Semiconductor device and its manufacture

Semiconductor device and method for fabricating semiconductor device

EMI shielding for imager devices

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Encapsulated optoelectronic device

HIGH POWER LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

Light emitting diodes including two reflector layers

White LED, backlight using the same, and liquid crystal display device

Semiconductor chip

Multinary oxynitride phosphor, and light emitting device, image display, illuminating device and phosphor-containing composition using the same, and multinary oxynitride

Microball attachment using self-assembly for substrate bumping

Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure

Circuit board and process for producing the same

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Angular velocity sensor

Low profile wire bonded USB device

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of forming a wafer level package

Optical die-down quad flat non-leaded package

Mold for forming molding member and method of manufacturing LED package using the same

LED FABRICATION METHOD EMPLOYING A WATER WASHING PROCESS

Electronic device and method of manufacturing thereof

Method for manufacturing metal chips by plasma from a layer comprising several elements

Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods

Composition of a solder, and method of manufacturing a solder connection

Nanoscale metal paste for interconnect and method of use

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Optical transmission module

Two-beam semiconductor laser device

Semiconductor device, method of manufacturing the same, and production equipment of the same

Data storage and stackable configurations

Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

Two-beam semiconductor laser apparatus

Chip carrier and fabrication method

Semiconductor device

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Compact power semiconductor package and method with stacked inductor and integrated circuit die

Surface-mount type crystal oscillator

Formation of a hybrid integrated circuit device

Connection unit, a board for mounting a device under test, a probe card and a device interfacing part

LED lighting lamp

Heat pipe device for cooling a voltage regulator of a rotating electric machine, such as an alternator or an alternator-starter

Flip-chip package and method of forming thereof

Semiconductor element, semiconductor device, and fabrication method thereof

Reconstituted wafer level stacking

Semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor device employing wafer level chip size package technology

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

DOWNHOLE TOOL

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Managed Memory Component

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Semiconductor package with leads on a chip having multi-row of bonding pads

Package with multiple dies

Methods for forming through wafer interconnects and structures resulting therefrom

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

Methods for forming semiconductor light emitting devices and submounts

LED INSERT MODULE AND MULTI-LAYER LENS

LIGHT-EMITTING DIODE

HOUSING FOR A LUMINESCENCE DIODE COMPONENT

Light source device, light source module, and method of making the light source device

Light chain

Infrared proximity sensor package with reduced crosstalk

Integrated circuits with phase change devices

Optical navigator sensor and optical navigator apparatus using the same

Semiconductor device and automotive AC generator

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Low cost high frequency device package and methods

Transfer Coil Architecture

Ceramic emitter substrate

Terminal pad structures and methods of fabricating same

Integrated circuit package system with package integration

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of forming integrated passive device module

ROBUST DIE BONDING PROCESS FOR LED DIES

Multi-die wafer level packaging

Thermal mechanical flip chip die bonding

Semiconductor device fabricating method and fabricating apparatus

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Light emitting diode package with diffuser and method of manufacturing the same

ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF

Clock reproducing and timing method in a system having a plurality of devices

Multilayer board and light-emitting module having the same

Semiconductor device and optical pickup device

Semiconductor device and power supply device using the same

White light-emitting device and manufacturing method thereof, and backlight and liquid crystal display device using the same

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

Method of manufacturing a printed wiring board

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Semiconductor device

Microwave chip supporting structure

Impedance compensated electrostatic discharge circuit for protection of high-speed interfaces and method of using the same

IMAGING MODULE PACKAGE

Separate testing of continuity between an internal terminal in each chip and an external terminal in a stacked semiconductor device

Semiconductor device

Circuit board having bypass pad

Sensor module and method for manufacturing a sensor module

Fluorescent substance, method for manufacturing the same and image display device

Warm-white semiconductor and its phosphor with red-spectrum garent structure

White light emitting device and producing method thereof

White light emitting diode and method of manufacturing the same

Phosphor distribution in LED lamps using centrifugal force

LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING SAME

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP

Semiconductor package

Semiconductor device

Bonding pad for anti-peeling property and method for fabricating the same

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Method of forming stacked die package

Wiring substrate and electronic component mounting structure

Semiconductor device with resin mold

Quad flat no-lead (QFN) packages

Controller chip mounted on a memory chip with re-wiring lines

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit package system with interconnect lock

Integrated circuit packaging system with interposer

Coupling wire to semiconductor region

Integrated circuit package system with package integration

Mountable integrated circuit package system with mountable integrated circuit die

Semiconductor device and manufacturing method of the same

Semiconductor device

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Electronic device

Semiconductor device

Integrated circuit package system with offset stacking

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

Method of opening pad in semiconductor device

ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY

Electronic device including an inductor

Semiconductor apparatus

FABRICATING METHODS OF PHOTOELECTRIC DEVICES AND PACKAGE STRUCTURES THEREOF

Methods of packaging imager devices and optics modules, and resulting assemblies

Light emitting diode

LIGHT REFLECTING MATERIAL, PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION, LIGHT EMITTING DEVICE AND PROCESS FOR PRODUCING PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMODATION

Light-emitting diode and light-emitting diode lamp

Multi-wavelength white light-emitting structure

Array type light-emitting device with high color rendering index

LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same

Semiconductor device and manufacturing method thereof

Semiconductor component

Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

Disguising test pads in a semiconductor package

Photo Detector and Photo Detection Apparatus Provided with Photo Detector

Solder pastes comprising nonresinous fluxes

WIRE BONDING METHOD

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Semiconductor device and touch sensor device

Optoisolator leadframe assembly

Method of manufacturing wiring board, wiring board, and semiconductor device

METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Method of fabricating semiconductor device having three-dimensional stacked structure

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Manufacturing method of contact structure

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Micromirror manufacturing method

Combined semiconductor apparatus with thin semiconductor films

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY

Laminated ceramic package

3D chip arrangement including memory manager

Light emitting device

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Solid-state image pick-up device, method for producing the same, and electronics device with the same

Using coulomb forces to form 3-D reconfigurable antenna structures

Assembly, chip and method of operating

Configuration context switcher with a clocked storage element

Configuration context switcher with a latch

SOLID STATE ILLUMINATION DEVICE

Light emitting device and illumination device

Wire bonding personalization and discrete component attachment on wirebond pads

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor Device

Semiconductor device

Flip chip interconnection with double post

Semiconductor device and method of manufacturing the same

Semiconductor packages and electronic products employing the same

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Fabrication method of semiconductor package

Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages

Stacked-type chip package structure and fabrication method thereof

Semiconductor package and method of forming similar structure for top and bottom bonding pads

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Semiconductor device

Flip-chip leadframe semiconductor package

Lead frame and semiconductor device provided with lead frame

Semiconductor device

Electronic device

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Secure connector grid array package

MICROELECTRONIC IMAGING UNITS HAVING AN INFRARED-ABSORBING LAYER AND ASSOCIATED SYSTEMS AND METHODS

Light-emitting diode

THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE

Semiconductor device and manufacturing method thereof, and camera module including the same

Solid state illumination device

Component attach methods and related device structures

LED device and method for manufacturing the same

Method of fabricating light emitting diode package with surface treated resin encapsulant and the package fabricated by the method

Jacketed LED assemblies and light strings containing same

LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING THE LIGHT-EMITTING DEVICE AND LIQUID CRYSTAL DISPLAY HAVING THE LIGHT-EMITTING DEVICE

Package for light emitting device having a lens spaced from a light emitting device module

Light-emitting diode package

Light-emitting diode

Method for soldering two elements together using a solder material

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Surface mount device

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Sensor packaging method for a human contact interface

Method of fabricating a piezoelectric vibrator

Leaded stacked packages having elevated die paddle

Method to build a wirebond probe card in a many at a time fashion

MICROELECTROMECHANICAL SYSTEM

Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed

Lead frame, method of making the same and light receiving/emitting device

Light source apparatus and display apparatus and white resist layer

Portable storage device

Circuit component, electrode connection structure and display device including the same

LCD Driver IC and Method for Manufacturing the Same

Touch screen system with light reflection

Antenna Device and Radio-Communication System Using the Same

System-in-package

Integrated circuit including sensor having injection molded magnetic material

Light-emitting module, and display unit and lighting unit using the same

Light-emitting device, white light-emitting device, illuminator, and image display

Relay switch including an energy detection circuit

Wafer level package integration and method

Wafer level die integration and method

Multi-chip stack structure and method for fabricating the same

Flexible column die interconnects and structures including same

Metal foil interconnection of electrical devices

Flip chip package and method for manufacturing the same

Chip package

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Semiconductor device and method of making integrated passive devices

Cap member and semiconductor device employing same

COMBINATION SUBSTRATE

Semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT

Integrated circuit package-on-package system with anti-mold flash feature

SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME

Electronic device having profiled elements extending from planar surfaces

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Semiconductor module with switching components and driver electronics

Warpage resistant semiconductor package and method for manufacturing the same

Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Packaged semiconductor device and method of manufacturing the packaged semiconductor device

Integrated sensor and circuitry

Semiconductor device with less power supply noise

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

LIGHT EMITTING DEVICE HAVING FUNCTION OF HEAT-DISSIPATION AND MANUFACTURING PROCESS FOR SUCH DEVICE

Led structure for flip-chip package and method thereof

LIGHT EMITTING UNIT

PACKAGE INCLUDING ORIENTED DEVICES

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice

Component for detecting especially infrared electromagnetic radiation

Vacuum package and manufacturing process thereof

IMAGING DEVICE

METHOD AND DEVICE FOR WIRE BONDING

Methods for manufacturing semiconductor devices

Multi-die processor

Method for manufacturing semiconductor device

Isolating chip-to-chip contact

Method of manufacturing a wiring substrate and semiconductor device

Method and apparatus for manufacturing semiconductor module

ASSEMBLING OF DOUBLED-SIDE STACKING PULRAL CHIPS

Manufacturing method for electronic devices

Method for manufacturing a microelectromechanical component, and a microelectromechanical component

Chip packaging process including simpification and mergence of burn-in test and high temperature test

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

Optical module

LED lamp

Circuit device and method of manufacturing the same

Electronic component with wire bonds in low modulus fill encapsulant

Integrated circuit package having reversible ESD protection

Alloy powder for material of inorganic functional material precursor and phosphor

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME