Semiconductor package having increased resistance to electrostatic discharge

Power semiconductor module method

LED fabrication via ion implant isolation

Optical reception and transmission module

Sliding type thin fingerprint sensor package

Optical semiconductor element and optical semiconductor device

Semiconductor laser device

Vertically displaced stack of multi-mode single emitter laser diodes

SILICON-CONTROLLED RECTIFIER WITH A HEAT-DISSIPATING STRUCTURE

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Circuit device and method of manufacturing the same

Warpage preventing substrates

Light source module

Power recovery circuit based on partial standing waves

Power Integrated Circuit with Bond-Wire Current Sense

Red phosphor, method for manufacturing the same and light emitting diode for using the same

Rectifier for automotive alternator

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME

Flip chip connection structure having powder-like conductive substance and method of producing the same

Semiconductor package and method for fabricating the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE

SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE SAME, BASE SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Flip chip package structure and carrier thereof

Device including a housing for a semiconductor chip including leads extending into the housing

Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof

Semiconductor device and method of fabricating semiconductor device

Power semiconductor module

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Packaged microchip with spacer for mitigating electrical leakage between components

Integrated circuit package

Electronic device

Method for connecting a die attach pad to a lead frame and product thereof

Integrated circuit package with etched leadframe for package-on-package interconnects

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Through-silicon vias and methods for forming the same

Sensor package

Electro-acoustic sensing device

Semiconductor light-emitting device and method of fabricating the same

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

White light emitting element and white light source

Package for a light emitting element

Electronic device

Pressure sensor having insect entering restriction element

Method for producing synthetic resin mold package, alcohol concentration sensor and apparatus for measuring alcohol concentration

Inductor formed in an integrated circuit

Method for bonding a wire conductor laid on a substrate

Methods for forming a through via

Method of forming metallic bump and seal for semiconductor device

Method of forming metallic bump on I/O pad

Integrated circuit package including wire bonds

Method of forming premolded lead frame

Low cost hermetically sealed package

Method for Singulating a Group of Semiconductor Packages that Contain a Plastic Molded Body

Method for making a heat dissipating device for LED installation

High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin

Optical data transceivers

VCSEL DEVICE AND METHOD FOR FABRICATING VCSEL DEVICE

Light-emitting device, backlight using same, and liquid crystal display

Electronic chip embedded circuit board and method of manufacturing the same

Electronic component module

ESD protection substrate and integrated circuit utilizing the same

Optical device for reducing disturbance light and manufacturing method thereof

Backlight device and liquid crystal display device

Layout schemes and apparatus for high performance DC-DC output stage

Fluorescent material and light-emitting device

Luminescent material and light-emitting device

Method of manufacturing a surface acoustic wave device

Semiconductor package and method for fabricating the same

SOI on package hypersensitive sensor

Integrated circuit underfill package system

Semiconductor device and method of manufacturing the same

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Semiconductor device and manufacturing method of the same

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE HAVING THE SAME MOUNTED THEREON

Semiconductor device and method of manufacturing the same

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Bump I/O contact for semiconductor device

Thermally enhanced wafer level package

Connecting structure for connecting at least one semiconductor component to a power semiconductor module

High speed electrical interconnects and method of manufacturing thereof

Semiconductor device

SEMICONDUCTOR PACKAGE HAVING A WARPAGE RESISTANT SUBSTRATE

Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same

Semiconductor device

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Semiconductor package and substrate for the same

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Semiconductor apparatus with decoupling capacitor

Solid state imaging device and method for manufacturing same, and solid state imaging module

Imaging module package

SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE PACKAGE

Light-emitting device

WIRE BOND LED LIGHTING UNIT

Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof

Combination of LED and heat dissipation device

Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus

Photo reflector including a light-emitting element and a light-receiving element

Microcircuit card attached to an adapter base, card base and manufacturing method

Wiring board, semiconductor apparatus and method of manufacturing them

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Electronic device, electronic module, and methods for manufacturing the same

Multilayer pillar for reduced stress interconnect and method of making same

Reinforced radio frequency identification device support and its manufacturing method

Single shot molding method for COB USB/EUSB devices with contact pad ribs

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for producing a semiconductor device using a solder alloy

Method for fabricating heat dissipating semiconductor package

Roll-on encapsulation method for semiconductor packages

Method of manufacturing semiconductor device

Die offset die to bonding

Process for packaging electronic devices

Optical module

High power LED module

LED array grid, method and device for manufacturing said grid and LED component for use in the same

Stack structure of circuit boards embedded with semiconductor chips

Circuit device

Semiconductor integrated circuit device and regulator using it

LIGHT-EMITTING CHIP AND METHOD OF MANUFACTURING THE SAME

Fluorophor and method for production thereof and illuminator

Method of Sealing and Molding an Optical Device With Resin

Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

Method of fabricating a stacked type chip package structure

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Wafer structure with a buffer layer

Bond pad design for fine pitch wire bonding

Semiconductor device

Semiconductor package having marking layer

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

Semiconductor package having restraining ring surfaces against soldering crack

Stackable semiconductor package having plural pillars per pad

Stable gold bump solder connections

Semiconductor Device Package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Memory Packages Having Stair Step Interconnection Layers

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

Partitioned Integrated Circuit Package with Central Clock Driver

I/O pad structures for integrated circuit devices

Stacked-type chip package structure and method of fabricating the same

Semiconductor device having a flexible printed circuit

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

Wireless semiconductor package for efficient heat dissipation

STACKABLE INTEGRATED CIRCUIT PACKAGE

Semiconductor device

Semiconductor device having grooved leads to confine solder wicking

Dual capillary IC wirebonding

LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME

Solid state light emitting device

Multilayer printed wiring board

Multilayer printed wiring board

Stacked semiconductor device and fabricating method thereof

Method for producing an electric component-mounted substrate

Proximity communication package for processor, cache and memory

Forming method of electrode and manufacturing method of semiconductor device

Manufacturing process of leadframe-based BGA packages

Wafer packaging method

Flip chip package with advanced electrical and thermal properties for high current designs

Method for thin semiconductor packages

SEMICONDUCTOR LASER DIODE WITH REDUCED PARASITIC CAPACITANCE

Semiconductor device

LED luminaire

Shielding Apparatus and Manufacturing Method Thereof

PLASMA DISPLAY APPARATUS

Circuit device and method of manufacturing the same

Circuit device

OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF

Interface module

Circuit module

Carrier body for components or circuits

Circuit device, circuit module, and outdoor unit

Semiconductor device

Tunable semiconductor laser device, manufacturing method therefor, and gas detector using therewith

Reduced inductance interconnect for enhanced microwave and millimeter-wave systems

Integrated circuit package including miniature antenna

Yellow emitting Ce3+ doped calcium silicate phosphor and white light emitting diodes including Ce3+ doped calcium silicate phosphor

Fluorophor and method for production thereof and illuminator

Fluorescent material and light-emitting device

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

Audio power amplifier package

Die warpage control

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

Semiconductor device and semiconductor memory device

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Multi-host interface controller with USB PHY/analog functions integrated in a single package

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Power semiconductor arrangement

Flash memory device and fabricating method thereof

Semiconductor device

Semiconductor component comprising copper metallizations

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device

Ball grid array substrate package and solder pad

Method of forming solder bumps on substrates

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

Direct device attachment on dual-mode wirebond die

Integrated circuit package system with mold lock subassembly

Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

Power semiconductor module

Semiconductor device and methods of manufacturing semiconductor devices

STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Semiconductor package and method of fabricating the same

Integrated circuit package system with multiple die

Semiconductor device

Integrated circuit packaging system with base structure device

Integrated circuit package system with leadframe array

Electronic components on trenched substrates and method of forming same

METHOD AND APPARATUS FOR PACKAGE-TO-BOARD IMPEDANCE MATCHING FOR HIGH SPEED INTEGRATED CIRCUITS

SOLID-STATE IMAGE SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Glass cap molding package, manufacturing method thereof and camera module

Wafer-level image sensor module, method of manufacturing the same, and camera module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Light emitting diode package with large viewing angle

Light emitting diode device

Island submount and a method thereof

Method for producing a matrix of individual electronic components and matrix produced thereby

Wafer-Shaped Measuring Apparatus and Method for Manufacturing the Same

Solder ball loading method and solder ball loading unit

Light emitting diode vacuum coating by magnetized mask

AUTOMOTIVE ELECTRIC/ELECTRONIC PACKAGE

Heat resistant substrate incorporated circuit wiring board

Semiconductor device including wiring excellent in impedance matching, and method for designing the same

Electronic device

Chemical removal of oxide layer from chip pads

Method of manufacturing substrate

Manufacturing method of solder ball disposing surface structure of package substrate

Method of applying encapsulant to wire bonds

Wire bond encapsulant application control

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Warpage control using a package carrier assembly

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

Method of adhering wire bond loops to reduce loop height

Method of wire bond encapsulation profiling

BI-DIRECTIONAL OPTICAL MODULE COMMUNICATING WITH SINGLE FIBER

Nitride semiconductor laser device

LIGHT EMITTING DIODE MODULE AND METHOD FOR THE MANUFACTURING OF SUCH AN LED MODULE

Method for forming BGA package with increased standoff height

Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure

Integrated circuit support for low profile wire bond

High frequency module

MULTI-BAND TUNABLE RESONANT CIRCUIT

Multi-chip package for reducing parasitic load of pin

Method of testing using a temporary chip attach carrier

Redundance control of temperature compensation for a LED printhead

GREEN LIGHT EMITTING PHOSPHOR AND LIGHT EMITTING DEVICE USING THE SAME

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Integrated circuit package system with multiple device units

Solder bump with inner core pillar in semiconductor package

Stacked dual-die packages, methods of making, and systems incorporating said packages

Integrated circuit packaging system with interposer

Stacked semiconductor chips

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device and method of forming interconnect structure in non-active area of wafer

METHODS FOR ATTACHING A FLIP CHIP INTEGRATED CIRCUIT ASSEMBLY TO A SUBSTRATE

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Microelectronic package and method of cooling an interconnect feature in same

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Semiconductor device, structure of mounting the same, and method of removing foreign matter from the same

Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card

Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package

Semiconductor device and manufacturing method of the same

Method of manufacturing integrated circuit package system with warp-free chip

Integrated circuit package system with under paddle leadfingers

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device and method of manufacturing the same

Semiconductor device having multiple substrates

SEMICONDUCTOR APPARATUS

Semiconductor device

Field-effect transistor, semiconductor chip and semiconductor device

Light emitting diode with auxiliary electric component

Solid-state optical device

Light emitting device

Package structure of photoelectronic device and fabricating method thereof

Illuminator and method for producing such illuminator

Semiconductor device

Photodetector with embedded infrared filter

Method for forming interconnects

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Wire bonding system utilizing multiple positioning tables

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Three dimensional packaging optimized for high frequency circuitry

Light emitting module and method for manufacturing the same

Semiconductor integrated device and apparatus for designing the same