212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Light emitting device, light emitting device package and lighting system
#9602HIGH EFFICACY LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION
#9603Semiconductor substrate and semiconductor chip
#9604Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same
#9605Die stacking with an annular via having a recessed socket
#9606INTEGRATED CIRCUIT CARRIER ASSEMBLY
#9607Method of manufacturing substrates having asymmetric buildup layers
#9608PACKAGE SUBSTRATE DESIGN DEVICE, PACKAGE SUBSTRATE DESIGN METHOD, AND COMPUTER READABLE RECORDING MEDIUM FOR RECORDING PACKAGE SUBSTRATE DESIGN PROGRAM
#9609Silicon nitride passivation layer for covering high aspect ratio features
#9610Method of fabricating a capillary-flow underfill compositions
#9611Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
#9612Fabrication method for resin-encapsulated semiconductor device
#9613Semiconductor device and manufacturing method of the same
#9614Semiconductor device and automotive ac generator
#9615Pin-type chip tooling
#9616SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#9617Semiconductor device and microphone
#9618Semiconductor laser, semiconductor laser device, and fabrication method of semiconductor laser
#9619Distributed semiconductor device methods, apparatus, and systems
#9620Light emitting device package, and display apparatus and lighting system having the same
#9621Light emitting device
#9622Light emitting device package
#9623Light emitting device and illumination apparatus
#9624CIRCUIT BOARD WITH ANCHORED UNDERFILL
#9625Solid-state image pickup device and a camera module
#9626Method of sensing magnitude of current through semiconductor power device
#9627Method of manufacturing electronic device and electronic device
#9628Board on chip package
#9629Layered chip package with wiring on the side surfaces
#9630Integrated circuit packaging system with via and method of manufacture thereof
#9631Chip package and method for forming the same
#9632Interconnect structure comprising blind vias intended to be metalized
#9633Methods of forming semiconductor chip underfill anchors
#9634Process for fabricating electronic components using liquid injection molding
#9635QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#9636Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#9637Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#9638Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#9639Lead frame for semiconductor device and method of manufacturing of the same
#9640Leadframe based multi terminal IC package
#9641Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#9642Quad flat non-leaded semiconductor package
#9643Package having spaced apart heat sink
#9644SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR
#9645Semiconductor device and method of forming insulating layer around semiconductor die
#9646Electronic component arrangement comprising a varistor and a semiconductor component
#9647High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#9648Multilayered board semiconductor device with BGA package
#9649Electronic Device Package and Methods of Manufacturing an Electronic Device Package
#9650PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM, AND LIGHT-RECEIVING DEVICE
#9651Semiconductor packaging and fabrication method using connecting plate for internal connection
#9652Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#9653Light emitting device
#9654Optical semiconductor package and optical semiconductor device
#9655Light emitting device package and light unit having the same
#9656Light emitting device package
#9657Light emitting device package
#9658Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body
#9659Light emitting device, light emitting device package, and lighting system
#9660LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME
#9661Light emitting device and light emitting device package
#9662Light emitting device and light emitting device package
#9663Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit
#9664Light emitting device, light emitting device package, and lighting system
#9665Light-emitting device
#9666Substrate for fabricating light emitting device and method for fabricating the light emitting device
#9667Light emitting device and light emitting device package
#9668Semiconductor light-emitting device
#9669Warm white LEDs having high color rendering index values and related luminophoric mediums
#9670Light emitting device package
#9671Light emitting device package and lighting system including the same
#9672Light emitting diode wafer-level package with self-aligning features
#9673METHODS OF FORMING WARM WHITE LIGHT EMITTING DEVICES HAVING HIGH COLOR RENDERING INDEX VALUES AND RELATED LIGHT EMITTING DEVICES
#9674Fluorescent substance, process for production of fluorescent substance, light-emitting device and light-emitting module
#9675Electronic circuit device
#9676Semiconductor light-emitting device
#9677Methods and devices for fabricating and assembling printable semiconductor elements
#9678COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
#9679ELECTRODE PORTION STRUCTURE
#9680Wiring substrate and method of manufacturing the same
#9681Ferroelectric component and manufacturing the same
#9682Carrier system with multi-tier conductive posts and method of manufacture thereof
#9683Angular rate sensor
#9684Enhanced integrated circuit package
#9685METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#9686CONNECTING PAD PRODUCING METHOD
#9687Method of fabricating multi-chip package structure
#9688DICING DIE-BONDING FILM
#9689Low-inductance power semiconductor assembly
#9690Non-uniform diffuser to scatter light into uniform emission pattern
#9691Semiconductor package and semiconductor device
#9692SEMICONDUCTOR DEVICE
#9693Luminescent material
#9694LED lamp incorporating remote phosphor with heat dissipation features
#9695LED lamp incorporating remote phosphor and diffuser with heat dissipation features
#9696High efficiency solid state lamp and bulb
#9697LED based pedestal-type lighting structure
#9698Integrally molded die and bezel structure for fingerprint sensors and the like
#9699Flux-free chip to substrate joint serial linear thermal processor arrangement
#9700Semiconductor device
#9701Method for fabricating circuit component
#9702Multi-surface IC packaging structures
#9703Through Silicon via Bridge Interconnect
#9704Package on package
#9705METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#9706Bump-on-lead flip chip interconnection
#9707Semiconductor package with embedded die and its methods of fabrication
#9708Stacked semiconductor chips with separate encapsulations
#9709Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP
#9710Dummy TSV to improve process uniformity and heat dissipation
#9711Thin package system with external terminals and method of manufacture thereof
#9712Semiconductor device capable of switching operation mode and operation mode setting method therefor
#9713COL package having small chip hidden between leads
#9714Semiconductor device and method of forming wafer level multi-row etched lead package
#9715Chip package and method for fabricating the same
#9716Stacked semiconductor package having discrete components
#9717MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR
#9718Semiconductor device
#9719Light-emitting diode with wire-piercing lead frame
#9720Light emitting device
#9721SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME
#9722Thermally-enhanced hybrid LED package components
#9723LED flip-chip package structure with dummy bumps
#9724Light emitting device
#9725LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#9726LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT
#9727Photonic crystal phosphor light conversion structures for light emitting devices
#9728Double flip-chip LED package components
#9729Light emitting device, light emitting device package
#9730Light emitting device and method thereof
#9731Light emitting device and light unit having the same
#9732Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
#9733Increasing contrast in electronic color displays via surface texturing of LEDs
#9734Solid state lamp with thermal spreading elements and light directing optics
#9735Semiconductor device and optical pickup device
#9736LED packaging with integrated optics and methods of manufacturing the same
#9737Optical receiver device
#9738Printed wiring board
#9739Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
#9740Manufacturing method of a bump structure having a reinforcement member
#9741Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces
#9742METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#9743Semiconductor device with copper wirebond sites and methods of making same
#9744SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE
#9745Rigid-backed, membrane-based chip tooling
#9746Semiconductor device support for bonding
#9747Optical coupler and producing method thereof
#9748INTEGRATED SEMICONDUCTOR LASER DEVICE AND METHOD OF FABRICATING THE SAME
#9749Light emitting device, light emitting device package, and lighting system
#9750Jacketed LED assemblies and light strings containing same
#9751Light emitting device package and lighting system
#9752LIGHT EMITTING DEVICE, AND ILLUMINATION LIGHT SOURCE, DISPLAY UNIT AND ELECTRONIC APPARATUS INCLUDING THE LIGHT EMITTING DEVICE
#9753Light emitting device package and light unit having the same
#9754Carbon nanotubes for the selective transfer of heat from electronics
#9755CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM
#9756High Frequency Power Supply Module Having High Efficiency and High Current
#9757Die bond film, dicing die bond film, and semiconductor device
#9758Methods of forming a metal pattern and semiconductor device structure
#9759Semiconductor die having a redistribution layer
#9760Manufacturing method for semiconductor package
#9761CHIP PACKAGE
#9762Thermal vias in an integrated circuit package with an embedded die
#9763Integrated circuit packaging system with encapsulation connector and method of manufacture thereof
#9764Semiconductor device and method of manufacturing a semiconductor device
#9765SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#9766Microwave circuit package
#9767Semiconductor substrate, package and device
#9768Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#9769Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer
#9770ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE
#9771DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME
#9772Light emitting device
#9773Light emitting module, method of manufacturing the light emitting module, and lamp unit
#9774LIGHT EMITTING DIODE PACKAGES, LIGHT EMITTING DIODE SYSTEMS AND METHODS OF MANUFACTURING THE SAME
#9775Light emitting device
#9776TRANSMISSIVE OPTICAL ELEMENTS INCLUDING PHOSPHOR PATTERNS THEREIN
#9777Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
#9778SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
#9779Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#9780Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus
#9781Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same
#9782LED multi-chip bonding die and light strip using the same
#9783LED module
#9784Light emitting device, light emitting device package, and lighting system
#9785CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
#9786Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts
#9787Semiconductor memory device with plural memory die and controller die
#9788METHODS FOR MEMORY PROGRAMMING DURING PRODUCT ASSEMBLY
#9789Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package
#9790SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#9791Method for manufacturing a semiconductor structure
#9792FLIP-CHIP LED MODULE FABRICATION METHOD
#9793Light emtting device, method for manufacturing light emitting device, and light emitting apparatus
#9794Method of manufacture of an integrated circuit package
#9795METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST
#9796Optical interconnect device and method for manufacturing the same
#9797Side emitting semiconductor package
#9798Solid-state light source
#9799Optical converter system for (W)LEDs
#9800Light emitting device
#9801Electronic component
#9802Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
#9803Resin-sealed electronic control device and method of fabricating the same
#9804Apparatus and methods for thermal management of light emitting diodes
#9805Resin-sealed electronic control device and method of fabricating the same
#9806Solid-state imaging device including an imaging element and a cover member having a quartz plate
#9807ADAPTIVE LIGHTING SYSTEM WITH III-NITRIDE LIGHT EMITTING DEVICES
#9808Impedance transformer, integrated circuit device, amplifier, and communicator module
#9809Current sensors and methods
#9810Semiconductor circuit and switching power supply apparatus
#9811Fluorescent material and light-emitting device employing the same
#9812Wireless communication system
#9813Circuit component with conductive layer structure
#9814CHIP-SCALE SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#9815PACKAGE DEVICE AND FABRICATION METHOD THEREOF
#9816Wirebondless wafer level package with plated bumps and interconnects
#9817Chip structure
#9818Semiconductor device and method of forming IPD in fan-out level chip scale package
#9819Two-shelf interconnect
#9820Thermal interface material design for enhanced thermal performance and improved package structural integrity
#9821Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#9822Method of manufacturing a semiconductor device
#9823Power device packages having thermal electric modules using peltier effect and methods of fabricating the same
#9824Semiconductor device assemblies
#9825LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
#9826Device having wire bond and redistribution layer
#9827Integrated circuit packaging system with shield and method of manufacture thereof
#9828Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
#9829OPTICAL DEVICE AND METHOD OF MANUFACTURING THE DEVICE
#9830Micro-optical device packaging system
#9831Semiconductor device having a base, a cavity, a diaphragm, and a substrate
#9832Packaged device with acoustic transducer and amplifier
#9833High thermal performance packaging for optoelectronics devices
#9834Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
#9835Light emitting device, light emitting device package, and lighting system
#9836Light emitting device, light emitting device package, and lighting system
#9837LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME AND APPARATUS FOR MANUFACTURING LIGHT EMITTING DEVICE
#9838Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
#9839Substrate for mounting light-emitting element and light-emitting device
#9840Light emitting device, light emitting device package, method of manufacturing light emitting device, and lighting system
#9841Hybrid light emitting diode chip and light emitting diode device having the same, and manufacturing method thereof
#9842LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME
#9843Illuminating device
#9844Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus
#9845METAL BASED ELECTRONIC COMPONENT PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
#9846Semiconductor light-emitting element array including a semiconductor rod
#9847Light-emitting device, light-emitting element and method of manufacturing same
#9848Light emitting device, light emitting device package, and lighting system
#9849Micro-channel-cooled high heat load light emitting device
#9850Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#9851Process for making an electric testing of electronic devices
#9852Configurable IC's with dual carry chains
#9853Method for making via interconnection
#9854Flip chip mounting method and bump forming method
#9855Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates
#9856Method of making a semiconductor device having a conductive particle on an electric pad
#9857Semiconductor device and process for fabricating the same
#9858System on a chip with on-chip RF shield
#9859METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#9860SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#9861Selective removal of gold from a lead frame
#9862Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#9863Manufacturing method of semiconductor device
#9864Semiconductor device including stacked semiconductor chips
#9865Integrated circuit packaging system and method of manufacture thereof
#9866Method of manufacturing semiconductor light emitting device including step of performing etching process with respect to conductive support member
#9867Method of manufacturing layered chip package
#9868Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
#9869LED package and a backlight unit unit comprising said LED package
#9870Light-emitting device and illumination device
#9871Light-emitting device and illumination device
#9872Phosphor-centric control of color of light
#9873Led lead frame structure
#9874Semiconductor package
#9875Method for manufacturing optical device, optical device, and biological information detector
#9876Semiconductor apparatus and endoscope apparatus
#9877RFID integrated circuit with integrated antenna structure
#9878Semiconductor device
#9879METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE
#9880Light-emitting device and lighting apparatus provided with the same
#9881Light emitting device, method of manufacturing the same, light emitting device package, and illumination system
#9882MOS transistor device in common source configuration
#9883Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
#9884Solder alloy and semiconductor device
#9885Lead frame ball grid array with traces under die
#9886Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer
#9887Semiconductor chip, electrode structure therefor and method for forming same
#9888Method of fabricating a conductive post on an electrode
#9889Conductive pillar structure for semiconductor substrate and method of manufacture
#9890Land grid array package capable of decreasing a height difference between a land and a solder resist
#9891Semiconductor device and electronic device
#9892Integrated circuit package with enlarged die paddle
#9893Semiconductor storage device and manufacturing method thereof
#9894Method for manufacturing semiconductor device
#9895Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#9896Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#9897Semiconductor device and method of patterning resin insulation layer on substrate of the same
#9898Packages and methods for packaging MEMS microphone devices
#9899Light emitting element, method for manufacturing same, and light emitting device
#9900Light emitting device and light emitting device package including the same