212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Semiconductor apparatus, ignition device for internal combustion engine, and internal combustion engine system
#902APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVICE CONFIGURED TO MEASURE A HYDROSTATIC PRESSURE OF THE FLUID
#903Wireless IC device
#904Light emitting device
#905Semiconductor device, manufacturing method thereof, and electronic apparatus
#906Method of fabricating semiconductor package
#907Electronic component
#908Configurable substrate and systems
#909Post-passivation interconnect structure
#9103D SEMICONDUCTOR DEVICE AND SYSTEM
#911Stack boat tool and method using the same
#912Stacked semiconductor device assembly in computer system
#913BLUE LIGHT-EMITTING PHOSPHOR AND LIGHT EMITTING DEVICE USING SAME
#914Electronic unit
#915Stacked semiconductor dies including inductors and associated methods
#916Integrated semiconductor assemblies and methods of manufacturing the same
#917ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
#918Integrated circuit component package and method of fabricating the same
#919Electronic device packaging with galvanic isolation
#920Non-vertical through-via in package
#921Stacked semiconductor apparatus being electrically connected through through-via and monitoring method
#9223D SEMICONDUCTOR DEVICE AND SYSTEM
#9233D SEMICONDUCTOR DEVICE AND SYSTEM
#924Package structure of fingerprint identification chip
#925Proximity detector device with interconnect layers and related methods
#926Sensor package structure
#9273D SEMICONDUCTOR DEVICE AND SYSTEM
#928Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device
#929Wireless communication link using near field coupling
#930Radio frequency shielding within a semiconductor package
#931Semiconductor light-emitting device
#932Thin optoelectronic modules with apertures and their manufacture
#933Chip package structure with conductive shielding film
#934Hybrid bonding systems and methods for semiconductor wafers
#935Semiconductor package structure and manufacturing method thereof
#936Semiconductor device having conductive wire with increased attachment angle and method
#937Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
#938Semiconductor package
#939Semiconductor package device and method of manufacturing the same
#940Semiconductor chip and semiconductor device provided with same
#941Substrate-free system in package design
#942Semiconductor device having electrode pads arranged between groups of external electrodes
#943Methods for forming interconnect assemblies with probed bond pads
#944Semiconductor device and method of manufacturing the same
#945Low profile transducer module
#946Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#947Production of a multi-chip component
#948Image sensor package and imaging apparatus
#949Semiconductor device and semiconductor element with improved yield
#950Semiconductor device
#951ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL
#952Semiconductor package
#953Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#9543D integrated circuit and methods of forming the same
#955Semiconductor structure and semiconductor package device using the same
#956Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer module
#957Semiconductor package having an isolation wall to reduce electromagnetic coupling
#958On-bonder automatic overhang die optimization tool for wire bonding and related methods
#959Semiconductor package and method of forming the same
#960Vertical interconnects for self shielded system in package (SiP) modules
#961Wire bond wires for interference shielding
#962Wire support for a leadframe
#963Semiconductor device
#964A 3D SEMICONDUCTOR DEVICE AND SYSTEM
#965Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#966Method, apparatus and system to interconnect packaged integrated circuit dies
#967Fingerprint chip package and method for processing same
#968High frequency module
#969Ion sensor based on differential measurement, and production method
#970Light source apparatus and endoscope system
#971DIE BONDING TO A BOARD
#972Apparatuses comprising semiconductor dies in face-to-face arrangements
#973Bridge interconnection with layered interconnect structures
#974Damaging components with defective electrical couplings
#975Resonator device, electronic apparatus, and vehicle
#976Light emitting device
#977Heterojunction semiconductor device for reducing parasitic capacitance
#978Isolator integrated circuits with package structure cavity and fabrication methods
#979Capacitors embedded in stiffeners for small form-factor and methods of assembling same
#980Semiconductor package having spacer layer
#981Semiconductor device and manufacturing method thereof
#982Method and device for controlling operation using temperature deviation in multi-chip package
#983High-power amplifier package
#984Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#985Molded intelligent power module for motors
#986Power semiconductor device including a spacer
#9873D SEMICONDUCTOR DEVICE AND SYSTEM
#9883D semiconductor device and structure
#989Multi-chip structure and method of forming same
#990Molded range and proximity sensor with optical resin lens
#991Magneto-resistive chip package including shielding structure
#992Light emitting device and lead frame with resin
#993SEMICONDUCTOR COMPONENT HAVING AN ESD PROTECTION DEVICE
#994Dual-series varactor EPI
#995Packaged die and RDL with bonding structures therebetween
#996Flip-chip like integrated passive prepackage for SIP device
#997Semiconductor package
#998Chip on package structure and method
#999Bonding pads with thermal pathways
#10003D integration method using SOI substrates and structures produced thereby
#1001Operating method for an ultrasonic wire bonder with active and passive vibration damping
#1002Power module, power converter and manufacturing method of power module
#1003Interstage matching network
#1004Opto-reflector
#1005Multi-die fine grain integrated voltage regulation
#1006Dynamic random access memory (DRAM) mounts
#1007Semiconductor device having upper and lower redistribution layers
#1008Using an interconnect bump to traverse through a passivation layer of a semiconductor die
#1009Power semiconductor device load terminal
#1010Power module based on multi-layer circuit board
#1011Integrated circuit package with pre-wetted contact sidewall surfaces
#1012Package structure for power converter and manufacture method thereof
#1013Low CTE component with wire bond interconnects
#1014Methods of determining racetrack layout for radio frequency isolation structure
#1015Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
#1016Optical device
#1017Techniques for integrating three-dimensional islands for radio frequency (RF) circuits
#1018MULTI-CHIP SEMICONDUCTOR APPARATUS
#1019Stacked microfeature devices and associated methods
#1020Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#1021Semiconductor device
#1022Conical-shaped or tier-shaped pillar connections
#1023Phase changing on-chip thermal heat sink
#1024Electronic package that includes multiple supports
#1025Wavelength conversion member, molded body, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus
#1026Shielded magnetoresistive random access memory devices and methods for fabricating the same
#1027Method of manufacturing semiconductor light emitting device
#1028Capacitor
#1029Semiconductor device comprising PN junction diode and Schottky barrier diode
#1030Semiconductor device
#1031Memory devices with controllers under memory packages and associated systems and methods
#1032Package-on-package assembly with wire bonds to encapsulation surface
#1033Packaging device and method of making the same
#1034Semiconductor device with metal structure electrically connected to a conductive structure
#1035Thermal interface material having different thicknesses in packages
#1036Thermal interface material having different thicknesses in packages
#1037Semiconductor package device and method of manufacturing the same
#1038Semiconductor package and manufacturing method thereof
#1039Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#1040Integrated circuit device with plating on lead interconnection point and method of forming the device
#1041Electronic package that includes lamination layer
#10423D SEMICONDUCTOR DEVICE AND SYSTEM
#10433D SEMICONDUCTOR DEVICE AND SYSTEM
#10443D SEMICONDUCTOR DEVICE AND SYSTEM
#10453D SEMICONDUCTOR DEVICE AND SYSTEM
#1046Method of manufacturing a semiconductor device including through silicon plugs
#1047Semiconductor device
#1048Sensor apparatus for monitoring at least one battery cell
#1049METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED
#1050Method for packaging at least one semiconductor component and semiconductor device
#1051Coated wire
#1052METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#1053Integrated circuit comprising at least an integrated antenna
#1054Chip scale package and related methods
#1055Semiconductor structure and a method of making thereof
#1056Microelectronic devices and methods for filling vias in microelectronic devices
#1057Semiconductor component and method of manufacture
#1058Semiconductor device and method for manufacturing the same
#1059Wafer level chip scale packaging intermediate structure apparatus and method
#1060Package structures and methods for forming the same
#1061Enhanced adhesive materials and processes for 3D applications
#1062Solar photovoltaic waterless soiling monitoring systems and methods
#1063Semiconductor device package comprising a dielectric layer with built-in inductor
#1064Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#1065Ultra small molded module integrated with die by module-on-wafer assembly
#1066Interconnection substrates for interconnection between circuit modules, and methods of manufacture
#1067Power converter
#10683D integration method using SOI substrates and structures produced thereby
#1069Semiconductor structures and fabrication methods thereof
#1070Integrated circuit emulating neural system with neuron circuit and synapse device array and fabrication method thereof
#1071Integrated circuit package including miniature antenna
#1072Backside isolation for integrated circuit
#1073Optoelectronic units in an optoelectronic device
#1074Power converter monolithically integrating transistors, carrier, and components
#1075Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#1076Method of fabricating a semiconductor package
#1077Universal surface-mount semiconductor package
#1078Electrical interconnections for semiconductor devices and methods for forming the same
#1079Semiconductor package device and method of manufacturing the same
#10803D chip sharing data bus
#1081Semiconductor device with first and second semiconductor chips connected to insulating element
#1082Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#1083Semiconductor chip, semiconductor device, and electronic device
#1084Packages with through-vias having tapered ends
#1085Package structures and method of forming the same
#1086Method of fabricating low-profile footed power package
#1087Method of making fully molded peripheral package on package device
#1088Chip on film package and display apparatus having the same
#1089Electro-optic device with multiple photonic layers and related methods
#1090Termination structure for gallium nitride Schottky diode including junction barriar diodes
#1091Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
#1092Electric conductor track, method, and use
#1093Semiconductor package having routable encapsulated conductive substrate and method
#1094Chip capacitor, circuit assembly, and electronic device
#1095Method of manufacturing light emitting device and light emitting device
#1096Light source circuit unit, illuminator, and display
#1097Optoelectronic component with ESD protection
#1098Enhancement-mode III-nitride devices
#1099Semiconductor device and semiconductor device manufacturing method
#1100Semiconductor packages and devices
#1101Shielded module having compression overmold
#1102Methods and modules related to shielded lead frame packages
#1103Post-grind die backside power delivery
#1104Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals
#1105Package-on-package semiconductor assemblies and methods of manufacturing the same
#1106Positional relationship among components of semiconductor device
#11073D integration method using SOI substrates and structures produced thereby
#1108Semiconductor device and method of manufacturing the same
#1109Imaging apparatus and electronic apparatus
#1110Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#1111Method for manufacturing semiconductor structure
#1112Manufacturing method of semiconductor structure
#1113ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#1114Integrated circuit packages and methods for forming the same
#11153D vertical FET with top and bottom gate contacts
#1116Apparatus and method for multiplexing data transport by switching different data protocols through a common bond pad
#1117Illumination device
#1118Power semiconductor device and power conversion device
#1119Using MEMS fabrication incorporating into LED device mounting and assembly
#1120Multiple bond via arrays of different wire heights on a same substrate
#1121Semiconductor device
#1122Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#1123Backside substrate openings in transistor devices
#1124Semiconductor device
#1125Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#1126Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#1127Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#11283D semiconductor device and system
#1129Semiconductor device and ball bonder
#1130Semiconductor package structure
#1131Reduction of stress in via structure
#1132Reduction of stress in via structure
#1133Magneto-resistive effect element
#1134Semiconductor device packages, packaging methods, and packaged semiconductor devices
#1135Light emitting device package
#1136BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE
#1137Parallel plate waveguide for power semiconductor package
#1138Memory module and memory system
#1139High efficiency LEDs and LED lamps
#1140Reflector markers and systems and methods for identifying and locating them
#1141Electronic module and method of manufacturing the same
#1142Wireless communications with dielectric medium
#1143Semiconductor device and method of manufacturing the same
#1144Porous semiconductor handle substrate
#1145Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#1146Embedded-bridge substrate connectors and methods of assembling same
#1147Circuit boards and semiconductor packages including the same
#1148Semiconductor device and method for manufacturing the same
#1149Integrated package assembly for switching regulator
#1150Power semiconductor package having a parallel plate waveguide
#1151Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#1152Semiconductor integrated circuit device and power supply system
#1153Method of embedding WLCSP components in E-WLB and E-PLB
#1154Semiconductor device and method for manufacturing the same
#1155Semiconductor packages having wire bond wall to reduce coupling
#1156Electronic device
#1157Methods and apparatus for an improved integrated circuit package
#1158SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#1159Sensor package and manufacturing method thereof
#1160VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#1161DEVICE AND SYSTEM FOR INTEGRATED SENSOR SYSTEM (ISS)
#1162Electrode pad structure of a light emitting diode
#1163Contoured package-on-package joint
#1164Stackable microelectronic package structures
#1165Semiconductor package structure
#1166Fabrication method of semiconductor package with stacked semiconductor chips
#1167Pad structure and integrated circuit die using the same
#1168Semiconductor package structure
#1169Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
#1170Releasable carrier method
#1171Automatic device detection and connection verification
#1172Surface mount device stacking for reduced form factor
#1173Light emitting apparatus
#1174Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
#1175Method of manufacturing a semiconductor device
#1176Package with different types of semiconductor dies attached to a flange
#1177Electronic component mounting board and electronic device
#1178Semiconductor device and method of packaging
#1179Semiconductor module
#1180Grid array connection device and method
#1181Resiliently mounted sensor system with damping
#1182Ribbon bonding tools, and methods of designing ribbon bonding tools
#11833-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#1184Solid state lighting component package with conformal reflective coating
#1185Half-bridge power semiconductor module and method for manufacturing same
#1186Stacked semiconductor die assemblies with die support members and associated systems and methods
#1187Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure
#1188Semiconductor package structure and semiconductor process
#1189Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#1190Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#1191Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#1192Fiducial mark for chip bonding
#1193Method of fabricating packaging substrate
#1194Lead frame
#1195Semiconductor device
#1196Semiconductor packages and methods of packaging semiconductor devices
#1197CONDUCTIVE BALL
#1198Printed wiring board, semiconductor package and method for manufacturing printed wiring board
#1199Mounting Method of a semiconductor device using a colored auxiliary joining agent
#1200HYBRID LOW METAL LOADING FLUX