Component assembly

SURFACE MOUNT CIRCUIT BOARD, METHOD FOR MANUFACTURING SURFACE MOUNT CIRCUIT BOARD, AND METHOD FOR MOUNTING SURFACE MOUNT ELECTRONIC DEVICES

SENSITIVE SILICON MICROPHONE WITH WIDE DYNAMIC RANGE

Semiconductor memory device and defect remedying method thereof

Package having a plurality of mounting orientations

Electronic components on trenched substrates and method of forming same

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Solder layer and device bonding substrate using the same and method for manufacturing such a substrate

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Electronic apparatus and mounting method

Low profile flip chip power module and method of making

Optoelectronic module provided with a flexible substrate and at least one photoreceptor circuit incorporated into a computer mouse

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Stacked semiconductor chip package with shared DLL signal and method for fabricating stacked semiconductor chip package with shared DLL signal

Packaged integrated circuit

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor package and fabrication method thereof

Semiconductor device

INTEGRATED CIRCUIT

Semiconductor chip and shielding structure thereof

Circuit device, a method for manufacturing a circuit device, and a semiconductor module

Semiconductor integrated circuit device and fabrication method for the same

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME

Stress buffer layer for packaging process

Semiconductor device and method of manufacturing the same

Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same

Semiconductor chip on film package with dummy patterns and manufacturing method thereof

High frequency device module and manufacturing method thereof

Semiconductor device

Power device package and semiconductor package mold for fabricating the same

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Universal substrate for a semiconductor device having selectively activated fuses

Stackable bare-die package

Stacked Package and Method of Fabricating the Same

Stackable integrated circuit package system with multiple interconnect interface

High current semiconductor power device SOIC package

QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

Semiconductor components with conductive interconnects

Image sensor chip package

OPTICAL MODULE

Image sensing device having protection pattern on the microlens, camera module, and method of forming the same

High Frequency Switch With Low Loss, Low Harmonics, And Improved Linearity Performance

Light-emitting diode having a flexible substrate

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Surface mounting type light emitting diode

Surface mounting type light emitting diode and method for manufacturing the same

LED devices having lenses and methods of making same

White light LED device

Optoelectronic components with adhesion agent

LED assembly with molded glass lens

Power electronic switching device with laminated bus

Method for manufacturing a circuit board structure

Flexible wiring cable

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

Method of manufacturing wiring substrate and method of manufacturing electronic component device

Mask and substrate alignment for solder bump process

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Method for fabricating an electronic device substrate

Manufacturing method for an LED light string and a jig for making the LED light string

Methods of forming inter-poly dielectric (IPD) layers in power semiconductor devices

Manufacturing method of semiconductor device and manufacturing method of lead frame

Method and apparatus for manufacturing electronic integrated circuit chip

Leadframe enhancement and method of producing a multi-row semiconductor package

Method for manufacturing a semiconductor laser

Fabrication process for package with light emitting device on a sub-mount

Method of manufacturing a semiconductor integrated circuit device

Light source for an image-generating unit

SEMICONDUCTOR LIGHT EMITTING DEVICE ARRAY CHIP AND EXPOSURE LIGHT SOURCE APPARATUS

Illumination system comprising color deficiency compensating luminescent material

HIGH-FREQUENCY SIGNAL PROCESSING MODULE AND ELECTRONIC DEVICE

Package board and method for manufacturing thereof

SEMICONDUCTOR CHIP, MULTI-CHIP SEMICONDUCTOR DEVICE, INSPECTION METHOD OF THE SAME, AND ELECTRIC APPLIANCE INTEGRATING THE SAME

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Semiconductor device and wire bonding method

Semiconductor package having stacked semiconductor chips

Electronic package structure and method

Semiconductor device and method for manufacturing the same

Single-sided, flat, no lead, integrated circuit package

CHIP PACKAGE

Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate

Integrated circuit including conductive bumps

Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member

Semiconductor device and method for producing the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Packaging conductive structure and method for manufacturing the same

Bowed wafer hybridization compensation

Semiconductor device with resin layers and wirings and method for manufacturing the same

Module comprising a semiconductor chip comprising a movable element

Semiconductor sensor having a flat mounting plate with banks

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Integrated package circuit with stiffener

SEMICONDUCTOR DEVICE

Packaging conductive structure for a semiconductor substrate having a metallic layer

Semiconductor device package with multi-chips and method of the same

Semiconductor device and semiconductor module using the same

Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

Stacked electronic component and manufacturing method thereof

Multi-chips package with reduced structure and method for forming the same

Package structure and manufacturing method thereof

Conductive structure for a semiconductor integrated circuit and method for forming the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device

Electronic component and method for manufacturing an electronic component

Apparatus for wire bonding and integrated circuit chip package

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Encapsulated chip scale package having flip-chip on lead frame structure

Method of manufacturing semiconductor devices encapsulated in chip size packages

Solid-state imaging apparatus, manufacturing method therefor and electronic equipment using the same

MOS transistor device in common source configuration

Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture

Group III Nitride Diodes on Low Index Carrier Substrates

Method for producing an optical, radiation-emitting component and optical, radiation-emitting component

Lateral-type light-emitting diode and method of manufacture thereof

High-power light-emitting diode

Light emitting diode structure and manufacturing method thereof

Optoelectronic component and package for an optoelectronic component

LIGHT EMITTING DEVICE

Light-emitting device

SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD

Bond quality indication by bump structure on substrate

Phosphor production method

Bond head link assembly for a wire bonding machine

Wire cleaning guide

Semiconductor sensor and manufacturing method therefor

Method for mounting electronic components

Transfer mask in micro ball mounter

SD Flash Memory Card Manufacturing Using Rigid-Flex PCB

Undercut-free BLM process for Pb-free and Pb-reduced C4

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Packaged semiconductor light emitting devices having multiple optical elements

Semiconductor device and method of manufacturing the same

Method and apparatus for creating RFID devices

Method for manufacturing passive device and semiconductor package using thin metal piece

Solid-state imaging device and method for manufacturing the same

Method for manufacturing a light-emitting diode having high heat-dissipating efficiency

Observation apparatus and method for observing void in underfill resin

Ribbon bonding tool and process

Condenser microphone

Semiconductor light-emitting element and semiconductor light-emitting device

ELECTRIC CIRCUIT PACKAGE

Method for mounting electronic-component module

Electronic component module and method for manufacturing the same

Power semiconductor module

Imaging device module and portable electronic apparatus utilizing the same

Bare chip mounted structure and mounting method

Semiconductor device including protection circuit and switch circuit and its testing method

High-frequency module

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

Electronic device manufacturing system and electronic device manufacturing method

Light Emitting Device and Illuminating Device

Phosphor composition and method for producing the same, and light-emitting device using the same

Illumination System Comprising a Red-Emitting Ceramic Luminescence Converter

White LED package structure having a silicon substrate and method of making the same

SEMICONDUCTOR PACKAGE WIRE BONDING

Bumping process and bump structure

Optical semiconductor device

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY

ARCHITECTURE FOR FACE-TO-FACE BONDING BETWEEN SUBSTRATE AND MULTIPLE DAUGHTER CHIPS

Electronic device comprising an integrated circuit

Panel, semiconductor device and method for the production thereof

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Semiconductor device comprising electromigration prevention film and manufacturing method thereof

Circuitized substrate with continuous thermoplastic support film dielectric layers

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

Bump structure and manufacturing method thereof

Integrated circuit package system with bump over via

Integrated circuit including gas phase deposited packaging material

Integrated circuit package having large conductive area and method for fabricating the same

Multi-chip module

Power semiconductor module and method for its manufacture

Module with silicon-based layer

Subminiature electronic device having hermetic cavity and method of manufacturing the same

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Glass dam structures for imaging devices chip scale package

Image sensor package with die receiving opening and method of the same

System in package semiconductor device suitable for efficient power management and method of managing power of the same

Stacked semiconductor package

SEMICONDUCTOR PACKAGE

Surface mount electronic component and process for manufacturing same

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and its manufacturing method

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

SEMICONDUCTOR CHIP SUPPRESSING A VOID DURING A DIE ATTACHING PROCESS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Pin referenced image sensor to reduce tilt in a camera module

Sensor device having stopper for limitting displacement

Semiconductor device, method for manufacturing the same, liquid crystal television, and EL television

Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

LIGHT EMITTING DIODE STRUCTURE WITH HIGH HEAT DISSIPATION

Light emitting device with a lens of silicone

Red phosphor and luminous element using the same

Light emitting device and phosphor of alkaline earth sulfide therefor

Green phosphor of thiogallate, red phosphor of alkaline earth sulfide and white light emitting device thereof

Surface-mount type optical semiconductor device and method for manufacturing the same

Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Test structure for seal ring quality monitor

Method For Manufacturing a Smart Card, a Thus Manufactured Smart Card, and a Method For Manufacturing a Wired Antenna

Ribbon bonding tool and process

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

Heat sink in the form of a heat pipe and process for manufacturing such a heat sink

Memory configured on a common substrate

Semiconductor device and production method therefor

Apparatus and method for semiconductor wafer bumping via injection molded solder

Low fabrication cost, fine pitch and high reliability solder bump

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Integrated sensor and circuitry and process therefor

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Method of manufacturing semiconductor device

Method of fabricating chip package structure

Integrated circuit edge protection method and apparatus

Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier

Image sensor chip package and method of fabricating the same

Method of LED packaging on transparent flexible film

OPTICAL TRANSCEIVER MODULE

Bi-directional optical module with improved optical crosstalk

Film type package for fingerprint sensor

Opto-isolator including a vertical cavity surface emitting laser

LED and LED-applied backlight module

LIGHT-EMITTING DIODE

Light emitting diode

Monolithic Controller for the Generator Unit of a Motor Vehicle

Thin-film capacitor

METAL TRACE FABRICATION FOR OPTICAL ELEMENT

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Display device and manufacturing method thereof

Versatile Si-based packaging with integrated passive components for mmWave applications

Semiconductor device with inductor

Luminescent material

Semiconductor and Method For Producing the Same

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Dynamic pad size to reduce solder fatigue

POWER CONTROL STRUCTURE FOR MANAGING A PLURALITY OF VOLTAGE ISLANDS

LSI package provided with interface module, and transmission line header employed in the package

Stacked structure using semiconductor devices and semiconductor device package including the same

Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE

Semiconductor package substrate

Semiconductor substrate

Semiconductor device

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Integrated circuit packaging system with interposer

Nanostructure-Based Package Interconnect

SEMICONDUCTOR DEVICE INCLUDING BUMP ELECTRODES

Bump structure having a reinforcement member

Heat dissipating device with preselected designed interface for thermal interface materials

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE SUBSTRATE

Semiconductor device including semiconductor elements and method of producing semiconductor device

Stackable semiconductor package having metal pin within through hole of package

PACKAGE AND METHOD FOR MAKING THE SAME

Microelectronic packages and methods therefor

Injection molded soldering process and arrangement for three-dimensional structures

Multi-chip package system with multiple substrates

Microelectromechanical system package

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Chip package structure

Semiconductor die package including leadframe with die attach pad with folded edge

PACKAGE-ON-PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME BY USING A LEADFRAME

Integrated circuit package system with integral inner lead and paddle

Package-level electromagnetic interference shielding

Electronic device with connection bumps

Semiconductor chip module

Sensor semiconductor package and fabrication

SEMICONDUCTOR DEVICE-BASED SENSORS AND METHODS ASSOCIATED WITH THE SAME

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

RESIN-SEALED SEMICONDUCTOR LIGHT RECEIVING ELEMENT, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING THE SAME

Light emitting diode module and display device having the same

Semiconductor light emitting element

Method to produce reflector with an outer peripheral edge portion of an upper surface uncovered by a reflection film and to produce a lightemitting device using the same reflector

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

Preparation of White Light Emitting Diode Using a Phosphor

LIGHT EMITTING DEVICE

High performance sub-system design and assembly

Imaging device equipped with a last copper and aluminum based interconnection level

Portable memory devices

Electromagnetic bandgap structure and printed circuit board

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Passivation layer for a circuit device and method of manufacture

Environmental protection coating system and method

CONDUCTOR FABRICATION FOR OPTICAL ELEMENT

Method for manufacturing integrated circuit device having antenna conductors

Low Cost Stacked Package

Fabrication method of a semiconductor device

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Die package with asymmetric leadframe connection

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Method for precision assembly of integrated circuit chip packages

Fabrication method of semiconductor package