Semiconductor integrated device and apparatus for designing the same

Light emitting device having silicon-containing composition and method of making same

Planar array contact memory cards

Semiconductor device having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode

Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Thermo-compression bonded electrical interconnect structure and method

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Wafer level package with cavities for active devices

Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method

Method of manufacturing a semiconductor device

Method for fabricating multi-chip stacked package

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Method of manufacturing semiconductor device

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Thermally enhanced package structure

Electronic component soldering structure and electronic component soldering method

BIDIRECTIONAL OPTICAL TRANSMISSION DEVICE

Light Emitting Unit and Illumination Device and Image Scanner Using Such Light Emitting Unit

Carrier assembly for an integrated circuit

Semiconductor chip package and printed circuit board

Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

High voltage interlock system and control strategy

High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Method and apparatus for interrogating an electronic component

Cancelling low frequency errors in MEMS systems

Nitride phosphor and production process thereof, and light emitting device

Semiconductor device, and manufacturing method of semiconductor device

Bonding method of semiconductor and laminated structure fabricated thereby

Integrated circuit package system with package encapsulation having recess

Connecting and bonding adjacent layers with nanostructures

Thermo-compression bonded electrical interconnect structure and method

Semiconductor mounting bonding wire

Integrated circuit, circuit system, and method of manufacturing

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method for manufacturing the same

Structure and method for fabricating flip chip devices

Structurally-enhanced integrated circuit package and method of manufacture

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic assemblies providing active side heat pumping

Semiconductor device, electronic component module, and method for manufacturing semiconductor device

Semiconductor device with double-sided electrode structure and its manufacturing method

Integrated circuit package system with delamination prevention structure

Integrated circuit package system with multi-chip module

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

Planar array contact memory cards

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

SEMICONDUCTOR DEVICE

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with external interconnects at high density

Integrated circuit package system with leads separated from a die paddle

Integrated circuit package-in-package system with leads

Thermal enhanced upper and dual heat sink exposed molded leadless package

Multi-Chip Stacked Package Structure

Molded semiconductor device including IC-chip covered with conductor member

High-Heat-Resistant Semiconductor Device

Image sensor package

SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY

PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE

Light emitting diode device

Light emitting diode package with a phosphor substrate

Phosphor and light-emitting device using same

LED surface-mount device and LED display incorporating such device

CHIP TYPE SEMICONDUCTOR LIGHT EMITTING DEVICE

Luminescent material

Spool wound with a gold alloy wire used for a bonding process

Apparatus and method for arranging magnetic solder balls

Electronic component package

Multilayer substrate with interconnection vias and method of manufacturing the same

CONDUCTIVE PASTE, CIRCUIT BOARD, CIRCUIT ARTICLE AND METHOD FOR MANUFACTURING SUCH CIRCUIT ARTICLE

Structural component comprising boron nitride agglomerated powder

Formation of circuitry with modification of feature height

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

Microelectronic package interconnect and method of fabrication thereof

Manufacturing process for a quad flat non-leaded chip package structure

MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

Semiconductor connection component

Production methods of electronic devices

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Method for fabricating stacked semiconductor components

Manufacturing process for a chip package structure

LED bonding structures and methods of fabricating LED bonding structures

Battery-operated wireless-communication apparatus and method

Alkali silicate glass based coating and method for applying

POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL

Optical module having a block with feedthrough pins

Semiconductor laser device and method for manufacturing the same

Three dimensional structure memory

Electronic device having stack-type semiconductor package and method of forming the same

High density in-package microelectronic amplifier

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Electronic device mounting structure

High speed interconnect and method of manufacture

Low-loss interface

High speed interconnection system having a dielectric system with polygonal arrays of holes therein

Method and apparatus for interrogating an electronic component

Phosphor and use thereof

Method for generating low color temperature light and light emitting device adopting the same

Quartz crystal device

Triggering device for a safety device in an automotive vehicle

Chip module and a fabrication method thereof

Stack chip and stack chip package having the same

Package structure for multiple die stack

Structure of high performance combo chip and processing method

Semiconductor device and method of manufacturing the same

Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Multi-chip semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Dual-sided chip attached modules

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device package structure

Electronic package device, module, and electronic apparatus

Semiconductor package embedded in substrate, system including the same and associated methods

Singulated semiconductor package

Semiconductor device with leadframe including a diffusion barrier

Chip package with asymmetric molding

Semiconductor package and method of assembling a semiconductor package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device including a coupling conductor having a concave and convex

METHOD OF FORMING A SEMICONDUCTOR DIE HAVING A SLOPED EDGE FOR RECEIVING AN ELECTRICAL CONNECTOR

SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, lead frame, and microphone package therefor

Surface mount light emitting apparatus

Light emitting device

METHOD OF MAKING AN LED DEVICE HAVING A DOME LENS

White light LED with multiple encapsulation layers

LED chip package structure with high-efficiency light-emitting effect and method of packing the same

Multilayer semiconductor device

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

IC card and an adapter for the same

Smartcard and method of producing smartcards

ELECTRONIC DEVICE

Printed wiring board

Stress-distribution detecting semiconductor package group and detection method of stress distribution in semiconductor package using the same

Manufacturing process for a Quad Flat Non-leaded chip package structure

Method for manufacturing printed circuit board

Method for forming bumps on under bump metallurgy

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Method of manufacturing a semiconductor device including plural semiconductor chips

Method of producing electronic apparatus

Method for forming a light emitting apparatus

Methods of laser surface modification of ceramic packages for underfill spread control and structures formed thereby

Photodetection unit, photodetector, and x-ray computed tomography apparatus

Optoelectronic circuit with a photoreceptor and a laser diode, and module comprising the same

Illumination system using a plurality of light sources

LED and LED lamp

Package Structure for a High-Luminance Light Source

Semiconductor device and manufacturing method of the same

Imaging device and method for a bonding apparatus

Display device and light-emitting device

OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME

Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system

Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system

Bidirectional switch module

FAULT ANALYZER

Integrated current sensor

Semiconductor device

Semiconductor chip with stratified underfill

Semiconductor apparatus

Semiconductor apparatus

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Flip chip for electrical function test and manufacturing method thereof

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

Stack-type semiconductor package, method of forming the same and electronic system including the same

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Wire bond pads

Method and structure for increased wire bond density in packages for semiconductor chips

Structure of high performance combo chip and processing method

Stacked chip package with redistribution lines

Semiconductor device and method of manufacturing the same

Nail-shaped pillar for wafer-level chip-scale packaging

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

Wafer level packaging of semiconductor chips

Semiconductor device including thermally dissipating dummy pads

Semiconductor module including semiconductor chips in a plastic housing in separate regions

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated Circuit Package with Passive Component

Sandwiched organic LGA structure

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package-on-package system with anti-mold flash feature

Integrated circuit package-in-package system with side-by-side and offset stacking

Semiconductor memory package

Lead frame, semiconductor device, and method of manufacturing semiconductor device

BONDING-PATTERNED DEVICE AND ELECTRONIC COMPONENT

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Method of manufacturing semiconductor device having plural dicing steps

Surface mountable semiconductor package with solder bonding features

Redistribution structures for microfeature workpieces

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Sensor semiconductor device and method for fabricating the same

Semiconductor device

LED light source having improved resistance to thermal cycling

Semiconductor light emitting device and method for manufacturing same

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

Light emitting diode package having heat dissipating slugs

LED with particles in encapsulant for increased light extraction and non-yellow off-state color

Light emission device

LED ASSEMBLY WITH LED-REFLECTOR INTERCONNECT

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

IC CARD

Method of producing a contactless microelectronic device, such as for an electronic passport

CONDUCTIVE BALL MOUNTING APPARATUS

Electronic component module

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

Integrated circuit (IC) carrier assembly with first and second suspension means

Acceleration sensing device

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

Printed board with component mounting pin

Printed board with component mounting pin

Wirebond pad for semiconductor chip or wafer

Semiconductor packaging method

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

High power LED housing and fabrication method thereof

Multilayer ceramic substrate and method for producing same

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADHESIVE FILM, WIRING CIRCUIT LAMINATED WITH ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Optoelectronic semiconductor package and method for attaching heat dissipation element thereto

Method of simple chip select for memory subsystems

Semiconductor package having memory devices stacked on logic device

Temperature sensing arrangements for power electronic devices

Wiring board, method of manufacturing the same, and semiconductor device having wiring board

Micro-power source module

Air bridge structures and methods of making and using air bridge structures

Semiconductor device

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method for the same

DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS

Semiconductor device and method for manufacturing the same

Semiconductor package having buss-less substrate

Package structure and manufacturing method thereof

Flip-chip type semiconductor device

Electronic device and electronic apparatus

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

Semiconductor package structure

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

LEAD FRAME STRUCTURE

Semiconductor chip stack-type package and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Multi-chip module package

Semiconductor component

Lead frame with non-conductive connective bar

Electronic component with buffer layer

Semiconductor device and printed circuit board

Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method

Semiconductor sensor device and method for manufacturing same

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device

Switching assembly for an aircraft ignition system

Light emitting device

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Light emitting diode package

Front and rear covering type LED package structure and method for packaging the same

Semiconductor light emitting device

Semiconductor light emitting device and semiconductor light emitting apparatus

LIGHT EMITTING DIODE AND OUTDOOR ILLUMINATION DEVICE HAVING THE SAME

Solid state lighting component

Solid state lighting component

Method And Device For Enhancing Solderability

Mounting structure of electronic component

CROSSLINKED POLYMERIC MATERIALS AS FILLER AND SPACERS IN ADHESIVES

Pressure sensor and method for manufacturing the same

Electronic component mounting method and electronic component mounting device

Method for producing shock and tamper resistant microelectronic devices

Method for manufacturing a device having a high aspect ratio via

Components joining method and components joining structure

Integrated semiconductor laser device and method of fabricating the same

Surface mount light emitting diode assembly and backlight module using the same

Lighting apparatus with LEDs