212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
#1802Semiconductor devices and methods of making the same
#1803Dual-interface IC card
#1804Fingerprint recognition chip packaging structure and packaging method
#1805Method for fabricating an electronic device and a stacked electronic device
#1806Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#1807Semiconductor integrated circuit
#1808Three-dimensional package structure
#1809Fabrication method of packaging substrate
#1810Semiconductor device and method of making a semiconductor device
#1811Semiconductor device and method of controlling warpage in reconstituted wafer
#1812Pad structure design in fan-out package
#1813Package structure and fabricating method thereof
#1814Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate
#1815Semiconductor device
#1816Leadless semiconductor packages, leadframes therefor, and methods of making
#1817Recessed lead leadframe packages
#1818Solenoid inductor
#1819Semiconductor chip package having optical interface
#1820Device for establishing a bonding connection and transducer therefor
#1821Semiconductor device and method of manufacturing the same
#1822Semiconductor device, electronic component, and electronic device
#1823Method for producing a power semiconductor module
#1824Semiconductor package including stepwise stacked chips
#1825Coated bond wires for die packages and methods of manufacturing said coated bond wires
#1826Semiconductor device and leadframe
#1827Semiconductor package with coated bonding wires and fabrication method thereof
#1828On-bonder automatic overhang die optimization tool for wire bonding and related methods
#1829High-frequency modules
#1830Semiconductor device and semiconductor package
#1831Semiconductor packages and methods of forming the same
#1832Semiconductor device and method for producing the same
#1833Clip and related methods
#1834Semiconductor devices with bump allocation
#1835Semiconductor device
#1836Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
#1837Lid structure and semiconductor device package including the same
#1838Leadframe package with pre-applied filler material
#1839Semiconductor chip module and semiconductor package including the same
#1840Radio-frequency isolation using front side opening
#1841DBC structure using a support incorporating a phase change material
#1842Flow passage member and semiconductor module
#1843Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#1844Die attachment for packaged semiconductor device
#1845Semiconductor die connection system and method
#1846Package structure and method for forming same
#1847Semiconductor device
#1848Fault tolerant memory systems and components with interconnected and redundant data interfaces
#1849MEMS grid for manipulating structural parameters of MEMS devices
#1850Semiconductor device and a method of manufacturing the same
#1851Method for fabricating a semiconductor integrated chip
#1852Semiconductor package assemblies with system-on-chip (SOC) packages
#1853Compact semiconductor package and related methods
#1854Method of manufacturing electronic component module and electronic component module
#1855Methods and apparatus for solder connections
#1856Warpage control in package-on-package structures
#1857Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#1858Wireless communication with dielectric medium
#1859Production of optoelectronic components
#1860Laser marking in packages
#1861Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#1862Monolithic microwave integrated circuits
#1863Low cost hybrid high density package
#1864Semiconductor device having terminals directly attachable to circuit board
#1865Cascode semiconductor package and related methods
#1866Power overlay structure and method of making same
#1867Semiconductor device
#1868Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#1869Fingerprint sensing unit and fingerprint sensing module
#1870Assembly structure, method to form assembly structure and method to form close-loop sealant structure
#1871Circuit board structure and method for manufacturing a circuit board structure
#1872Non-volatile memory and devices that use the same
#1873Light emitting diodes, components and related methods
#1874Wafer-level packaging using wire bond wires in place of a redistribution layer
#1875Semiconductor package and method of forming the same
#1876Semiconductor device
#1877Radio frequency integrated circuit module
#1878Semiconductor device packages, packaging methods, and packaged semiconductor devices
#1879Semiconductor package with integrated semiconductor devices and passive component
#1880Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#1881Package structure
#1882Method for manufacturing wire bonding structure, wire bonding structure, and electronic device
#1883Semiconductor device and manufacturing method thereof
#1884Bump structure having a side recess and semiconductor structure including the same
#1885Method for forming fuse pad and bond pad of integrated circuit
#1886Semiconductor device having a conductive via structure
#1887Semiconductor devices and methods of making the same
#1888System and methods for producing modular stacked integrated circuits
#1889Selecting a substrate to be soldered to a carrier
#1890Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel
#1891Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
#1892Packaged device with additive substrate surface modification
#1893Packaged semiconductor device having leadframe features preventing delamination
#1894Circuit device
#1895Scheme for connector site spacing and resulting structures
#1896Semiconductor device
#1897Packaged semiconductor chips having heat dissipation layers and ground contacts therein
#1898Three-dimensional one-time-programmable memory comprising off-die address/data-translator
#1899Apparatus and methods related to conformal coating implemented with surface mount devices
#1900Semiconductor device
#1901Semiconductor device
#1902High speed, efficient SiC power module
#1903Method of assembly semiconductor device with through-package interconnect
#1904Devices and methods of packaging semiconductor devices
#1905Semiconductor package including planar stacked semiconductor chips
#1906Three dimensional integrated circuits stacking approach
#1907Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#1908Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#1909Methods of forming wire interconnect structures
#1910Contactless communication unit connector assemblies with signal directing structures
#1911Semiconductor device and method for manufacturing the same
#1912Stacked die integrated circuit
#1913Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#1914Low pressure sintering powder
#1915Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
#1916Semiconductor device and method for manufacturing the same
#1917Package on-package (PoP) structure including stud bulbs
#1918Electric magnetic shielding structure in packages
#1919Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
#1920Shielded module having compression overmold
#1921Semiconductor device with through-substrate via covered by a solder ball
#1922Semiconductor component and method of manufacture
#1923Semiconductor component and method of manufacture
#1924Resin-encapsulatd semiconductor device and method of manufacturing the same
#1925Method for determining a bonding connection in a component arrangement and test apparatus
#1926LED-based light source utilizing asymmetric conductors
#1927Electronic device module and method of manufacturing the same
#1928Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#1929Method of producing a semiconductor device with through-substrate via covered by a solder ball
#1930Microelectronic assemblies with cavities, and methods of fabrication
#1931Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#1932Semiconductor device
#1933Semiconductor device
#1934Releasable carrier and method
#1935Stacked semiconductor device assembly in computer system
#1936Screening methodology to eliminate wire sweep in bond and assembly module packaging
#1937Solid state imaging apparatus and method of producing the same
#1938Semiconductor device
#1939Lead-free soldering method and soldered article
#1940Semiconductor device with lead terminals having portions thereof extending obliquely
#1941Semiconductor package having an isolation wall to reduce electromagnetic coupling
#1942Optoelectronic component and method of producing an optoelectronic component
#1943Method for manufacturing semiconductor device
#1944Stacked integrated circuits with redistribution lines
#1945Wafer backside interconnect structure connected to TSVs
#1946Bonding device
#1947Bonding device
#1948Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device
#1949Packaging device and method of making the same
#1950Packaging structure, packaging method and template used in packaging method
#1951High voltage device with multi-electrode control
#1952Multilayer semiconductor integrated circuit device
#1953Semiconductor device having recessed edges and method of manufacture
#1954Die package with low electromagnetic interference interconnection
#1955Die packaging with fully or partially fused dielectric leads
#1956Semiconductor package in package
#1957Apparatus, system, and method for wireless connection in integrated circuit packages
#1958Power semiconductor package device having locking mechanism, and preparation method thereof
#1959Heat isolation structures for high bandwidth interconnects
#1960Termination structure for gallium nitride schottky diode
#1961Semiconductor structure and a method of making thereof
#1962Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#1963Semiconductor devices with ball strength improvement
#1964Electronic device with periphery contact pads surrounding central contact pads
#1965Mixed impedance leads for die packages and method of making the same
#1966Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#1967Semiconductor package including substrates spaced by at least one electrical connecting element
#1968Jig for fabricating semiconductor device
#1969Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
#1970Semiconductor chip with redundant thru-silicon-vias
#1971Wire tensioner
#1972Method for producing semiconductor device, and wire-bonding apparatus
#1973Grid array connection device and method
#1974Method of manufacturing wafer level packaging including through encapsulation vias
#1975Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#1976Semiconductor device that transfers an electric signal with a set of inductors
#1977Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#1978Stacked semiconductor device
#1979Radio frequency shielding within a semiconductor package
#1980Resonant circuit including bump pads
#1981Semiconductor-on-insulator with back side heat dissipation
#1982Apparatus for stacked semiconductor packages and methods of fabricating the same
#1983Semiconductor package
#1984Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
#1985Discharge examination device, wire-bonding apparatus, and discharge examination method
#1986Semiconductor package using flip-chip technology
#1987Semiconductor device
#1988Electronic part embedded substrate and method of producing an electronic part embedded substrate
#1989Method of fabricating a chip module with stiffening frame and directional heat spreader
#1990Reversible top/bottom MEMS package
#1991Power module packaging structure and method for manufacturing the same
#1992Display device
#1993Package-on-package structures and methods for forming the same
#1994Semiconductor device having stacked chips
#1995Printed circuit board, method, and semiconductor package
#1996Wire bonding apparatus and method of manufacturing semiconductor device
#1997Method of manufacturing semiconductor device and wire bonding apparatus
#1998Shielded electronic component package
#1999Impedance matching configuration
#2000Power semiconductor module
#2001Semiconductor package and mounting structure thereof
#2002Package for a surface-mount semiconductor device and manufacturing method thereof
#2003Limiting electronic package warpage with semiconductor chip lid and lid-ring
#2004Semiconductor structure having thermal backside core
#2005RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
#2006Power device integration on a common substrate
#2007Semiconductor device, manufacturing method thereof, and electronic apparatus
#2008Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#2009Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#2010Stacked semiconductor die assemblies with support members and associated systems and methods
#2011Mechanisms of forming connectors for package on package
#2012Package-on-package semiconductor assemblies and methods of manufacturing the same
#2013Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
#2014Semiconductor device
#2015Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#2016Semiconductor device
#2017Power semiconductor module
#2018Waterproof electronic device and manufacturing method thereof
#2019Semiconductor devices comprising getter layers and methods of making and using the same
#2020Semiconductor device including at least one element
#2021Methods of packaging semiconductor devices and structures thereof
#2022Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
#2023Electronic component package and method of manufacturing the same
#2024Radio frequency isolation cavity formation using sacrificial material
#2025Semiconductor device
#2026Semiconductor package and fabrication method thereof
#2027Stacked semiconductor die assemblies with die support members and associated systems and methods
#2028Integrated device die and package with stress reduction features
#2029Connecting techniques for stacked CMOS devices
#2030Molding structure for wafer level package
#2031Semiconductor device and method of forming a thin wafer without a carrier
#2032Manufacturing method of a resin molded article
#2033Circuit packages including modules that include at least one integrated circuit
#2034Semiconductor device
#2035Semiconductor device, manufacturing method thereof, and electronic apparatus
#2036Methods of forming conductive and insulating layers
#2037Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology
#2038Ball bonding metal wire bond wires to metal pads
#2039Bonded structures for package and substrate
#2040Reliable device assembly
#2041Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#2042Semiconductor integrated circuit layout structure
#2043Electronic power device with improved cooling
#2044Semiconductor chip package assembly with improved heat dissipation performance
#2045Methods for connecting inter-layer conductors and components in 3D structures
#2046Magneto-resistive chip package including shielding structure
#2047Electronic module comprising fluid cooling channel and method of manufacturing the same
#2048Wiring substrate
#2049Integration of backside heat spreader for thermal management
#2050Semiconductor device
#2051Optical coupling device having a drive circuit on a ground frame to drive a light emitting element on a power frame
#2052Transistor arrangement
#2053Chip package and manufacturing method thereof
#2054Semiconductor package manufacturing method
#2055Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#2056Method of fabricating a lead frame by additive process
#2057Electronic components with integral lead frame and wires
#2058Power semiconductor device
#2059Processes for preparing color stable red-emitting phosphors
#2060Package for light emitting apparatus and light emitting apparatus including the same
#2061MOSFET with reduced resistance
#2062Semiconductor package
#2063Semiconductor package and method for fabricating base for semiconductor package
#2064Method of fabricating semiconductor device having voids between top metal layers of metal interconnects
#2065High-frequency device including high-frequency switching circuit
#2066Support terminal integral with die pad in semiconductor package
#2067High voltage polymer dielectric capacitor isolation device
#2068Power MOSFET and manufacturing method thereof
#2069Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#2070Combined packaged power semiconductor device
#2071Semiconductor device
#2072Wiring board and semiconductor package
#2073Reliable packaging and interconnect structures
#2074Structure and method to minimize warpage of packaged semiconductor devices
#2075Identification circuit and IC chip comprising the same
#2076LED module
#2077Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#2078Semiconductor device
#2079Method and device for controlling operation using temperature deviation in multi-chip package
#2080Semiconductor package
#2081Semiconductor device including a protective film
#2082Cavity package with composite substrate
#2083Power module and method of manufacturing power module
#2084Integrated circuit structure and method of forming
#2085Switching device and electronic circuit
#2086Light emitting device and light emitting module using the same
#2087Three-dimensional vertical memory comprising dice with different interconnect levels
#2088Chip on package structure and method
#2089System-in-package and fabrication method thereof
#2090Stacked package configurations and methods of making the same
#2091Methods for forming semiconductor device packages
#2092Semiconductor packages with pillar and bump structures
#2093Guard structure for signal isolation
#2094Circuit assemblies with multiple interposer substrates, and methods of fabrication
#2095Lead frame, mold and method of manufacturing lead frame with mounted component
#2096Semiconductor package
#2097Metal top stacking package structure and method for manufacturing the same
#2098Semiconductor device packages
#2099Package-on-package semiconductor device
#2100Semiconductor substrate structure, semiconductor package and method of manufacturing the same