WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

Micro-electro-mechanical-system package and method for manufacturing the same

Packaging substrate structure with electronic components embedded therein and method for manufacturing the same

Image sensor with cooling element

Planar magnetic device and power supply IC package using same

Semiconductor device

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

Top layers of metal for high performance IC's

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Integrated circuit including parylene material layer

Electronic device

Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package

Cu-Mo substrate and method for producing same

Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods

Semiconductor package having a plurality input/output members

Partitioning of electronic packages

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Magnetic shielding package structure of a magnetic memory device

Semiconductor chip, method of fabricating the same and stacked package having the same

IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

DOUBLE SIDED INTEGRATED PROCESSING AND SENSING CHIP

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

CMOS image sensor package

Circuit board for light emitting device package and light emitting unit using the same

Light emitting element

Polarless surface mounting light emitting diode

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member

Surface mount type light emitting diode package device

Backlight including side-emitting semiconductor light emitting devices

Light emitting semiconductor device

Optical element coupled to low profile side emitting LED

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND DISPLAY DEVICE

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME

MEMS BASED OPTICAL COHERENCE TOMOGRAPHY PROBE

Semiconductor die singulation method

Three-dimensional face-to-face integration assembly

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Capping coating for 3D integration applications

Method of manufacturing an integrated circuit module

Fabrication method of an organic substrate having embedded active-chips

System for the Manufacture of Electronic Assemblies Without Solder

Shielding and heat dissipation device

Power inverter

LED device and back panel of liquid crystal display

Method of fabricating hermetic terminal and hermetic terminal, method of fabricating piezoelectric oscillator and piezoelectric oscillator, oscillator, electronic appliance, and radio clock

Multi-Stage RF Amplifier Including MMICs and Discrete Transistor Amplifiers in a Single Package

Integrated circuit, chip stack and data processing system

Cascode current sensor for discrete power semiconductor devices

Semiconductor circuit and switching power supply apparatus

WHITE LED DEVICE COMPRISING DUAL-MOLD AND MANUFACTURING METHOD FOR THE SAME

High frequency ultrasound transducers based on ceramic films

Piezoelectric oscillator and case having an integral electrical terminal

Surface acoustic wave device

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Near chip scale package integration process

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

Sensor-type package and method for fabricating the same

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Semiconductor structure and semiconductor manufacturing method

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Power semiconductor module

Packaging substrate and application thereof

Stacked memory device

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage

Method of producing optical MEMS

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Semiconductor device with semiconductor chip and method for producing it

Heat slug and semiconductor package

Package Including a Microprocessor & Fourth Level Cache

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Image sensor package with trench insulator and fabrication method thereof

Semiconductor device

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Optical communication module

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

SEMICONDUCTOR LIGHT EMITTING DEVICES WITH SEPARATED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME

Semiconductor light emitting device

Semiconductor light emitting device and light emitting apparatus having the same

Semiconductor light emitting apparatus

Light-emitting device

Semiconductor light emitting devices with applied wavelength conversion materials

Mounting method, electric part-mounted substrate and an electric device

Noncontact information storage medium and method for manufacturing same

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

Functional element-mounted module and a method for producing the same

Wiring board and method of manufacturing wiring board

Substrate with low-elasticity layer and low-thermal-expansion layer

Mounting method

INTERCONNECT ASSEMBLIES AND METHODS

Method of manufacturing semiconductor device

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Component bonding method, component laminating method and bonded component structure

Adhesive bleed prevention method and product produced from same

Assembly of Encapsulated Electronic Components to a Printed Circuit Board

Optical communication device

Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules

ELECTRONIC COMPONENT, FABRICATION METHOD FOR THE SAME AND ELECTRONIC DEVICE HAVING THE SAME

Power module, power converter, and electric machine system for mounting in vehicle

Light Emitting Unit, Illumination Device Using Such Light Emitting Unit, and Image Scanner

LIGHT EMITTING DIODE PACKAGE, DIRECT TYPE BACKLIGHT MODULE AND EDGE TYPE BACKLIGHT MODULE

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Optoelectronic device with upconverting luminophoric medium

Flip chip quantum well modulator

Integrated modulating retro-reflector

Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit

RF identification device with near-field-coupled antenna

Power electronics devices with integrated gate drive circuitry

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

COMPLEX OXYNITRIDE PHOSPHOR, LIGHT-EMITTING DEVICE USING SAME, IMAGE DISPLAY, ILLUMINATING DEVICE, PHOSPHOR-CONTAINING COMPOSITION AND COMPLEX OXYNITRIDE

SEMICONDUCTOR DEVICE

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Method and structure to reduce cracking in flip chip underfill

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Die stacking apparatus and method

Arrangement of stacked integrated circuit dice having a direct electrical connection

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Bridge type pad structure of a semiconductor device

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

Electronic device, method of producing the same, and semiconductor device

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Conductor bump method and apparatus

Integrated circuit packaging system for fine pitch substrates

Multi-chip stack structure having through silicon via and method for fabrication the same

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Integrated Support Structure for Stacked Semiconductors With Overhang

PACKAGING WITH A CONNECTION STRUCTURE

Laser release process for very thin Si-carrier build

Semiconductor device and lead frame

Integrated circuit package system with multiple devices

Lead frame package apparatus and method

SEMICONDUCTOR PACKAGE APPARATUS

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Component and assemblies with ends offset downwardly

Flip-Chip Photodiode

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Light emitting diode structure

LED Light Source with Increased Thermal Conductivity

MULTI-CHIP LIGHT EMITTING DIODE PACKAGE

Optical device including a wiring having a reentrant cavity

Compression bonding device and a mounting method

Metal base circuit board, LED, and LED light source unit

Circuit board

Solar cell receiver having an insulated bypass diode

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Relay substrate and substrate assembly

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

Method for forming semiconductor package and mold cast used for the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

Package structure for solid-state lighting devices and method of fabricating the same

Structure of a supporting assembly for surface mount device LED and manufacturing method thereof

Backlight Assembly, Method of Manufacturing the Same and Display Device Having the Same

Electronic device and method for manufacturing electronic device

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Connector with build-in control unit and its application

Driving chip, driving chip package having the same, display apparatus having the driving chip, and method thereof

Microelectronic pressure sensor

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Tapered dielectric and conductor structures and applications thereof

Device and method for testing integrated circuit dice in an integrated circuit module

Phosphor, light-emitting device using same, image display and illuminating device

White light-emitting lamp, backlight using same, display and illuminating device

Phosphor, phosphor sheet, and manufacturing method therefore, and light emission device using the phosphor

Semiconductor device

Method of manufacturing an electronic part mounting structure

Flip chip package structure and method for manufacturing the same

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Integrated circuit having a semiconductor substrate with a barrier layer

Electronic assembly having a multilayer adhesive structure

Semiconductor device and method for manufacturing the same

Crosstalk-free WLCSP structure for high frequency application

Semiconductor device with heat sink and method for manufacturing the same

Heat extraction from packaged semiconductor chips, scalable with chip area

Semiconductor plastic package and fabricating method thereof

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Stacked integrated circuit leadframe package system

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor device package

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor device and method of manufacturing the same

Method for fabricating semiconductor device having backside redistribution layers

Optical Module

Sensor package

Semiconductor device having a sensor chip, and method for producing the same

Semiconductor device

Light-emitting device

Light emitting diode device

Optoelectronic component

Light emitting device and method of manufacturing the same

RADIATION-EMITTING ELEMENT AND METHOD FOR PRODUCING A RADIATION-EMITTING ELEMENT

Silicon LED package having horn and contact edge with (111) planes

SUPER THIN SIDE-VIEW LIGHT-EMITTING DIODE (LED) PACKAGE AND FABRICATION METHOD THEREOF

Infrared sensor and method for manufacturing infrared sensor

Method and apparatus for loading solder balls

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Apparatus and method of mounting conductive ball

Dual cavity, high-heat dissipating printed wiring board assembly

Methods of attaching a die to a substrate

ALIGNMENT OF OPTICAL ELEMENT AND SOLAR CELL

THERMAL SPRAY FOR SOLAR CONCENTRATOR FABRICATION

Conductive ball mounting method and apparatus having a movable solder ball container

Wire bonded wafer level cavity package

METHOD OF PACKAGING A SEMICONDUCTOR DIE

Method for forming side wirings

Flip chip mounting method and bump forming method

Method and apparatus for fabricating integrated circuit device using self-organizing function

LIGHT EMITTING DEVICE PROCESSES

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

Luminescent material

Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

BONDING WIRE

PACKAGE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Semiconductor device with offset stacked integrated circuits

Backlight module with light source substrate blocks

Memory card and its manufacturing method

Semiconductor assembly having a housing

Light emitting apparatus including independently driven light emitting portions

Fluorescent substance and process for producing the same, and luminescent element using the same

Light emitting device and method of manufacturing the same

Light emitting apparatus

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor apparatus having side surface wiring

Circuit module and electrical component

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device having double side electrode structure and method of producing the same

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

INTERCONNECT JOINT

Method for packaging semiconductor dies having through-silicon vias

Device structure with preformed ring and method therefor

Semiconductor device

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE

Light emitting device and method of manufacturing the same

Red line emitting complex fluoride phosphors activated with Mn4+

Semiconductor light emitting device and method of manufacturing the same

LED chip package structure with high-efficiency light-emitting effect and method of packaging the same

Bonding method

Semiconductor device bonding apparatus and method for bonding semiconductor device using the same

METHOD OF FORMING PASSAGE IN SUBSTRATE FOR MEMS MODULE

Method of manufacturing printed wiring board

Thermally aware design modification

Capacitive isolator

Wafer processing method

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Substrate removal during LED formation

Manufacturing method of semiconductor integrated circuit device

Fretting and whisker resistant coating system and method

Electronic assemblies without solder and methods for their manufacture

CURABLE ENCAPSULANT COMPOSITION AND ASSOCIATED METHOD

Device structure of carbon fibers and manufacturing method thereof

METHOD OF PRODUCING A PHOTOELECTRIC TRANSDUCER AND OPTICAL PICK UP

Semiconductor assembly

Package Structure for a High-Luminance Light Source

Control device and method for producing a control device

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit package system with flexible substrate and recessed package

Light emitting diode device and applications thereof

Integrated circuit with electromagnetic intrachip communication and methods for use therewith