Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

Semiconductor package and methods of fabricating the same

Hybrid carrier and a method for making the same

Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same

MOLDED PACKAGE ASSEMBLY

Folded leadframe multiple die package

Semiconductor device package and method of making a semiconductor device package

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

MEMS Packaging Including Integrated Circuit Dies

Semiconductor Device Having Element Portion and Method of Producing the Same

Semiconductor device having antenna over thin film integrated circuit

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

GROUP-III NITRIDE COMPOUND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF, GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREOF, AND LAMP

LIGHT EMITTING ELEMENT, PRODUCTION METHOD THEREOF, BACKLIGHT UNIT HAVING THE LIGHT EMITTING ELEMENT, AND PRODUCTION METHOD THEREOF

Semiconductor light emitting device

Light emitting diode and method for manufacturing the same

Light emitting diode having grooves to modulate light emission thereof

Optoelectronic device submount

Light-emitting diode arrangement comprising a color-converting material

Semiconductor light emitting devices with high color rendering

Gallium nitride material devices including diamond regions and methods associated with the same

Wire bonding method

DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MODULE

Sensor ,Sensor Component and Method for Producing a Sensor

SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS

Bondwire design

Semiconductor device

Aligned nanotube bearing composite material

Semiconductor device and manufacturing method thereof

Microelectronic devices and methods for forming interconnects in microelectronic devices

Method for singulating semiconductor devices

METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Apparatus for improved power distribution in wirebond semiconductor packages

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

Multi-mode I/O circuitry supporting low interference signaling schemes for high speed digital interfaces

Light emitting device and illuminating device

Light source module of light emitting diode

Semiconductor device

ELECTRONIC ELEMENT PACKAGING

Solid-state image capturing apparatus, mounting method of solid-state image capturing apparatus, manufacturing method of solid-state image capturing apparatus, and electronic information device

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

High temperature operating package and circuit design

LUMINESCENT MATERIAL

FLUORESCENCE EMITTING DEVICE

SEMICONDUCTOR DEVICE

FLIP CHIP QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Clustered stacked vias for reliable electronic substrates

ANGLED FLYING LEAD WIRE BONDING PROCESS

Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package

Integrated circuit package system with wafer scale heat slug

Tape wiring substrate and tape package using the same

Multiphase synchronous buck converter

Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same

Printed circuit board, semiconductor package, card apparatus, and system

Manufacturing process and structure for embedded semiconductor device

Electronic Circuit Package

Method of manufacturing semiconductor device

Semiconductor package with stacked dice for a buck converter

Semiconductor device and manufacturing method of the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Ultra-Thin Semiconductor Package

Semiconductor device

Method of manufacturing electronic device on leadframe

Manufacturing process of semiconductor device and semiconductor device

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Silicone resin composition

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method

Light emitting diode package and manufacturing method thereof

Light emitting diode package

Light emitting diode with higher illumination efficiency

Light emitting diode package

Light-emitting diode light source

Semiconductor device

Interconnection element for electric circuits

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

Mounting substrate

Bonding wire for semiconductor device

Method for manufacturing electronic device

Power semiconductor devices having integrated inductor

Dual metal stud bumping for flip chip applications

Manufacturing method of semiconductor device

IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE

Method for fabricating package structures for optoelectronic devices

Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby

Method for manufacturing an LED chip package structure

Method of making phosphor containing glass plate, method of making light emitting device

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

Electrically conductive adhesive

Manufacturing method of optical waveguide device, optical waveguide device obtained thereby, and optical waveguide connecting structure used for the same

Semiconductor device

Semiconductor light-emitting device

Apparatus and method for thermal dissipation in a light

Apparatus and methods for thermal management of light emitting diodes

Integrated circuit and assembly therewith

Liquid crystal display device

Solid-state imaging device, method of fabricating solid-state imaging device, and camera

DROPLET DISCHARGE DEVICE

Semiconductor package with an antenna and manufacture method thereof

Semiconductor power device with bias circuit

Light-emitting device and lighting apparatus incorporating same

Large area LED array and method for its manufacture

Lighting device and method of making

Liquid epoxy resin composition and flip chip semiconductor device

Module with stacked semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

Flip chip interconnect solder mask

INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD

Resin-sealed semiconductor device

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Semiconductor package apparatus having redistribution layer

Semiconductor device for fingerprint recognition

Semiconductor package having insulated metal substrate and method of fabricating the same

Electromagnetic shilding structure and manufacture method for multi-chip package module

Method of forming a semiconductor package and structure thereof

High performance system-on-chip inductor using post passivation process

Optical semiconductor device

Light emitting diode device

Package structure module with high density electrical connections and method for packaging the same

Process for producing semiconductor device and apparatus therefor

Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus

Wiring board and method of manufacturing the same

HEAT RADIATING PLATE FOR SEMICONDUCTOR PACKAGE AND PLATING METHOD THEREOF

Alignment verification for C4NP solder transfer

INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH

Method for fabricating a flip chip system in package

Method for processing a base that includes connecting a first base to a second base with an insulating film

MULTI-LAYER SUBSTRATE AND MANUFACTURE METHOD THEREOF

Stack package and method for manufacturing the same

Image sensing devices and methods for fabricating the same

Semiconductor structure with solder bumps

PACKAGE FOR MEMS MICROPHONE

Nitride semiconductor laser chip, nitride semiconductor laser device, and manufacturing method of nitride semiconductor laser chip

Nitride semiconductor laser device and method of manufacturing the same

Apparatus for housing a light assembly

Light emitting device

Light emitting device and LCD backlight using the same

ESD protection structure

Printed circuit board and semiconductor package including the same

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

SEMICONDUCTOR DEVICE PACKAGE

Leadless package

Integrated circuit package and fabricating method thereof

Local area semiconductor cooling system

Power semiconductor device

Integrated circuit incorporating wire bond inductance

Stacked semiconductor package assembly having hollowed substrate

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

Flex clip connector for semiconductor device

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Encapsulated imager packaging

Bi-directional, reverse blocking battery switch

Semiconductor device, DC/DC converter and power supply

Semiconductor light-emitting device, method of manufacturing semiconductor light-emitting device, and lamp

Side view type LED package

Light emitting device package

Light-emitting device with magnetic field

Light emitting device with magnetic field

Light emitting device with magnetic field

Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating

Light emitting device

Curable organopolysiloxane composition and semiconductor device

Wiring board for semiconductor device

Multileveled printed circuit board unit including substrate interposed between stacked bumps

Printed circuit board and component package having the same

METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE

Micropad formation for a semiconductor

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Method of manufacturing a semiconductor device

Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion

Method for forming a die-attach layer during semiconductor packaging processes

Method for processing a base that includes connecting a first base to a second base

Bonding pad structure and semiconductor device including the bonding pad structure

Microphone package, lead frame, mold substrate, and mounting structure therefor

High efficiency low cost safety light emitting diode illumination device

LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING SAME

Interposer and method for manufacturing interposer

Circuit board and manufacturing method thereof

Package substrate with built-in capacitor and manufacturing method thereof

Method of making halogen-free circuitized substrate with reduced thermal expansion

Electronic element wafer module; electronic element module; sensor wafer module; sensor module; lens array plate; manufacturing method for the sensor module; and electronic information device

Image pickup apparatus and semiconductor circuit element

Insulating target material, method of manufacturing insulating target material, conductive complex oxide film, and device

Electrical module with specified ground-side connection of filter circuit shunt arms

High power integrated RF amplifier

Radiation-emitting device comprising a plurality of radiation-emitting components and illumination device

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging

Combination substrate

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and the method of manufacturing the same

Semiconductor device

SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES

Semiconductor device including electrically conductive bump and method of manufacturing the same

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Semiconductor device, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Integrated circuit package system with heat slug

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD

Semiconductor Device

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Method and manufacture of silicon based package and devices manufactured thereby

Semiconductor device and programming method

Module with Flat Construction and Method for Placing Components

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Semiconductor package and semiconductor device

Silicon heat spreader mounted in-plane with a heat source and method therefor

Ultra thin image sensor package structure and method for fabrication

Die package including substrate with molded device

Semiconductor die packages having overlapping dice, system using the same, and methods of making the same

Semiconductor package with an embedded printed circuit board and stacked die

Multi-chip package

Flexible contactless wire bonding structure and methodology for semiconductor device

Radio frequency over-molded leadframe package

ESD protection semiconductor device having an insulated-gate field-effect transistor

Method of manufacturing a semiconductor light-emitting device

LIGHT EMITTING DEVICES WITH HIGH EFFICIENCY PHOSPOR STRUCTURES

Wavelength-converting converter material, light-emitting optical component, and method for the production thereof

White light emitting device

Semiconducting sheet

Package with overlapping devices

Semiconductor light-emitting device, illuminator and method of manufacturing semiconductor light-emitting device

IC MODULE, IC INLET, AND IC MOUNTED BODY

Circuit board ready to slot

White heat-curable silicone resin composition, optoelectronic part case, and molding method

Method of manufacturing semiconductor device

Adhesive composition and adhesive sheet

Forming a 3-D semiconductor die structure with an intermetallic formation

Electronic apparatus manufacturing method

METHOD FOR MANUFACTURING A FLIP CHIP PACKAGE

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Optimized circuit design layout for high performance ball grid array packages

Package for a semiconductor light emitting device

Pseudo-translucent integrated circuit package

CIRCUIT DEVICE HAVING A FREE WHEELING DIODE, CIRCUIT DEVICE AND POWER CONVERTER USING DIODES

Surface light emitting device and polarization light source

Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate

Integrated circuit device and method of producing

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Thermally and electrically conductive interconnect structures

Semiconductor memory card

Compact inductive power electronics package

Reading configuration data from internal storage node of configuration storage circuit

Light emitting diode lamp and light emitting device

Side surface light emitting device

LIGHT SOURCE MODULE WITH HIGH HEAT-DISSIPATION EFFICIENCY

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE HAVING A REDUCED THICKNESS, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Method for cutting and molding in small windows to fabricate semiconductor packages

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

3-D semiconductor die structure with containing feature and method

Semiconductor package including flip chip controller at bottom of die stack

Mountable integrated circuit package system with intra-stack encapsulation

Integrated circuit package with improved connections

ELECTRICAL BONDING PAD

SEMICONDUCTOR PACKAGE

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

Method of manufacturing semiconductor device including mounting and dicing chips

Semiconductor device and method of manufacturing the same

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor device and method of manufacturing the same

Method and system for providing an aligned semiconductor assembly

Multi-layer stacked wafer level semiconductor package module

SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS

Power semiconductor module

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

SEMICONDUCTOR CHIP PACKAGE

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

Lead frame for semiconductor package

WAFER-LEVEL STACK PACKAGE

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

Stack combination of plural chip package units

Integrated circuit package system with interposer

Mountable integrated circuit package system with stacking interposer

Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate

SENSOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor memory device

Etched surface mount islands in a leadframe package

LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES

System and apparatus for wafer level integration of components

Leadless package system having external contacts

Integrated circuit package system with lead locking structure

Integrated circuit package system with shielding

Leadframe design for QFN package with top terminal leads

Chipset package structure