Circuit board and circuit device

Power core devices and methods of making thereof

Multilayer printed circuit board

Heat sink mounted on a vehicle-transmission case

Electrical device with covering

Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of wire bonding over active area of a semiconductor circuit

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Pre-plated leadframe having enhanced encapsulation adhesion

METHODS OF FORMING A CORED METALLIC THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY

Method of making semiconductor package with plated connection

Method for manufacturing a semiconductor device

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

Light emitting diode package with metal reflective layer and method of manufacturing the same

MARKED BODY AND MANUFACTURING METHOD THEREOF

Light emitting diodes and lasers diodes with color converters

Electroluminescent device with a light conversion element

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME

Light-emitting diode and method for manufacturing the same

Image sensor package and image capture device with same

OPTICAL DEVICE, CAMERA MODULE, MOBILE PHONE, DIGITAL STILL CAMERA, AND MEDICAL ENDOSCOPE

Antenna device and radio communication device

Output Circuit

Contact carriers (tiles) for populating larger substrates with spring contacts

Semiconductor package land grid array substrate and plurality of first and second electrodes

Phosphor converted LED with improved uniformity and having lower phosphor requirements

Wavelength Converter, Light-Emitting Device, Method of Producing Wavelength Converter and Method of Producing Light-Emitting Device

Light emitting device and method for manufacturing the same

RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APPARATUS

Module comprising a semiconductor chip

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE

Semiconductor device and its manufacturing method

Semiconductor device and method for manufacturing the same

Wire-bonded semiconductor component with reinforced inner connection metallization

Semiconductor integrated circuit device and fabrication process thereof

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Stackable semiconductor device and fabrication method thereof

Integrated circuit and method for producing the same

Semiconductor device with Al pad

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

Semiconductor device and method for manufacturing thereof

Copper die bumps with electromigration cap and plated solder

SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

Carbon nanotubes for active direct and indirect cooling of electronics device

Chip package module

Chip and wafer integration process using vertical connections

Structure and electronics device using the structure

Semiconductor package

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Semiconductor package and the method of making the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

CHIP PACKAGE STRUCTURE

Integrated circuit package system with lead support

Methods and apparatus for flip-chip-on-lead semiconductor package

Leadframe based flip chip semiconductor package and lead frame thereof

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Leadframe design for QFN package with top terminal leads

Multi-layer Package Structure for an Acoustic Microsensor

LED module and manufacturing method thereof

Semiconductor light emitting device

Integrated photoreceptor circuit and optoelectronic component including the same with electric contact pads arranged solely on side of the processing area which is juxtaposed with the photosensitive area

Apparatus and method for connecting a component with a substrate

Method for manufacturing electric connections in wafer

HEAT BLOCK

Paste for forming an interconnect and interconnect formed from the paste

Semiconductor device

Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor

System for fabricating semiconductor components with conductive interconnects

System and method for concurrently checking availability of data in extending memories

Surface modifying macromolecules with high degradation temperatures and uses thereof

Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic

Integrated circuit socket

Fibrous laminate interface for security coatings

Method of making an interconnect structure

Wirebond structure and method to connect to a microelectronic die

Wire bonding method and related device for high-frequency applications

Method of making reliable wafer level chip scale package semiconductor devices

Integrated circuit package system employing multi-package module techniques

Method of joining chips utilizing copper pillar

Sensor component and method for producing a sensor component

Adhesive film for stacking semiconductor chips

Electronic components on trenched substrates and method of forming same

Semiconductor laser diode apparatus and method of fabricating the same

Light-emitting device

ADAPTER FOR A MEMORY CARD AND A MEMORY CARD

Pump structures integral to a fluid filled heat transfer apparatus

Thermal pillow

ELECTROSTATIC DISCHARGE PROTECTION COMPONENT, AND ELECTRONIC COMPONENT MODULE USING THE SAME

Apparatus, unit and method for testing image sensor packages

Semiconductor device for driving motor, three-phase motor and motor driving apparatus with the semiconductor device and fan motor

Light emitting device and method for manufacturing the same

Solid state white light emitter and display using same

Solid state white light emitter and display using same

Molded beam for optoelectronic sensor chip substrate

Semiconductor device and method of manufacturing the same

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Microelectronic substrate including bumping sites with nanostructures

Chip structure with bumps and testing pads

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module with multiple semiconductor chips

Semiconductor device having stacked dice disposed on base substrate

Silicon chip having inclined contact pads and electronic module comprising such a chip

Electronic device and method for producing electronic devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device having a bonding structure for two elements

Method for manufacturing semiconductor device

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Semiconductor package and fabricating method thereof

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING

Physical quantity sensor and semiconductor device having package and cover

Lead structure for a semiconductor component and method for producing the same

Semiconductor module with semiconductor chips and method for producing it

Base substrate for chip scale packaging

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Package structure and stacked package module using the same

Multi-chip package with a single die pad

Method and apparatus for fabricating a plurality of semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Low cost lead-free preplated leadframe having improved adhesion and solderability

Multi-chip stack structure and fabrication method thereof

Portable object connectable package

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Power module having stacked flip-chip and method of fabricating the power module

CHIP PACKAGE STRUCTURE

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing same

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

Vertical electrical interconnect formed on support prior to die mount

Circuit component and method of manufacture

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device package

Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device

Semiconductor device and method of manufacturing the same

Image sensor module having build-in package cavity and the method of the same

Packaging methods for imager devices

Semiconductor device and manufacturing method of the same

Submount for diode with single bottom electrode

LED interconnect spring clip assembly

Light emitting device

Light emitting diode package

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

High-power light emitting diode and method of manufacturing the same

Optical Element, Optoelectronic Component Comprising Said Element, and the Production Thereof

Soldering structure and method using Zn

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Wiring substrate and electronic device

Wiring board and capacitor to be built into wiring board

Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same

Method for manufacturing hybrid printed circuit board

Packaging for chip-on-board pressure sensor

Wireless communication system

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor component and production method

Design techniques for stacking identical memory dies

Semiconductor module

Method of fabricating module having stacked chip scale semiconductor packages

SINGLE-CHIP SURFACE MOUNTED LED STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME

Silicone resin composition

Optical transceiver with reduced height

Condenser microphone

Semiconductor optical device and manufacturing method thereof

Electronic components on trenched substrates and method of forming same

Thin film deposition as an active conductor and method therefor

Method and structure for connecting, stacking, and cooling chips on a flexible carrier

Method and structure to improve thermal dissipation from semiconductor devices

Electronic device, package having the same, and electronic apparatus

Light emitting diode for harsh environments

LED backlight device and LCD device

Identification document with a contactless RFID chip

Class D amplifier arrangement

Digital isolator with communication across an isolation barrier

Light emitting device with light emitting cells arrayed

LED assembly and module

Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device

Method and device including reworkable alpha particle barrier and corrosion barrier

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Substrate with feedthrough and method for producing the same

Semiconductor device

Removal of integrated circuits from packages

Semiconductor device manufacturing method and semiconductor device

Metallic electrode forming method and semiconductor device having metallic electrode

Mounting configuration of electronic component

Semiconductor module, method of manufacturing semiconductor module, and mobile device

System and method for increased stand-off height in stud bumping process

Stacked-Chip Semiconductor Device

Semiconductor component and method of manufacture

Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces

Structure of semiconductor device package and method of the same

Semiconductor device and method of manufacturing same

Chip package substrate and structure thereof

Package substrate strip, metal surface treatment method thereof and chip package structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Substrate for mounting semiconductor element and method of manufacturing the same

Resin molded semiconductor device and differential amplifier circuit

LOW COST AND LOW COEFFICIENT OF THERMAL EXPANSION PACKAGING STRUCTURES AND PROCESSES

MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF

Integrated passive cap in a system-in-package

Space-efficient package for laterally conducting device

Semiconductor Light emitting device, LED package using the same, and method for fabricating the same

Light emitting diode and method of fabricating the same

LIGHT EMITTING DIODE STRUCTURE

Illuminance detecting apparatus comprising a light shielding element containing openings for each detector element

ILLUMINANCE DETECTION APPARATUS AND SENSOR MODULE

Conductive ball mounting apparatus and conductive ball mounting method

Electropolishing metal features on a semiconductor wafer

Circuit board surface structure

Circuit board surface structure and fabrication method thereof

Leadframe treatment for enhancing adhesion of encapsulant thereto

Resin filling apparatus, filling method, and method of manufacturing an electronic device

Thermopile infrared sensor array

Method for manufacturing the BGA package board

Designs and methods for conductive bumps

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

Method of forming plugs

Methods for fabricating semiconductor components and packaged semiconductor components

Resin encapsulation molding method for semiconductor device

Substrate based unmolded package

Semiconductor device and fabrication process thereof

Thermosetting die bonding film

Method for fabricating semiconductor device and carrier applied therein

Method of forming a bump-on-lead flip chip interconnection having higher escape routing density

Method for manufacturing semiconductor light emitting device

Bi-directional optical module

Illumination arrangement, multiple light module, luminaire and use thereof

Electronic part mounting board and method of mounting the same

Electrical component

Method for aligning die to substrate

SOLID STATE IMAGE PICK-UP DEVICE AND CAMERA USING THE SOLID STATE IMAGE PICK-UP DEVICE

Resistance balance circuit

Phosphor composition and method for producing the same, and light-emitting device using the same

Light emitting device

SEMICONDUCTOR COMPONENT

Carbon nanotube bond pad structure and method therefor

Integrated circuit package system with underfill

Semiconductor apparatus and mobile apparatus

Method of assembling chips

High temperature, stable SiC device interconnects and packages having low thermal resistance

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Electronic assembly having a multilayer adhesive structure

Power semiconductor module and method for producing the same

Interposer for die stacking in semiconductor packages and the method of making the same

Chip module and method for producing a chip module

Electronic package and manufacturing method thereof

Semiconductor device and a method of manufacturing for high output MOSFET

Planar multi semiconductor chip package and method of manufacturing the same

Package structure to improve the reliability for WLP

Heat dissipation methods and structures for semiconductor device

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME

IC card and method of manufacturing the same

Airtight package comprising a pressure adjustment unit

Memory IC package assembly having stair step metal layer and apertures

Semiconductor package configuration with improved lead portion arrangement

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Encapsulated optical package

Semiconductor device

Nickel tin bonding system with barrier layer for semiconductor wafers and devices

Light-emitting diode

Light emitting device

Light-emitting diode incorporation the packing nano particules with high refractive index

Optical semiconductor device and method for manufacturing optical semiconductor device

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

Illumination device

Light emitting apparatus

Semiconductor white light emitting device and method for manufacturing the same

Light emitting diode, method for manufacturing light emitting diode, integrated light emitting diode, method for manufacturing integrated light emitting diode, light emitting diode backlight, light emitting diode illumination device, light emitting diode display, electronic apparatus, electronic device, and method for manufacturing electronic device

Alternating current light emitting device

High-heat-resistive semiconductor device

Direct attach optical receiver module and method of testing

Low-profile capillary for wire bonding

Method and device for transferring a chip to a contact substrate

Sealed capacitive sensor

Method and apparatus for electronically aligning capacitively coupled mini-bars

Method and apparatus for ultra thin wafer backside processing

Multi-wavelength LED construction & manufacturing proces

Electronic module

Methods for fabricating semiconductor components with conductive interconnects

Conductive via formation utilizing electroplating

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

REWORKABLE CHIP STACK

Soldering method and method of manufacturing semiconductor device including soldering method

Electronic component structure and method of making

Method for fabricating semiconductor device to which test is performed at wafer level and apparatus for testing semiconductor device

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Layer sequence and method of manufacturing a layer sequence

Method of manufacturing an electronic component and an electronic device