Light emitting module, lighting device and display device

LED Source Adapted for Light Bulbs and the Like

LED unit and LED lighting lamp using the LED unit

Electronic Assembly and Backlight Module

NOISE SHIELDING CASE AND SHIELDING STRUCTURE FOR ELECTRONIC PART

Thin foil semiconductor package

Radio-frequency package

Integrated circuit package system

CIRCUIT BOARD INTERCONNECTION SYSTEM, CONNECTOR ASSEMBLY, CIRCUIT BOARD AND METHOD FOR MANUFACTURING A CIRCUIT BOARD

Solid-state imaging device and method of manufacturing the same

Circuit for detecting bonding defect in multi-bonding wire

WHITE LIGHT LIGHT-EMITTING DIODES

Semiconductor device having pairs of pads

Plastic Semiconductor Package Having Improved Control of Dimensions

Integrated circuit package system flip chip

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Layered chip package and method of manufacturing same

Integrated circuit package system having cavity

Electronic device having a chip stack

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device bonding with stress relief connection pads

SEMICONDUCTOR DIE SUPPORT IN AN OFFSET DIE STACK

Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer

Semiconductor device and method of fabricating semiconductor device

Electronic package with a thermal interposer and method of manufacturing the same

Semiconductor device

SYSTEM-IN-PACKAGE WITH THROUGH SUBSTRATE VIA HOLES

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Flip chip packages

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package-in-package system and method of manufacture thereof

Solder joint reliability in microelectronic packaging

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Lead frame, resin package, semiconductor device and resin package manufacturing method

Advanced quad flat non-leaded package structure and manufacturing method thereof

Semiconductor device

Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

3D integrated circuit device fabrication with precisely controllable substrate removal

Semiconductor device and electronic apparatus using the same

Camera Module and Manufacturing Method Thereof

Semiconductor light emitting device

Optical semiconductor device module with power supply through uneven contacts

Flip chip light emitting diode with epitaxial strengthening layer and manufacturing method thereof

Light emitting diode module

LIGHTING DEVICE

Light-radiating semiconductor component with a luminescence conversion element

Semiconductor light emitting device

Light-emitting device

Semiconductor light-emitting device

LED PACKAGE STRUCTURE

Sensing module

High refractive index materials and composites

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP

BOARD STRUCTURE AND ELECTRONIC DEVICE

Electrode structure and method for forming bump

INTERPOSER INTEGRATED WITH CAPACITORS AND METHOD FOR MANUFACTURING THE SAME

Printed circuit board and method of manufacturing the same

Laminated body, method of manufacturing substrate, substrate, and semiconductor device

Acceleration sensor chip package

Sensor device including two sensors embedded in a mold material

Method of manufacturing a wiring board

Process for through silicon via filing

Semiconductor device and manufacturing method thereof

Heat dissipating package structure and method for fabricating the same

Methods of forming semiconductor constructions and assemblies

Package-integrated thin film LED

Anisotropically compliant horns for ultrasonic vibratory solid-state bonding

High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device

Method for Manufacturing a Triple Wavelengths White Led

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Printed circuit board

Wireless telemetry electronic circuit board for high temperature environments

Electro-optical device and method for manufacturing the same

Low cost fingerprint sensor system

Light-emitting component and its manufacturing method

Fluorescent material, process for producing the same, and luminescent device

Seal apparatus and method of manufacturing the same

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Stacked semiconductor device and method

Corrosion control of stacked integrated circuits

Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis

Integrated circuit packaging system having a cavity

Semiconductor device

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Method of making a sidewall-protected metallic pillar on a semiconductor substrate

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Miniature electronic component for microwave applications

Bond pad for wafer and package for CMOS imager

Semiconductor package and manufacturing method thereof

Integrated circuit package with open substrate

Method of packaging and interconnection of integrated circuits

Integrated circuit package system for package stacking and manufacturing method thereof

Method for forming terminal of stacked package element and method for forming stacked package

Semiconductor package and method for manufacturing the same

Package on Package Design a Combination of Laminate and Tape Substrate with Back-to-Back Die Combination

Semiconductor structure with communication element

Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device

Integrated circuit package system

Metal leadframe package with secure feature

Leadless package with internally extended package leads

Semiconductor module with two cooling surfaces and method

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module

Semiconductor device and method of manufacturing the same

Light emitting device and production method of same

Two-phase cooling for light-emitting devices

Pixel interconnect insulators and methods thereof

Image Sensing Module

Universal PCB and smart card using the same

Ultrasonic bonding apparatus

Electronic component module and method for manufacturing the same

Tape wiring substrates and packages including the same

Camera module and method of manufacturing camera module

Controller for motor, and vehicle

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

Aluminum bump bonding for fine aluminum wire

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Methods of making compliant semiconductor chip packages

Method of manufacturing stacked semiconductor device

Method for fabricating package structure of stacked chips

Method for manufacturing a sensor device with a stress relief layer

Multilayer ceramic substrate, method for manufacturing the same, and method for reducing substrate warping

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

Camera module and method of manufacturing the same

Semiconductor device

Semiconductor memory apparatus for controlling pads and multi-chip package having the same

HEAT DISSIPATION MODULE FOR LIGHT EMITTING DIODE

Exposed interconnect for a package on package system

Camera module and method of manufacturing the same

Thin inductor, method of producing the thin inductor, and ultra small size power conversion apparatus using the thin inductor

Semiconductor device

LIGHT EMITTING UNIT AND METHOD OF MANUFACTURING THE LIGHT EMITTING UNIT

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE

Phosphor, method for production thereof, wavelength converter, light emitting device and luminaire

SIGNAL COUPLER

Bond pad structure and method for producing same

Method for forming a package-on-package structure

Through silicon via layout

Semiconductor device with an improved solder joint

Method for forming bumps in substrates with through vias

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Semiconductor chip and semiconductor device

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor assembly with component pads attached on die back side

Semiconductor package, core layer material, buildup layer material, and sealing resin composition

Flange package for a semiconductor device

IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGE STRUCTURE

Triple tier package on package system

Stacked Memory Module

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Lead frame package

Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

Electronic device and method of manufacturing same

Semiconductor device packages with electromagnetic interference shielding

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Assembling of Electronic Members on IC Chip

CAPACITOR FORMED IN INTERLEVEL DIELECTRIC LAYER

Destructor integrated circuit chip, interposer electronic device and methods

Through silicon via and method of fabricating same

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Semiconductor device and radio communication device

SMD diode holding structure and package thereof

Semiconductor device and method for making the same

Wafer level LED package structure and method for making the same

Light emitting diode package and method of manufacturing the same

Light-Emitting Diode Housing Comprising Fluoropolymer

Light-emitting module

LED REFLECTING PLATE AND LED DEVICE

Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system

Light emitting device with an insulating layer

Large area thin freestanding nitride layers and their use as circuit layers

Method of manufacturing photo interrupter including a positioning member with at least one positioning pin integrally provided with a connecting part, and photo interrupter manufactured thereby

Electrical connection of components

Mounting structure and electronic equipment

LED PACKAGE AND ATTACHMENT STRUCTURE OF MOLDED CIRCUIT COMPONENT

Mass air flow measurement device

Signal quality monitoring to defeat microchip exploitation

Memory module, memory system, and information device

NONVOLATILE MEMORY SYSTEM

Compact multilevel electrical integration of microsystems

Maskless Process for Solder Bump Production

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM

Integrated circuit package system with concave terminal

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

DICING DIE-BONDING FILM

Method and apparatus for forming planar alloy deposits on a substrate

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Microelectronic packages with small footprints and associated methods of manufacturing

Compact control device for a motor vehicle

Component-embedded module and manufacturing method thereof

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING HEAT RELEASE PATTERN

Sheet structure and method of manufacturing the same

Antennas integrated in semiconductor chips

Capacitance-based microchip exploitation detection

High Q transformer disposed at least partly in a non-semiconductor substrate

Resistance sensing for defeating microchip exploitation

Capacitance structures for defeating microchip tampering

Power conversion apparatus and electric vehicle

SHIELDED WIREBOND

Semiconductor device, through hole having expansion portion and thin insulating film

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

Semiconductor device mounted structure and semiconductor device mounted method

Metal cap with ringed projection to be welded to stem and ringed groove provided immediately inside of ringed projection and optical device having the same

Semiconductor device and manufacturing method thereof

Optical semiconductor apparatus

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

Semiconductor device and method of designing the same

Embedded inductor and method of producing thereof

Leadframe, semiconductor device, and method of manufacturing the same

Electronic device protected against electro static discharge

COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SHEET USED IN THE SAME, AND METHOD FOR MANUFACTURING COMPOSITE SEMICONDUCTOR DEVICE

Multi-layer package-on-package system

Integrated circuit package stacking system

Fan-in interposer on lead frame for an integrated circuit package on package system

RDL patterning with package on package system

Method for forming an etched recess package on package system

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

Image sensing device and packaging method thereof

Assembly for image sensing chip and assembling method thereof

Solid-state imaging device and method for manufacturing same

Sensor apparatus for detecting variations in a dynamic quantity while suppressing detection deviations that are caused by bending deformation of a sensor chip

LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD AND ITS MOUNTED SUBSTRATE

PACKAGING STRUCTURE AND METHOD FOR LIGHT-EMITTING DIODE

Semiconductor device and fabrication method thereof

Light emitting device

Optical Element, Radiation-Emitting Component and Method for Producing an Optical Element

Warm white light emitting apparatus and back light module comprising the same

LIGHT EMITTING DIODE CHIP PACKAGE

OPTICAL MODULE

Method for producing group III nitride semiconductor layer, group III nitride semiconductor light-emitting device, and lamp

IC chip package and image display device incorporating same

White light devices using non-polar or semipolar gallium containing materials and phosphors

Fluorescent substance and light-emitting device employing the same

METHOD FOR PRODUCING AN APPARATUS FOR WIRELESS COMMUNICATION OR FOR PRODUCING A PRELAMINATE FOR SUCH AN APPARATUS

IC CARD AND IC CARD SOCKET

Method and device for controlling the generation of ultrasonic wire bonds

Power conversion apparatus and electric vehicle

CIRCUIT CONNECTION STRUCTURE

Printed circuit boards

Flex-rigid wiring board and method for manufacturing the same

Electronic component built-in wiring board and method for radiating heat generated at the same

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

ASSEMBLY/DISASSEMBLY PLIERS

Copper bonding method

Fully integrated micro-strip VCO

Method of forming support structures for semiconductor devices

Systems and methods for reducing contact to gate shorts

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Method for manufacturing a semiconductor package

Method for manufacturing package on package with cavity

METHOD OF MAKING LIGHT EMITTING DIODES

Method of manufacturing a stacked semiconductor apparatus

Optical device package and optical semiconductor device using the same

Stacked memory module and system

PROTECTIVE PACKAGE FOR AN ELECTROMECHANICAL MICRO-SYSTEM COMPRISING A WIRING RELAY

RF shielding arrangement for semiconductor packages

INTEGRATED MICROWAVE CIRCUIT

Substrate structure

Capacitor, capacitor device, electronic component, filter device, communication apparatus, and method of manufacturing capacitor device

Monolithic ceramic electronic component and method for manufacturing the same

Galvanic isolator

Light emitting device assembly, surface light source device, liquid crystal display device assembly, and light output member

Semiconductor integrated circuit device

STRUCTURED SEMICONDUCTOR ELEMENT FOR REDUCING CHARGING EFFECTS

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

Method and apparatus for improvements in chip manufacture and design

IC chip package employing substrate with a device hole

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, MANUFACTURING METHODS THEREOF, AND STACK PACKAGE

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing a semiconductor device

EXTERNAL HEAT SINK FOR BARE-DIE FLIP CHIP PACKAGES

Semiconductor module and a method for producing an electronic circuit

Segmentation of a die stack for 3D packaging thermal management

High frequency ceramic package and fabrication method for the same

BALL GRID ARRAY PACKAGE

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof

Integrated circuit package system with leadframe substrate

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

Method of forming a molded array package device having an exposed tab and structure

DICING/DIE BONDING FILM

Semiconductor system-in-package and method for making the same

ISOLATED STACKED DIE SEMICONDUCTOR PACKAGES

Multi lead frame power package

Integrated circuit package with etched leadframe for package-on-package interconnects