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
#64843D semiconductor device including field repairable logics
#6485SEMICONDUCTOR APPARATUS AND IMPEDANCE CALIBRATION CIRCUIT FOR THE SAME
#6486LED DEVICE
#6487Stacked structure of chips
#6488IC device having low resistance TSV comprising ground connection
#6489WIRING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE WIRING STRUCTURE
#6490Semiconductor packages and methods of packaging semiconductor devices
#6491Bonded stacked wafers and methods of electroplating bonded stacked wafers
#6492Method to form a 3D semiconductor device
#6493Dual molded multi-chip package system
#6494OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT
#6495Circuit substrate and method of manufacturing same
#6496SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#6497Semiconductor device and method of manufacturing the semiconductor device
#6498Electrostatic chucking of an insulator handle substrate
#6499Manufacturing method of semiconductor device and semiconductor device
#6500Chip package and method for forming the same
#6501Multichip Packages
#6502METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#6503PACKAGE ON PACKAGE
#6504Semiconductor device, method of manufacturing semiconductor device, and electronic device
#6505CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER
#6506Semiconductor device including a stack of semiconductor chips, underfill material and molding material
#6507Semiconductor structure with low resistance of substrate and low power consumption
#6508Contactless communication medium
#6509STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES
#6510Semiconductor device
#6511COPPER-BASED METALLIZATION SYSTEM INCLUDING AN ALUMINUM-BASED TERMINAL LAYER
#65123D integration method using SOI substrates and structures produced thereby
#6513Optical semiconductor device
#6514MRAM DEVICE AND METHOD OF ASSEMBLING SAME
#6515Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#65163D semiconductor device
#6517Semiconductor light-emitting device
#6518Light-emitting devices
#6519Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
#6520LIGHT-EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME
#6521Contacting an optoelectronic semiconductor component through a conversion element and corresponding optoelectronic semiconductor component
#6522Light-reflective anisotropic conductive adhesive and light-emitting device
#6523Light emitting devices, systems, and methods
#6524Method for Packaging an LED Emitting Light Omnidirectionally and an LED Package
#6525Solid state lighting component package with reflective layer
#65263D semiconductor device
#6527WAVELENGTH CONVERSION PLATE AND LIGHT EMITTING DEVICE USING THE SAME
#6528Dual-interface smart card
#6529Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The Same
#6530Flow sensors having nanoscale coating for corrosion resistance
#6531Method of making glass core substrate for integrated circuit devices
#6532Integrated structures of high performance active devices and passive devices
#6533Area efficient through-hole connections
#6534METHOD FOR PACKAGING WAFER
#6535Method for connecting substrate and method for manufacturing semiconductor device
#6536Light-emitting diode arrangement and method for producing the same
#6537Method and apparatus for manufacturing LED device
#6538SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#6539Packaged microphone with reduced parasitics
#6540Light-emitting device, method for producing the same, and illuminating device
#6541LED light bulb
#6542LED light module with heat releasing casing and grooved backing to contain conductive bonding fluids
#6543Integrated led in system-in-package module
#6544EMI Shielding in a Package Module
#6545Light emitting diode switch device and array
#6546Configuration context switcher with a clocked storage element
#6547Light-mixing multichip package structure
#6548Light emitting die (LED) packages and related methods
#6549PACKAGE STRUCTURE OF FULL-COLOR LED INTEGRATED WITH DRIVING MECHANISM AND CURRENT LIMITING ELEMENTS
#6550White light emitting lamp and white LED lighting apparatus including the same
#6551METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLDING COMPOUNDS OF SEMICONDUCTOR PACKAGES
#6552Semiconductor device and wiring board
#6553Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP
#6554Packaged semiconductor device for high performance memory and logic
#6555Three-dimensional integrated circuits with protection layers
#6556Layered chip package and method of manufacturing the same
#6557Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
#6558Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#6559Device including two semiconductor chips and manufacturing thereof
#6560Semiconductor device and package wiring substrate with matrix pattern external terminals for transmitting a differential signal
#6561Semiconductor package and method for fabricating the same
#6562Forming semiconductor chip connections
#6563Semiconductor chip module, semiconductor package having the same and package module
#6564Semiconductor device and method of forming column interconnect structure to reduce wafer stress
#6565Structures for improving current carrying capability of interconnects and methods of fabricating the same
#6566DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE
#6567Solid-state imaging element, method for manufacturing solid-state imaging element, and electronic device
#6568Luminous devices, packages and systems containing the same, and fabricating methods thereof
#6569Light emitting device and fabricating method thereof
#6570Light-emitting device package and method of manufacturing the light-emitting device package
#6571LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREOF
#6572Surface-Mount LED with Optical Lens
#6573STRUCTURE OF LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF
#6574LED platform with membrane
#6575Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
#6576Packaging photon building blocks having only top side connections in a molded interconnect structure
#6577LED light source and method of manufacturing the same
#6578Gallium-nitride-on-handle substrate materials and devices and method of manufacture
#6579Semiconductor device and stacked semiconductor device
#6580DEVICE ALLOWING SUPPRESSION OF STRESS ON CHIP
#6581White light devices using non-polar or semipolar gallium containing materials and phosphors
#6582Light emitting device
#6583Light emitting device
#6584Light emitting device having curved top surface with fine unevenness
#6585(HALO)silicate-based phosphor and manufacturing method of the same
#6586Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
#6587Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
#6588Accurate alignment for stacked substrates
#6589Method for packaging airtight multi-layer array type LED
#6590Silicone resin composition and optical material
#6591Epoxy resin compositions
#6592METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE
#6593Method for forming chip package
#6594Method for bonding of chips on wafers
#6595Method of manufacturing semiconductor device
#6596CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL
#6597DRAM device with built-in self-test circuitry
#6598Light emitting device capable of preventing breakage during high drive voltage and light emitting device package including the same
#6599LED lamp and manufacturing method thereof
#6600Stacked shield compartments for electronic components