Socket, and test apparatus and method using the socket

Semiconductor module, and hybrid vehicle drive device including the same

PHOSPHOR PACKAGE OF LIGHT EMITTING DIODES

Light emitting device

LIGHT EMITTING DEVICE

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Integrated circuit package system including stacked die

Solder cap application process on copper bump using solder powder film

Semiconductor chip package and method of manufacturing the same

Flip-chip package structure, and the substrate and the chip thereof

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Three-dimensional die-stacking package structure

Wiring substrate for a multi-chip semiconductor device

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor package with reduced length interconnect and manufacturing method thereof

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

SEAL RING FOR GLASS WALL MICROELECTRONICS PACKAGE

Multichip module package and fabrication method

Heat-conductive package structure

Microelectronic package element and method of fabricating thereof

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Semiconductor wafer structure

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Fusion quad flat semiconductor package

Electrically connecting substrate with electrical device

Integrated circuit package system with multiple molding

Mixed wire semiconductor lead frame package

INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

Manufacturing process and structure of through silicon via

Electronic device comprising an integrated circuit and a capacitance element

Microelectronic imagers and methods for manufacturing such microelectronic imagers

Back-illuminated type solid-state image pickup device and camera module using the same

Chip-type LED having an insulating substrate in which a first concave hole and a second concave hole are formed

SOLDER ALLOYS

Method of manufacturing high power light-emitting device package and structure thereof

Group of phosphor particles for light-emitting device, light-emitting device and backlight for liquid crystal display

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Semiconductor device and semiconductor device fabrication method

Chip-type light emitting device and wiring substrate for the same

LED chip design for white conversion

Method for connecting an electronic chip to a radiofrequency identification device

Method and apparatus for placing conductive balls

COMPRESSION BONDING DEVICE

Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same

Film substrate, fabrication method thereof, and image display substrate

Component with sensitive component structures and method for the production thereof

Hybrid integrated circuit device and manufacturing method thereof

Cooling of substrate using interposer channels

Method of forming a substrate with interposer channels for cooling the substrate

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

PRODUCING A SURFACE-MOUNTABLE RADIATION EMITTING COMPONENT

Semiconductor Device Package Disassembly

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

OPTICAL MODULE AND OPTICAL TRANSCEIVER

Light emitting device including protective glass film

Solid state lighting device with heat-dissipating capability

Optical device and illumination device

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

Antenna element and semiconductor device

RFID integrated circuit with integrated antenna structure

Power semiconductor package

Semiconductor device and method for fabricating the same

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Semiconductor device having through electrode and method of fabricating the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Semiconductor device with pads of enhanced moisture blocking ability

Chip package

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor device

Heat dissipation plate and semiconductor device

Semiconductor package system with patterned mask over thermal relief

High-Density Fine Line Structure And Method Of Manufacturing The Same

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

SEMICONDUCTOR PACKAGE

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Multi-chip electronic package with reduced stress

STRUCTURE AND METHOD FOR MANUFACTURING SMD DIODE FRAME

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Semiconductor device and method for manufacturing thereof

Nitride Compound Semiconductor and Process for Producing the Same

IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME

Semiconductor device and manufacturing method of the same

Power semiconductor devices with trenched shielded split gate transistor and methods of manufacture

Power semiconductor devices with shield and gate contacts and methods of manufacture

Semiconductor light emitting device member, method for manufacturing such semiconductor light emitting device member and semiconductor light emitting device using such semiconductor light emitting device member

LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND LAMP

Package for micromirror device

Optical semiconductor device

PHOSPHOR AND METHOD FOR PRODUCTION THEREOF, AND APPLICATION THEREOF

LIGHTING DEVICE PACKAGE

Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same

Image sensor having two light receiving elements and camera module having the image sensor

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Multilayered printed circuit board and fabricating method thereof

Cooling of substrate using interposer channels

Cooling of substrate using interposer channels

ELECTRONIC APPARATUS

Method of fabricating a semiconductor package having through holes for molding back side of package

Method for fabricating semiconductor package free of substrate

METHOD OF PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of fabricating a semiconductor die having a redistribution layer

Fabrication method of semiconductor integrated circuit device

Manufacturing method of light emitting diode

Method of fabricating a memory card using SiP/SMT hybrid technology

Methods for forming quad flat no-lead (QFN) packages

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Circuit system with circuit element and reference plane

Light-transmitting module capable of responding a high-frequency over 10GHz

Semiconductor device and semiconductor memory tester

Light Emitting Device, Light Emitting Device Package Structure, and Method of Manufacturing the Light Emitting Device Package Structure

Power Converter Unit

Multilayer wiring element having pin interface

Packaging system with hollow package and method for the same

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

Current sensor including an integrated circuit die including a first and second coil

LED with phosphor layer having different thickness or different phosphor concentration

Method of manufacturing a piezoelectric component

Chip attack protection

Semiconductor device with a buffer region with tightly-packed filler particles

Integrated circuit package system with overhang die

Integrated circuit package system with dual side connection

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor die having a distribution layer

Semiconductor device and method of assembly

Semiconductor device and wire bonding method

Electronic device comprising an ESD device

Semiconductor package and trenched semiconductor power device using the same

Semiconductor package and method for manufacturing the same

High-density fine line structure and method of manufacturing the same

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

Integrated circuit package system with overhanging connection stack

Multi-chips Stacked package structure

Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground

Semiconductor device and method of manufacturing the same

Semiconductor device with flip-chip connection that uses gallium or indium as bonding material

Wafer-level solder bumps

IC chip with finger-like bumps

Integrated circuit package in package system with adhesiveless package attach

Semiconductor device

High thermal performance packaging for circuit dies

Semiconductor device, a method of manufacturing the same and an electronic device

LOW TEMPERATURE THERMAL INTERFACE MATERIALS

Semiconductor device including semiconductor chips having contact elements

MEMS package and method for the production thereof

Semiconductor package having through holes for molding back side of package

Build-up-package for integrated circuit devices, and methods of making same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

High-Density Fine Line Structure And Method Of Manufacturing The Same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Semiconductor package and multi-chip semiconductor package using the same

Stackable package by using internal stacking modules

Integrated circuit package system with top and bottom terminals

Electronic component and a method of fabricating an electronic component

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Integrated circuit package system with integral inner lead and paddle

Semiconductor device

PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

Optoelectronic component that emits electromagnetic radiation and illumination module

Packaged device and method of manufacturing the same

SEMICONDUCTOR LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND LAMP

Light-emitting device and method for fabricating same

Light emitting device package

SEMICONDUCTOR LIGHT EMITTING DEVICE, PROCESS FOR PRODUCING THE SAME, AND LED ILLUMINATING APPARATUS USING THE SAME

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Optical designs for high-efficacy white-light emitting diodes

Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Multi-light emitting diode package

Light emitting device

Semiconductor Display Device and Method for Manufacturing The Same

Efficient cooling of lasers, LEDs and photonics devices

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Non-Volatile Memory Device, Method of Manufacturing the Same, and Semiconductor Package

Method for manufacturing a printed wiring board

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

Micro-ball loading device and loading method

BONDING METHOD AND BONDING APPARATUS

Flexible substrate

Method and arrangement for producing a smart card

Method of machining substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Grooving bumped wafer pre-underfill system

Formation of alpha particle shields in chip packaging

Stack circuit member and method

Manufacturing Method of Semiconductor Integrated Circuit Device

Method for manufacturing semiconductor package

Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers

Method of constructing a stacked-die semiconductor structure

Manufacturing method for semiconductor integrated device

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link

Semiconductor laser device

Light emitting apparatus and surface light source apparatus having the same

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Multi-layer substrate and manufacture method thereof

ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE

Semiconductor memory device and semiconductor memory card using the same

Antenna System for a Radar Transceiver

Antenna system for a radar transceiver

Methods and systems of attaching a radio transceiver to an antenna

Signal transmission circuit, IC package, and mounting board

Quad flat non-leaded chip package

Semiconductor device including a stress buffer

Tape wiring substrate and chip-on-film package using the same

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Wafer level surface passivation of stackable integrated circuit chips

Self-aligned wafer or chip structure, and self-aligned stacked structure

Electrical shielding in stacked dies by using conductive die attach adhesive

Mounting substrate and manufacturing method thereof

Substrate bonding method and semiconductor device

Structure and manufactruing method of chip scale package

Semiconductor device

CHIP PACKAGE

Semiconductor device and manufacturing method thereof

Electronic device manufacturing method and electronic device

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Integrated circuit package system employing device stacking

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE

Heat spreader in a flip chip package

Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK

Die mounting stress isolator

Mold compound circuit structure for enhanced electrical and thermal performance

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Semiconductor device

Array molded package-on-package having redistribution lines

Multiple die integrated circuit package

Lead frame, semiconductor device using same and manufacturing method thereof

Integrated circuit package system having perimeter paddle

Semiconductor device with surface mounting terminals

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Method of making a wafer level integration package

Semiconductor device and semiconductor package having the same

Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium

Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack

Surface mountable chip

Thin double-sided package substrate and manufacture method thereof

Optically Active Compositions and Combinations of Same with Indium Gallium Nitride Semiconductors

Light-emitting semiconductor device

Electronic component package and method of manufacturing the same, and electronic component device

Low profile side emitting LED with window layer and phosphor layer

Light-emitting diode arrangement

High light efficiency solid-state light emitting structure and methods to manufacturing the same

Semiconductor Light Source and Method of Producing Light of a Desired Color Point

Semiconductor module

Light-emitting diode and method for fabrication thereof

Wire bonding apparatus and process

Bonding Tool With Improved Finish

Method of making demountable interconnect structure

Electromagnetic bandgap structure and printed circuit board

Manufacturing method of electronic component

Integrated galvanic isolator using wireless transmission

Power composite integrated semiconductor device and manufacturing method thereof

METHOD OF FORMING AN INTERCONNECT JOINT

Manufacturing method for semiconductor device containing stacked semiconductor chips

Process for producing a functional device-mounted module

Lead frame and method for fabricating semiconductor package employing the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Plastic overmolded packages with mechancially decoupled lid attach attachment

Securing a transistor outline can within an optical component

Thick film circuit component and method for manufacturing the same

Apparatus for Producing Ic Chip Package

Connected body and optical transceiver module

Optical path converting member, multilayer print circuit board, and device for optical communication

Lighting device and lighting method