212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
High voltage device with multi-electrode control
#1202Manufacturing method of semiconductor package
#1203Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods
#1204Substrate-less stackable package with wire-bond interconnect
#1205Semiconductor device
#1206SEMICONDUCTOR DEVICE
#1207Molding compound including a carbon nano-tube dispersion
#1208Apparatus for communication across a capacitively coupled channel
#1209Magnetically coupled galvanically isolated communication using lead frame
#1210Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#1211Warpage control in package-on-package structures
#1212Semiconductor device and manufacturing method thereof
#1213Semiconductor package and method of fabricating the same
#1214Semiconductor package and method for fabricating the same
#1215Integrated circuit (IC) package with a solder receiving area and associated methods
#1216Semiconductor package
#1217Method for manufacturing semiconductor device
#1218Compact media player
#1219Light-emitting device having surface-modified luminophores
#1220Power module
#1221Picking up irregular semiconductor chips
#12223D semiconductor device, fabrication method and system
#1223Handler bonding and debonding for semiconductor dies
#1224Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter
#1225Methods of forming connector pad structures, interconnect structures, and structures thereof
#1226Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane
#1227Method and structure for wafer level packaging with large contact area
#1228Package with metal-insulator-metal capacitor and method of manufacturing the same
#1229Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#1230Electrically testable microwave integrated circuit packaging
#1231Stacked semiconductor device
#1232Integrated circuit sensor and sensor substrate
#1233SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#1234Structures and methods for shielding magnetically sensitive components
#1235Semiconductor memory device and structure
#1236Advanced node cost reduction by ESD interposer
#1237Substrates, assembles, and techniques to enable multi-chip flip chip packages
#1238Packaging through pre-formed metal pins
#1239High-frequency module
#1240Selective planishing method for making a semiconductor device
#1241Wedge bonding tools, wedge bonding systems, and related methods
#1242Package-on-package structures and methods for forming the same
#1243Integrated circuit package having wirebonded multi-die stack
#1244Packages with metal line crack prevention design
#1245Semiconductor device
#1246Light emitting device and light emitting module
#1247Package structure and method of manufacturing the same
#1248High-frequency module
#1249Chip package structure and manufacturing method thereof
#1250Ceramic metal circuit board and semiconductor device using the same
#1251Molding structure for wafer level package
#1252Semiconductor device package and a method of manufacturing the same
#1253Low cost package warpage solution
#1254Integrated circuit package mold assembly
#1255Current sensing device and method for producing the same
#1256Semiconductor device including plural semiconductor chips
#1257Electronic device and mounting structure of the same
#1258Packaging assembly and method of making the same
#1259Camera module and electronic apparatus to lower risk of breakage of camera module
#1260Semiconductor device and a method of manufacturing the same
#1261Wire bonded wide I/O semiconductor device
#1262Packaging devices and methods for semiconductor devices
#1263Semiconductor package and method of fabricating the same
#1264Method of making a wire support leadframe for a semiconductor device
#1265Semiconductor memory device and a chip stack package having the same
#1266Wafer level flat no-lead semiconductor packages and methods of manufacture
#1267Fingerprint sensor device and method
#1268Light emitting element
#1269Power module assembly with dual substrates and reduced inductance
#1270Methods, circuits and systems for a package structure having wireless lateral connections
#1271Semiconductor device
#1272Semiconductor device with stacked terminals
#1273Wiring substrate and semiconductor device
#1274Package structures and method of forming the same
#1275Multi-die memory device
#1276Manufacturable RGB laser diode source
#1277Thermal ground planes and light-emitting diodes
#1278Semiconductor device, and method of manufacturing the same
#1279Fabrication method of electronic package having embedded package block
#1280Packaged semiconductor assemblies and methods for manufacturing such assemblies
#1281Redistribution layer structures for integrated circuit package
#1282Leadframe and method of manufacturing the same
#1283Package-on-package with cavity in interposer
#1284Solder in cavity interconnection structures
#1285Packaging structures of integrated circuits
#1286Method for manufacturing interconnect structure
#1287Semiconductor device structure and method for forming the same
#1288Pad design for reliability enhancement in packages
#1289Semiconductor device including a bidirectional switch
#1290SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES
#1291Paste material, wiring member formed from the paste material, and electronic device including the wiring member
#1292Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
#1293Pressing of wire bond wire tips to provide bent-over tips
#1294Methods related to implementing surface mount devices with ground paths
#1295Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component
#1296Composite board, light-emitting device, and manufacturing method of light-emitting device
#1297IGBT die structure with auxiliary P well terminal
#1298Semiconductor package
#1299Method for interconnecting stacked semiconductor devices
#1300Semiconductor package including package substrate and chip stack in which a lower chip has a respective dummy pad by which each upper chip is connected to the package substrate
#1301Three-dimensional package structure and the method to fabricate thereof
#1302Interconnect structure and method of forming same
#1303Terminal structure of a power semiconductor device
#1304Electronic component package and method of manufacturing the same
#1305Multi-chip package and method of providing die-to-die interconnects in same
#1306Through via structure and method
#1307HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY
#1308Thermal interface material layer and package-on-package device including the same
#1309Devices and methods related to radio-frequency switches having improved on-resistance performance
#1310Manufacturing method for semiconductor package with cantilever pads
#1311Fluoride fluorescent material and method for producing the same as well as light emitting device using the same
#1312Light-emitting diode device
#1313LIGHT EMITTING DIODE
#1314Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
#1315Display apparatus and manufacturing method thereof
#1316SOLID STATE DEVICE MINIATURIZATION
#1317FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE
#1318Semiconductor packages with leadframes and related methods
#1319Wire bonding methods and systems incorporating metal nanoparticles
#1320Protective film for semiconductors, semiconductor device, and composite sheet
#1321Packaged integrated circuit device with cantilever structure
#1322Integrated circuit package substrate
#1323POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS
#1324Semiconductor devices and methods of making the same
#1325Semiconductor device with island and associated leads
#1326Handler bonding and debonding for semiconductor dies
#1327Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#1328Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#1329Thermocompression Bonding with Passivated Gold Contacting Metal
#1330Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#1331Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#1332Thermocompression Bonding Using Metastable Gas Atoms
#1333System for Low-Force Thermocompression Bonding
#1334Amplifier devices with back-off power optimization
#1335High breakdown voltage passive element and high breakdown voltage passive element manufacturing method
#1336Electronic system having increased coupling by using horizontal and vertical communication channels
#1337Semiconductor package and method of manufacturing the semiconductor package
#1338LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion
#1339Method for making semiconductor device with sidewall recess and related devices
#1340Active chip on carrier or laminated chip having microelectronic element embedded therein
#1341Cascode semiconductor package and related methods
#1342Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
#1343MEMS sensor package systems and methods
#1344Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#1345Control device with semiconductor module having bent latch, control, power supply and motor control terminals
#1346Light emitting device and method for manufacturing light emitting device
#1347Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#1348Semiconductor package
#1349Integrated circuit module and method of forming same
#1350Bonding wire for semiconductor device
#1351Semiconductor device and method for manufacturing the same
#1352Ring structures in device die
#1353Semiconductor device and semiconductor package including the same
#1354Semiconductor device
#1355Semiconductor device and process for fabricating the same
#13563D SEMICONDUCTOR DEVICE AND STRUCTURE
#1357Manufacturing method of semiconductor device
#1358Flip-chip beamforming integrated circuit with integral thermal mass
#1359Beamforming integrated circuit with RF grounded material ring
#1360LED module
#1361Semiconductor package
#1362METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUIT DEVICE, AND CIRCUIT DEVICE
#1363Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
#1364Manufacturing method of an electronic component module
#1365Light-emitting devices having closely-spaced broad-spectrum and narrow-spectrum luminescent materials and related methods
#1366LIGHT EMITTING DEVICE
#1367Method of manufacturing semiconductor package
#1368Semiconductor device and manufacturing method of the same
#1369Flexible display panel, display device nd bonding method thereof
#1370Connecting techniques for stacked CMOS devices
#1371Semiconductor device and method of manufacturing the same
#1372Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#1373Cavity formation in backside interface layer for radio-frequency isolation
#1374Electronic circuit package using composite magnetic sealing material
#1375Fully molded miniaturized semiconductor module
#1376Semiconductor device and wiring board design method
#1377Fan-out ball grid array package structure and process for manufacturing the same
#1378Thermally conductive semiconductor device and manufacturing method thereof
#1379Semiconductor device and method of forming interposer with opening to contain semiconductor die
#1380Light emitting diode display with redundancy scheme
#1381Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
#1382Electronic system having increased coupling by using horizontal and vertical communication channels
#1383Method of manufacturing semiconductor devices having conductive plugs with varying widths
#1384Semiconductor device method of manufacture
#1385Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers
#1386Power semiconductor module and method for manufacturing the same
#1387Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
#1388Method of manufacturing a semiconductor power package
#1389Semiconductor chip package having optical interface
#1390Magnetic field sensor and method for making same
#1391Solution for reducing poor contact in InFO package
#1392Method of producing an interposer-chip-arrangement for dense packaging of chips
#1393Method for forming ball in bonding wire
#1394Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#1395SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
#1396Tall and fine pitch interconnects
#1397Dual-sided radio-frequency package with overmold structure
#1398Semiconductor package and fabricating method thereof
#1399Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
#1400Semiconductor package
#1401Package structures
#1402Chip carrier configured for delamination-free encapsulation and stable sintering
#1403Lead and lead frame for power package
#1404Semiconductor device
#1405Semiconductor device
#14063D IC bump height metrology APC
#1407Integrated III-V device and driver device units and methods for fabricating the same
#1408SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#1409Systems and methods for bonding semiconductor elements
#1410PHOSPHOR AND LIGHT EMITTING DEVICE
#1411Selective area heating for 3D chip stack
#1412Composite semiconductor device
#1413Semiconductor package including antenna substrate and manufacturing method thereof
#1414Light emitting device and light emitting device package
#1415Semiconductor device
#1416Substrate and the method to fabricate thereof
#1417Semiconductor device
#1418Land structure for semiconductor package and method therefor
#1419Package with roughened encapsulated surface for promoting adhesion
#1420High reliability wafer level semiconductor packaging
#1421Semiconductor system
#1422Semiconductor device, measurement device, and correction method
#1423Radio-frequency isolation using cavity formed in interface layer
#1424LIGHT EMITTING DIODES AND METHODS
#1425Cavity formation using sacrificial material
#1426Non-volatile memory with stacked semiconductor chips
#1427Method for fabricating a semiconductor package
#1428Semiconductor device having stacked chips
#1429Pad design for reliability enhancement in packages
#1430Semiconductor device
#1431Hall effect sensing element
#1432Flow sensor, method for manufacturing flow sensor and flow sensor module
#1433Packaging for high power integrated circuits and infrared emitter arrays
#1434Sensor device with ingress protection
#1435Method of manufacturing light emitting device including metal patterns and cut-out section
#1436Power device integration on a common substrate
#1437Semiconductor device and method of manufacturing the same
#1438Semiconductor device with a semiconductor chip connected in a flip chip manner
#1439SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1440Scalable semiconductor interposer integration
#1441Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
#1442Leadframe package with stable extended leads
#1443Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package
#1444Light-emitting device and manufacturing method thereof
#1445Light emitting device and light emitting device package
#1446Electronic package structure with multiple electronic components
#1447Bonding device
#1448Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
#1449Power transistor with harmonic control
#1450Wire bond wires for interference shielding
#1451Electronic component mounting substrate, electronic device, and electronic module
#1452Semiconductor chip package having a repeating footprint pattern
#1453Semiconductor device
#1454Method of fabricating a chip module with stiffening frame and orthogonal heat spreader
#1455Chip module with stiffening frame and orthogonal heat spreader
#1456Integrated circuit package pad and methods of forming
#1457Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#1458Semiconductor device and method of manufacturing the same
#1459Encoder head with birefringent elements for forming imperfect retroreflection and exposure system utilizing the same
#1460Laser package having multiple emitters configured on a support member
#1461Semiconductor package and manufacturing method thereof
#1462Semiconductor optical package and method
#1463Apparatus and methods for multi-die packaging
#1464Bump structure having a side recess and semiconductor structure including the same
#14653D printed hermetic package assembly and method
#1466Integrated circuit die having a split solder pad
#1467Memories and memory components with interconnected and redundant data interfaces
#1468Tool and method of reflow
#1469Battery protecting apparatus
#1470Stack device having voltage compensation
#1471Package-on-package (PoP) structure including stud bulbs
#1472Semiconductor packaging structure and method
#1473LPS solder paste based low cost fine pitch pop interconnect solutions
#1474Elongated bump structures in package structure
#1475Method of manufacturing a semiconductor device
#1476Cavity package with composite substrate
#1477Semiconductor device with lead terminals having portions thereof extending obliquely
#1478Packaging structures with improved adhesion and strength
#1479Fabrication method of electronic package
#1480Memory device comprising programmable command-and-address and/or data interfaces
#1481Systems and methods for single-molecule nucleic-acid assay platforms
#1482Phosphor, method for manufacturing same, and light-emitting device
#1483Method for manufacturing semiconductor device
#1484Integrated electronic device with transceiving antenna and magnetic interconnection
#1485Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1486Noise cancellation for a magnetically coupled communication link utilizing a lead frame
#1487Integrated circuit including wire structure, related method and design structure
#1488Remapped packaged extracted die with 3D printed bond connections
#1489Power semiconductor module
#1490Semiconductor device
#1491Semiconductor packages having an electric device with a recess
#1492Strip-type substrate for producing chip card modules
#1493MEMS capacitive shear sensor system having an interface circuit
#1494Optoelectronic semiconductor component
#1495Light emitting diode package having frame with bottom surface having two surfaces different in height
#1496Electronic device including a HEMT
#1497Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device
#1498Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#1499Semiconductor packages and methods of packaging semiconductor devices
#1500Method and apparatus for making integrated circuit packages