212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Method for producing a metal-ceramic substrate for electric circuits on modules
#13502Electrical contact for a cadmium tellurium component
#13503Method to prevent corrosion of bond pad structure
#13504Semiconductor die singulation method
#13505MANUFACTURING METHOD FOR PACKAGE STRUCTURE
#13506Semiconductor Chip Having a Photodiode, Semiconductor Device and Manufacturing Method Thereof
#13507METHOD FOR MANUFACTURING THIN TYPE LIGHT EMITTING DIODE ASSEMBLY
#13508Metallized substrate and method for producing the same
#13509BONDING METHOD OF SILICON BASE MEMBERS, DROPLET EJECTION HEAD, DROPLET EJECTION APPARATUS, AND ELECTRONIC DEVICE
#13510OPTICAL FIBER SENSOR HAVING ELECTRICAL CONNECTORS
#13511Leak-proof LED base structure
#13512Semiconductor device
#13513Thermal spacer for stacked die package thermal management
#13514Image pickup apparatus and semiconductor circuit element
#13515Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal
#13516Integrated circuit protection layer used in a capacitive capacity
#13517Single full-color LED with driving mechanism
#13518Composite substrate and elastic wave device using the same
#135193D chip-stack with fuse-type through silicon via
#13520Programmable through silicon via
#13521Intrusion detection using a conductive material
#13522Ceramic composite for phototransformation and light emitting device using the same
#13523Package Structure for Solid-State Lighting with Low Thermal Resistance
#13524Light emitting device
#13525Semiconductor device having recess with varying width and method of manufacturing the same
#13526Semiconductor device
#13527Semiconductor device and manufacturing method of the same
#13528Semiconductor device and manufacturing method of the semiconductor device
#135293D integration of vertical components in reconstituted substrates
#13530Substrate bonding with metal germanium silicon material
#13531SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP
#13532SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#13533Semiconductor device and electronic apparatus equipped with the semiconductor device
#13534Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
#13535Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof
#13536Achieving mechanical and thermal stability in a multi-chip package
#13537INTEGRATED CIRCUIT CHIP PACKAGE MODULE
#13538Stackable layer containing ball grid array package
#13539SEMICONDUCTOR DEVICE
#13540Multi-chip semiconductor package
#13541Lead frames with improved adhesion to plastic encapsulant
#13542Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
#13543Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
#13544IC package with capacitors disposed on an interposal layer
#13545OPTICAL DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD OF MANUFACTURING OPTICAL DEVICE
#13546SEMICONDUCTOR DEVICE
#13547Semiconductor device and method for manufacturing
#13548Method for forming a patterned thick metallization atop a power semiconductor chip
#13549SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST
#13550LIGHT-EMITTING DIODE ILLUMINATING APPARATUS
#13551CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#13552LED packaging structure and fabricating method thereof
#13553LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONVERSION AND METHODS OF MANUFACTURE THEREOF
#13554PACKAGE STRUCTURE
#13555Semiconductor device including bonding pads and semiconductor package including the semiconductor device
#13556Wire bonding apparatus and wire bonding method
#13557Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#13558RF power module
#13559High-yield method of exposing and contacting through-silicon vias
#13560Stacked integrated chips and methods of fabrication thereof
#13561Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme
#13562Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method
#13563Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps
#13564Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#13565Thin quad flat package with no leads (QFN) fabrication methods
#13566Laser bonding for stacking semiconductor substrates
#13567ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME
#13568Optical module implementing a light-receiving device and a light-transmitting device within a common housing
#13569CONDENSER MICROPHONE USING THE CERAMIC PACKAGE WHOSE INSIDE IS ENCOMPASSED BY METAL OR CONDUCTIVE MATERIALS
#13570Passive phase control in an external cavity laser
#13571Backlight panel employing white light emitting diode having red phosphor and green phosphor
#13572ELECTRO-HYDRODYNAMIC GAS FLOW LED COOLING SYSTEM
#13573Computer modules with small thicknesses and associated methods of manufacturing
#13574Substrate for high frequency and package using this substrate
#13575Magnetic device having a conductive clip
#13576Semiconductor circuit and switching power supply apparatus
#13577SEMICONDUCTOR LIGHT-EMITTING DEVICE AS WELL AS LIGHT SOURCE DEVICE AND LIGHTING SYSTEM INCLUDING THE SAME
#13578Phosphor particle group and light emitting apparatus using the same
#13579Electronic device
#13580Substrate having optional circuits and structure of flip chip bonding
#13581Contact pad supporting structure and integrated circuit for crack suppresion
#13582Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps
#13583Semiconductor device and method of fabricating the same
#13584SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS
#13585Power semiconductor module and fabrication method thereof
#13586SEMICONDUCTOR DEVICE
#13587Semiconductor package system with thermal die bonding
#13588Wafer level vertical diode package structure and method for making the same
#13589Method and apparatus for stacked die package with insulated wire bonds
#13590Semiconductor device including wires connecting electrodes to an inner lead
#13591Semiconductor device with lead terminals having portions thereof extending obliquely
#13592Power module package having excellent heat sink emission capability and method for manufacturing the same
#13593Integrated circuit package-on-package stacking system
#13594Semiconductor device, method for manufacturing the same, and multilayer substrate having the same
#13595OPTICAL DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD
#13596Micromechanical component and method for producing a micromechanical component
#13597Microelectromechanical apparatus and method for producing the same
#13598Semiconductor package
#13599Metal schemes of trench MOSFET for copper bonding
#13600Semiconductor device with circuit for reduced parasitic inductance
#13601Light emitting diode package structure and method for fabricating the same
#13602Light emitting device with improved light extraction efficiency
#13603PACKAGING STRUCTURE OF LIGHT-EMITTING COMPONENTS
#13604Semiconductor light emitting device
#13605Light emitting diode package structure
#13606Wavelength-converting casting composition and light-emitting semiconductor component
#13607Chip card with dual communication interface
#13608Method of assembling a member on a support by sintering a mass of conductive powder
#13609Wiring board and method of manufacturing the same
#13610IC PACKAGE HAVING COLORED PATTERN
#13611Functional element-mounted module and a method for producing the same
#13612EXTRA HIGH BANDWIDTH MEMORY DIE STACK
#13613Methods for making microelectronic die systems
#13614ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME
#13615Fiber optic transceiver (FOT) module and method for manufacturing an FOT module
#13616METHOD AND DEVICE TO IMPROVE SIGNAL-TO-NOISE RATIO IN HIGH-SPEED OPTICAL DATA COMMUNICATIONS
#13617LED lamp unit
#13618Light source, light-emitting module having the same and backlight unit have the same
#13619Power module
#13620SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
#13621Methods for forming packaged products
#13622Liquid crystal display
#13623PACKAGED POWER SWITCHING DEVICE
#13624Illuminating device
#13625Sealing agent for optical semiconductor element, and optical semiconductor element
#13626PROCESS FOR THE PREPARATION OF A LINE-EMITTER PHOSPHOR
#13627Integrated circuit package system and method of manufacture thereof
#13628HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME
#13629Semiconductor device and manufacturing method thereof
#13630SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#13631Through-wafer interconnects for photoimager and memory wafers
#13632Electronic device and electronic apparatus
#13633Method of Producing Optoelectronic Components and Optoelectronic Component
#13634Marking method for semiconductor device and semiconductor device provided with markings
#13635Semiconductor package structure with protection bar
#13636SEMICONDUCTOR DEVICE
#13637SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND INTERPOSER SUBSTRATE
#13638Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips
#13639Semiconductor device
#13640Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
#13641Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same
#13642Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors
#13643Three-dimensional package
#13644CHIP ON LEAD WITH SMALL POWER PAD DESIGN
#13645SEMICONDUCTOR CHIP PACKAGE
#13646Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate
#13647Semiconductor device with output circuit arrangement
#13648LED package methods and systems
#13649Light emitting device package and manufacturing method thereof
#13650Light emitting diode package
#13651Embedding type solder point-free combination structure of LED beads with substrate or lamp body
#13652Light emitting device with a recess lead portion
#13653Thin film light emitting diode
#13654SYSTEM AND METHOD FOR SOLDER BONDING
#13655METHOD OF MANUFACTURING CAPACITOR-EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE
#13656Condenser for power module and power module
#13657DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE
#13658Transport method and transport apparatus
#13659Shield case and MEMS microphone having it
#13660Integrated array transmit/receive module
#13661METHOD FOR FABRICATING A SEMICONDUCTOR CHIP DEVICE HAVING THROUGH-SILICON-VIA (TSV)
#13662Structures and methods for improving solder bump connections in semiconductor devices
#13663METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#13664METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#13665SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
#13666Methods of manufacturing imaging device packages
#13667Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
#13668Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
#13669Method of manufacturing semiconductor device
#13670APPARATUS AND METHOD FOR TESTING A TRANSDUCER AND/OR ELECTRONIC CIRCUITRY ASSOCIATED WITH A TRANSDUCER
#13671Semiconductor package and methods of manufacturing the same
#13672ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME
#13673Lighting device, image pickup apparatus and portable terminal unit
#13674Light emitting diode module and back light assembly
#13675Light emitting diode lamp
#13676Laser apparatus
#13677Semiconductor package and plasma display device including the same
#13678Mounting structure of semiconductor package and plasma display device having the same
#13679Memory card and method for manufacturing the same
#13680CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES
#13681Power semiconductor module system
#13682Electric circuit device, electric circuit module, and power converter
#13683Low profile discrete electronic components and applications of same
#13684Platform integrated phased array transmit/receive module
#13685FUSE
#13686Integrated electronic device with transceiving antenna and magnetic interconnection
#13687Control circuit for a power semiconductor assembly and power semiconductor assembly
#13688Motor driving inverter circuit module, motor driving apparatus having the motor driving inverter circuit module, and inverter integrated circuit package
#13689Integrally formed light emitting diode light wire and uses thereof
#13690Illumination system
#13691Fluorescent substance, method for producing the same, and light-emitting device using the same
#13692PHOSPHOR, METHOD FOR PRODUCING SAME, PHOSPHOR-CONTAINING COMPOSITION, LIGHT-EMITTING DEVICE, IMAGE DISPLAY, AND ILLUMINATING DEVICE
#13693Light emitting device with phosphor wavelength conversion
#13694METHOD OF EVALUATING THE FLAME RETARDANCY OF SEALING RESIN AND TEST SAMPLE FOR EVALUATION OF FLAME RETARDANCY
#13695Through-hole electrode substrate and method of manufacturing the same
#13696Through-silicon via with air gap
#13697Semiconductor device
#13698Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips
#13699Semiconductor device and method of manufacturing the same
#13700Structures and methods for improving solder bump connections in semiconductor devices
#13701Semiconductor device
#13702Ball land structure having barrier pattern
#13703Bump-on-lead flip chip interconnection
#13704SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNECTION BASED ON METAL PILLARS
#13705Semiconductor device and method of confining conductive bump material during reflow with solder mask patch
#13706Structures and methods for improving solder bump connections in semiconductor devices
#13707Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip
#13708System-in-package packaging for minimizing bond wire contamination and yield loss
#13709SEMICONDUCTOR PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
#13710SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP
#13711Semiconductor device and semiconductor package including the same
#13712PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
#13713Manufacturing method for semiconductor devices and semiconductor device
#13714Micro-optical device packaging system
#13715Semiconductor device
#13716PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#13717Semiconductor device and method of manufacturing same
#13718Stacked semiconductor package
#13719METHOD OF MANUFACTURING THROUGH-SILICON-VIA AND THROUGH-SILICON-VIA STRUCTURE
#13720Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
#13721CHIP PACKAGE WITH STACKED INDUCTORS
#13722Semiconductor optical sensor element and method of producing the same
#13723True CSP power MOSFET based on bottom-source LDMOS
#13724Semiconductor device including normally-off type junction transistor and method of manufacturing the same
#13725Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
#13726SEMICONDUCTOR LIGHT EMITTING DEVICE
#13727Lighting device having light emitting element mounted in glass substrate
#13728LED package
#13729Light-emitting diode light bar and method for manufacturing the same
#13730FULL-COVER LIGHT-EMITTING DIODE LIGHT BAR AND METHOD FOR MANUFACTURING THE SAME
#13731Thin-film semiconductor component and component assembly
#13732Light emitting device
#13733LAMP AND METHOD OF PRODUCING A LAMP
#13734MANUFACTURING METHOD AND STRUCTURE OF LIGHT-EMITTING DIODE WITH MULTILAYERED OPTICAL LENS
#13735Chip level package of light-emitting diode
#13736Light emitting device package
#13737Semiconductor light-emitting device and light-emitting device package having the same
#13738Light emitting diode apparatus
#13739Light emitting diode
#13740RADIATION DETECTOR
#13741Antenna built-in module, card type information device, and methods for manufacturing them
#13742Coaxial plated through holes (PTH) for robust electrical performance
#13743Printed wiring board and method for manufacturing printed wiring board
#13744SUBSTRATE EMBEDDED WITH PASSIVE DEVICE
#13745METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#13746METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#13747THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE
#13748Attachment using magnetic particle based solder composites
#13749Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns
#13750Neutron detection structure and method of fabricating
#13751LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
#13752Surface-mount type optical semiconductor device and method for manufacturing the same
#13753Manufacturing method of light emitting diode
#13754Light emitting device and optical coupling module
#13755High-frequency circuit device, and communications apparatus comprising same
#13756Electric power converter
#13757HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE
#13758LED module and packaging method thereof
#13759Organic lighting device and lighting equipment
#13760LED device and LED lighting apparatus
#13761Electrical assembly
#13762Memory card and memory card manufacturing method
#13763Power device package having enhanced heat dissipation
#13764Low cost manufacturing of micro-channel heatsink
#13765Halosilicate phosphor and white light emitting device including the same
#13766MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS
#13767Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
#13768Grid array packages
#13769Semiconductor device
#13770Adhesive Tape, Semiconductor Package and Electronics
#13771SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#13772Semiconductor device
#13773Bonding pad structure and manufacturing method thereof
#13774Pad layout structure of semiconductor chip
#13775LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS
#13776Solder joints with enhanced electromigration resistance
#13777Solder limiting layer for integrated circuit die copper bumps
#13778Semiconductor device
#13779Semiconductor device
#13780Semiconductor chip used in flip chip process
#13781SEMICONDUCTOR DEVICE
#13782Semiconductor device and method of manufacturing the same
#13783Fabrication method of circuit board
#13784Face-to-face (F2F) hybrid structure for an integrated circuit
#13785Wafer structure with conductive bumps and fabrication method thereof
#13786Method of thinning a semiconductor substrate
#13787Molding compound including a carbon nano-tube dispersion
#13788Embedded Through Silicon Stack 3-D Die In A Package Substrate
#13789Stackable semiconductor device assemblies
#13790Chip-Stacked Package Structure
#13791Semiconductor package and manufacturing method of the same
#13792Integrated circuit packaging system substrates and method of manufacture thereof
#13793Microball assembly methods, and packages using maskless microball assemblies
#13794Semiconductor device and method of forming recessed conductive vias in saw streets
#13795Semiconductor apparatus
#13796Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package
#13797High-density multifunctional PoP-type multi-chip package structure
#13798Integrated circuit packaging system with package stacking and method of manufacture thereof
#13799SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#13800Power module having stacked flip-chip and method of fabricating the power module