Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

Method of making an electronic device having a liquid crystal polymer solder mask and related devices

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

Connection method and substrate

Magnetic field sensor

Multi chip module, method for operating the same and DC/DC converter

Semiconductor device and method of manufacture thereof

Power semiconductor package structure and manufacturing method thereof

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

Package carrier and manufacturing method thereof

Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices

Packaging substrate with conductive structure

Materials, structures and methods for microelectronic packaging

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE

Semiconductor device

Semiconductor device

Stacked half-bridge package with a current carrying layer

IC package and method for manufacturing the same

Semiconductor module

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

Semiconductor die package and method for making the same

Stacked half-bridge package with a common conductive leadframe

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

Chip package and method for forming the same

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Semiconductor devices having insulating substrates and methods of formation thereof

COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF

Stacked half-bridge package with a common conductive clip

Light emitting device

ADHESIVE FILM FOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LED PACKAGE USING THE SAME

LIGHT-EMITTING DEVICE PACKAGE

LED with remote phosphor layer and reflective submount

PACKAGE HAVING A LIGHT-EMITTING ELEMENT AND METHOD OF FABRICATING THE SAME

LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LED WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT EMITTING MODULE

Light-emitting device package

Light-emitting device package and method of manufacturing the same

Package carrier and manufacturing method thereof

Multilayer printed wiring board

Multilayer pillar for reduced stress interconnect and method of making same

Increasing dielectric strength by optimizing dummy metal distribution

Dummy metal design for packaging structures

Method of forming metal pillar

Manufacturing method of semiconductor device

Semiconductor device having a semiconductor chip, and method for the production thereof

Device including two mounting surfaces

Nitride crystal with removable surface layer and methods of manufacture

Routable array metal integrated circuit package fabricated using partial etching process

Chip Scale Package structure with can attachment

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Ceramic Substrate For Mounting Luminescent Element

Metallization for a cavity housing and a nonmagnetic sealed cavity housing

Method and system for a photonic interposer

Laser hammering technique for aligning members of a constructed array of optoelectronic devices

SURFACE-EMITTING LASER DIODE MODULE HAVING IMPROVED FOCUSING PERFORMANCE

Light Emitting Diode (LED) Assembly and Method of Manufacturing the Same

Vertical mount transient voltage suppressor array

Phosphor, process for producing the same, and luminescent device

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

RF power amplifier

Techniques for attenuating resonance induced impedance in integrated circuits

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Light emitting diode with oscillator

METHOD OF RESIN MOLDING, RESIN MOLDING APPARATUS AND FEEDING HANDLER

Optical element package and method of manufacturing the same

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor package

Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound

Semiconductor package having an internal cooling system

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Semiconductor device and method for manufacturing the same

Semiconductor package with through silicon vias and method for making the same

Achieving mechanical and thermal stability in a multi-chip package

Semiconductor device having separated heatsink and chip mounting portion

Semiconductor device

Leadframe, semiconductor device, and method of manufacturing the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Lead frame and semiconductor package including the same

Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus

Semiconductor packages having lead frames

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

Geometry of contact sites at brittle inorganic layers in electronic devices

Selective Deposition in the Fabrication of Electronic Substrates

Semiconductor device and method of forming IPD on molded substrate

Semiconductor package with semiconductor core structure and method of forming same

Methods and materials useful for chip stacking, chip and wafer bonding

Semiconductor device

Glued light core for light-emitting diode

Light emitting device using GaN LED chip

Light-emitting device package and method of manufacturing the same

LIGHTING DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR LIGHT EMITTING PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

Light-emitting diode lamp with an improved leadframe

LIGHT EMITTING DIODE PACKAGE

LIGHT EMITTNG MODULE, METHOD OF MANUFACTURING THE SAME AND DISPLAY APPARATUS HAVING THE SAME

Packaging photon building blocks having only top side connections in an interconnect structure

Radio frequency identification device in polycarbonate and its manufacturing method

Method of manufacturing LED light bar and manufacturing equipment thereof

Methods for forming conductive elements and vias on substrates

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

Wiring board and method of producing the same

Media isolated pressure sensor

METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD

Continuously referencing signals over multiple layers in laminate packages

RF IDENTIFICATION DEVICE WITH NEAR-FIELD-COUPLED ANTENNA

Integrated circuit chip and fabrication method

Dicing die bonding film, semiconductor wafer, and semiconductor device

Method of forming adaptive interconnect structure having programmable contacts

Semiconductor packages and methods of fabricating the same

Solid element device and method for manufacturing the same

IC card and booking-account system using the IC card

LIGHTING DEVICE AND PRODUCTION METHOD OF THE SAME

Reflector for LED and light-emitting device equipped with same

Light-emitting device

LIGHT SOURCE PACKAGE

Light-source module and light-emitting device

Substrate assembly provided with capacitive interconnections, and manufacturing method thereof

Power inverter

SYNTHETIC JET PACKAGING

BARRIER DIODE FOR INPUT POWER PROTECTION

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE

Stacked-chip device

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Multi chip package

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDER BUMP CONTACTS

Substrate bonding method and semiconductor device

Semiconductor device having a copper plug

Die structure, manufacturing method and substrate thereof

Copper pillar full metal via electrical circuit structure

Semiconductor device and production method therefor

Chip package and method for forming the same

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD FOR PREPARING THE SAME

Flip chip device having simplified routing

Wafer level molding structure

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Semiconductor device

Semiconductor package and method of manufacturing the same

Chip assembly with frequency extending device

Semiconductor device

High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor

High power semiconductor package with conductive clips and flip chip driver IC

High power semiconductor package with multiple conductive clips

High power semiconductor package with conductive clip on multiple transistors

High power semiconductor package with conductive clip

Leadless semiconductor package with routable leads, and method of manufacture

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

Semiconductor package and method of fabricating the same

Semiconductor packages

Stack type semiconductor package and method of fabricating the same

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process

Image sensor circuit, system, and method

Pressure sensor and method of packaging same

Power device package structure

Anti-reflection structures for CMOS image sensors

ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE PREPARED USING THE SAME

ADHESIVE COMPOSITION

Light emitting diode with a temperature detecting pattern and manufacturing method thereof

LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

Optical semiconductor device having pre-molded leadframe with window and method therefor

Semiconductor light emitting device including bonding layer and semiconductor light emitting device package

Light emitting diode package and fabrication method thereof

LIGHT EMITTING DEVICE AND PACKAGE STRUCTURE THEREOF

LED package structure and fabrication method thereof

Nitride semiconductor light emitting diode

Light emitting diode, light emitting diode lamp, and illuminating apparatus

Light emitting diode (LED) die having stepped substrates and method of fabrication

RF identification device with near-field-coupled antenna

Methods and Structures Involving Terminal Connections

Method of Making a Low Profile Flip Chip Power Module

Controlling plating stub reflections in a chip package

Hidden plating traces

Method of manufacturing a light emitting, power generating or other electronic apparatus

Ultrasonic wire bonding method for a semiconductor device

Method of making a copper wire bond package

Power semiconductor device package method

Double-faced electrode package, and its manufacturing method

Three-dimensional semiconductor device

Method of manufacturing semiconductor device including plural semiconductor chips stacked together

Vacuum wafer level packaging method for micro electro mechanical system device

Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

Method of manufacturing a light emission device based on light emitting diodes

Light-emitting diode package, light source module having the same and backlight assembly having the same

Automotive headlamps

Light emitting device and method for manufacturing same

Light source with tunable CRI

Light bulb shaped lamp

BOND PACKAGE AND APPROACH THEREFOR

Sensor module

Vertically integrated systems

Energized ophthalmic lens including stacked integrated components

LIQUID CRYSTAL DISPLAY

Die power structure

Stacked device identification assignment

PROBE MANUFACTURING METHOD, PROBE STRUCTURE, PROBE APPARATUS, AND TEST APPARATUS

Light emitting device with sealing member containing filler particles

Printable composition of a liquid or gel suspension of diodes

Semiconductor device and assembling method thereof

Device packaging with substrates having embedded lines and metal defined pads

BALL GRID ARRAY METHOD AND STRUCTURE

Substrate with embedded stacked through-silicon via die

Three-dimensional system-in-package package-on-package structure

Semiconductor device, and inspection method thereof

Chip scale surface mounted semiconductor device package and process of manufacture

Dual-leadframe multi-chip package and method of manufacture

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer

Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture

Package with a CMOS die positioned underneath a MEMS die

PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE

Semiconductor power device having a super-junction structure

Apparatus with light emitting or absorbing diodes

Light-emitting device and lighting apparatus

Light-emitting diode die package and method for producing same

Light emitting device, light emitting device package, and lighting system including the same

Semiconductor light emitting device

Light emitting device package and method of manufacturing the same

LED PACKAGE

LIGHT EMITTING DIODE PACKAGE

LED PACKAGE AND CHIP CARRIER THEREOF

Light emitting diode chip and method of fabricating the same

LIGHT EMITTING DEVICE

Light-emitting diode die package and method for producing same

LIGHT EMITTING DEVICE

Light-emitting device package and method of manufacturing the same

Method and apparatus of fabricating a pad structure for a semiconductor device

Diode for a printable composition

Diode for a printable composition

Light emitting device having a well structure different of a multi-quantum well structures

WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME

Circuit device and method of manufacturing the same

SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE

Chip pad resistant to antenna effect and method

Electronic component employing a layered frame

Solder paste, joining method using the same and joined structure

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

LIGHT EMITTING MODULE AND BACKLIGHT UNIT USING THE SAME

Light-emitting apparatus and automotive headlamps

LED-BASED LIGHT EMITTING SYSTEMS AND DEVICES

Semiconductor chip assembly and method for making same

Enhanced stacked microelectronic assemblies with central contacts

Wiring board, semiconductor apparatus and method of manufacturing them

Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Frame-attached anti-reflection glass and method of manufacturing the same

Power transistor output match network with high Q RF path and low Q low frequency path

High-frequency power amplifier device

DC-DC CONVERTER, MODULE, POWER SUPPLY DEVICE, AND ELECTRONIC APPARATUS

Microelectromechanical transducer and corresponding assembly process

Semiconductor Element Control Device and In-Vehicle Electrical System

Thermosetting encapsulation adhesive sheet

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE OBTAINED USING THE SAME

THERMOSETTING DIE-BONDING FILM

Microelectronic package and method of manufacturing same

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor package and package on package having the same

Semiconductor device and method of forming the same

Integrated circuit having a three dimensional stack package structure

Method of fabricating a TSV for 3D packaging of semiconductor device

Embedded component device and manufacturing methods thereof

Semiconductor device

Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof

Simultaneous wafer bonding and interconnect joining

Light emitting semiconductor element bonded to a base by a silver coating

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

Method of assembling two integrated circuits and corresponding structure

Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

BGA package structure and method for fabricating the same

Elimination of RDL using tape base flip chip on flex for die stacking

Package structure

Package structure

Localized alloying for improved bond reliability

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE

Bump structure and manufacturing method thereof

Method for chip scale package and package structure thereof

IC device having electromigration resistant feed line structures

Metallic thermal joint for high power density chips

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

SEMICONDUCTOR DEVICE

Self-organizing network with chip package having multiple interconnection configurations

Method of manufacturing non-leaded package structure

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

SEMICONDUCTOR DEVICE

Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

3D integrated circuit device fabrication with precisely controllable substrate removal

Semiconductor device, manufacturing method thereof, and electronic apparatus

Semiconductor apparatus