Semiconductor chip, flip chip package and wafer level package including the same

Chip package structure and manufacturing method therefor

Glass core substrate for integrated circuit devices and methods of making the same

Bendable and stretchable electronic devices and methods

Current sensor isolation

Semiconductor device and method of manufacturing the same

Cooling channels in 3DIC stacks

Integrated circuit package having wirebonded multi-die stack

Semiconductor device and method of forming PoP semiconductor device with RDL over top package

Integrated circuit package

Tunable composite interposer

Semiconductor package and mobile device using the same

Chip part and method of making the same

Semiconductor device

Lead frames with wettable flanks

Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP

Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module

Adjustable losses of bond wire arrangement

Method of manufacturing connector structures of integrated circuits

Stub minimization for assemblies without wirebonds to package substrate

High-frequency amplifier

Wireless chip and electronic device having wireless chip

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

Semiconductor package assembly

Embedded circuit package

Source down semiconductor devices and methods of formation thereof

Semiconductor device

Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component

Method for package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor image sensor module and method of manufacturing the same

Packaged integrated circuit including a switch-mode regulator and method of forming the same

Power semiconductor module and composite module

Semiconductor structure and manufacturing method thereof

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Apparatus and method for inspecting a semiconductor package

Integrated circuit underfill scheme

Semiconductor device

Switch circuit of cascode type having high speed switching performance

Integrated WLUF and SOD process

Compensation of bondwires in the microwave regime

Leadless electronic packages for GaN devices

Semiconductor dies with recesses, associated leadframes, and associated systems and methods

Electrostatic discharge protection for a balun

Low profile zero/low insertion force package top side flex cable connector architecture

Optoelectronic component and method of producing same

Light-emitting apparatus

Circuit device and method for the production thereof

Power package lid

Semiconductor packages

Noise cancellation for a magnetically coupled communication link utilizing a lead frame

Semiconductor device with an isolation structure coupled to a cover of the semiconductor device

Semiconductor device and manufacturing method of same

Semiconductor modules and methods of forming the same

Chip rotated at an angle mounted on die pad region

Microfluidic delivery member with filter and method of forming same

Amplifier

Magnetically coupled galvanically isolated communication using lead frame

Semiconductor device with power transistors coupled to diodes

Semiconductor packages and methods of forming the same

Multi-die wirebond packages with elongated windows

Semiconductor device and manufacturing method thereof

Laminated chip having microelectronic element embedded therein

Semiconductor chip package having contact pins at short side edges

Packaged semiconductor device having stacked attached chips overhanging the assembly pad

Power semiconductor module

Multiple die stacking for two or more die

Package-on-package type stack package and method for manufacturing the same

Off substrate kinking of bond wire

Method of manufacturing semiconductor package

Semiconductor device

Apparatus and semiconductor structure including a multilayer package substrate

Semiconductor device

Repackaged integrated circuit and assembly method

Multi-die memory device

Photosensitive compositions and applications thereof

Printed circuit board with embedded electronic component and manufacturing method thereof

Module and method for manufacturing the module

High-frequency semiconductor amplifier

Optoelectronic light-emitting component and leadframe assemblage

Offset interposers for large-bottom packages and large-die package-on-package structures

Post-passivation interconnect structure and method of forming same

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Package carrier, semiconductor package, and process for fabricating same

Hybrid bonding with uniform pattern density

Package-on-package assembly with wire bonds to encapsulation surface

Lead portion of semiconductor device

Fingerprint sensor package and method for fabricating the same

Connection pads for a fingerprint sensing device

Semiconductor pressure sensor

High current, low switching loss SiC power module

Integrated semiconductor device and wafer level method of fabricating the same

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same

Semiconductor package and method of manufacturing the same

Semiconductor package with die paddle

Bonding method including adjusting surface contours of a bonding system

Wireless communication link using near field coupling

Semiconductor device

Contoured package-on-package joint

Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Method of manufacturing a semiconductor device including through silicon plugs

Method of fabricating semiconductor package having semiconductor element

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Isolator with reduced susceptibility to parasitic coupling

Semiconductor device and method of manufacturing same

Semiconductor packages and related methods

Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

Stacked chip-on-board module with edge connector

Electronic device having a lead with selectively modified electrical properties

Thermal interface material layer and package-on-package device including the same

Semiconductor module with reinforcing board

Discrete three-dimensional one-time-programmable memory

Three-dimensional one-time-programmable memory comprising off-die read/write-voltage generator

Detecting and driving load using transistor

Semiconductor photomultiplier

Solution for reducing poor contact in info packages

Corrosion-resistant copper bonds to aluminum

Method of forming bump structure having a side recess and semiconductor structure including the same

Methods of manufacturing an integrated circuit having stress tuning layer

Semiconductor device and lead frame having two leads welded together

Environmental hardened packaged integrated circuit

Method for through silicon via structure

Compact semiconductor package and related methods

Semiconductor devices with impedance matching-circuits

EMI/RFI shielding for semiconductor device packages

Power semiconductor package having reduced form factor and increased current carrying capability

Integrated circuit device with plating on lead interconnection point and method of forming the device

Integrated circuit (IC) package with a solder receiving area and associated methods

Integrated circuit device with shaped leads and method of forming the device

Drive mechanism and manufacturing device

DC-DC converter with a switching transistor arranged in an area where an inductor overlaps a substrate

Structure of battery protection circuit module package coupled with holder, and battery pack having same

Semiconductor device and method for manufacturing the semiconductor device

Semiconductor device, method for manufacturing the same, and electronic device

POP structures with dams encircling air gaps and methods for forming the same

Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation

Package apparatus and manufacturing method thereof

Method of packaging integrated circuits

Semiconductor device

Radio frequency isolation structure with racetrack

Packaging devices and methods for semiconductor devices

Semiconductor device

Substrate-less stackable package with wire-bond interconnect

Semiconductor device

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Semiconductor device

Semiconductor package having improved package-on-package interconnection

Semiconductor die and package jigsaw submount

Racetrack layout for radio frequency shielding

Flow sensor package

Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same

High-frequency module

Electronic component housing package and electronic apparatus

Stress reduction apparatus and method

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Method of multi-chip wafer level packaging

Resin package with a groove for an embedded internal lead

Semiconductor device for sensor application using contacts located on top surface and bottom surface and method for fabricating thereof

Organic thin film passivation of metal interconnections

Memory devices with controllers under memory packages and associated systems and methods

Semiconductor package and method of forming the same

Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Integrated matching circuit for a high frequency amplifier

Electrical connection module, semiconductor module and method for producing a semiconductor module

Thin film light emitting diode

Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof

Lead frame-based chip carrier used in the fabrication of MEMS transducer packages

Forming a panel of triple stack semiconductor packages

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

Semiconductor package

Chip using triple pad configuration and packaging method thereof

Scribe seals and methods of making

Semiconductor die arrangement

Method of making a semiconductor device package with dummy gate

Non-planar inductive electrical elements in semiconductor package lead frame

Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

LED having vertical contacts redistributed for flip chip mounting

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Semiconductor package with dual second level electrical interconnections

Semiconductor device and measurement device

Packaged semiconductor device with interior polygonal pads

Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias

Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad

Interconnect structure for wafer level package

Package assembly and method for manufacturing the same

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Methods of forming 3-D circuits with integrated passive devices

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Package on package structure and method for forming the same

Semiconductor device with a plate-shaped lead terminal

Semiconductor system and device

Electrical connections for chip scale packaging

Semiconductor package

Compact multi-die power semiconductor package

Compact single-die power semiconductor package

Electronic device with first and second contact pads and related methods

Semiconductor component having inner and outer semiconductor component housings

Vertically integrated systems

Method for producing a printed circuit, printed circuit obtained by this method and electronic module comprising such a printed circuit

Packaged semiconductor devices and packaging methods thereof

Improving the strength of micro-bump joints

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Using MEMS fabrication incorporating into LED device mounting and assembly

Method of manufacturing a single light-emitting structure

High isolation wideband switch

Electronic devices with semiconductor die coupled to a thermally conductive substrate

Semiconductor packages and modules with integrated ferrite material

Package-on-package structures

Multi-die package with bridge layer and method for making the same

Flexible circuit leads in packaging for radio frequency devices

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Shielded radio-frequency module having reduced area

Integration of backside heat spreader for thermal management

Semiconductor light-emitting device, method for producing same, and display device

Self-aligned floating mirror for contact vias

Power semiconductor devices having a semi-insulating field plate

Metal to metal bonding for stacked (3D) integrated circuits

Stacked semiconductor device assembly

Stackable molded microelectronic packages with area array unit connectors

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Chip mounting

Integrated circuit packages and methods for forming the same

Electronic device module and method of manufacturing the same

Method for manufacturing a resin-encapsulated semiconductor device

Systems and methods for mechanical and electrical package substrate issue mitigation

Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure

BVA interposer

Semiconductor device and method for making the device

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Inter-connection of a lead frame with a passive component intermediate structure

Manufacturing method of power MOSFET using a hard mask as a CMP stop layer between sequential CMP steps

Devices and methods related to metallization of ceramic substrates for shielding applications

Multichip modules and methods of fabrication

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Scheme for connector site spacing and resulting structures

Semiconductor device comprising power elements in juxtaposition order

Integrated circuit package fabrication with die attach paddle having middle channels

Template and pattern forming method

Packaged semiconductor devices and methods of packaging thereof

Method of manufacturing RF power amplifier module, RF power amplifier module, RF module, and base station

Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device

Metal cap apparatus and method

Semiconductor device and structure therefor

Semiconductor manufacturing for forming bond pads and seal rings

Method for manufacturing a chip arrangement

Transformer

Chip on film package and display apparatus having the same

Electronic device, optical module and manufacturing process thereof

Semiconductor module

Light emitting element package having three regions

Low-inductance circuit arrangement comprising load current collecting conductor track

Semiconductor package

Package-on-package structure with organic interposer

Metal pad structure over TSV to reduce shorting of upper metal layer

Method for making a microelectronic assembly having conductive elements

Display drive circuit including an output terminal

Etching agent for copper or copper alloy

Semiconductor device and method of manufacturing the same

Multiple bond via arrays of different wire heights on a same substrate

System and process for fabricating semiconductor packages

Proximity sensor having light-blocking structure in leadframe and method of making same

Multi-chip semiconductor apparatus

Preventing misshaped solder balls

Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure

Integrated circuit stress releasing structure

Power converter package using driver IC

Dual power converter package

Semiconductor device and DC-to-DC converter

Light emitting device and method for manufacturing light emitting device

Semiconductor device including a trench at least partially filled with a conductive material in a semiconductor substrate

Microelectronic package with stacked microelectronic units and method for manufacture thereof

Stacked structure of semiconductor chips having via holes and metal bumps

Power semiconductor package having vertically stacked driver IC

Bump pad structure

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor devices with close-packed via structures having in-plane routing and method of making same

Reconfigurable PoP

Electronic component with a leadframe

Discrete three-dimensional vertical memory

Discrete three-dimensional memory

Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object

Semiconductor chip and method for forming a chip pad

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

Semiconductor die connection system and method

Wafer level flat no-lead semiconductor packages and methods of manufacture

Wire bonding apparatus comprising an oscillator mechanism

SMD, IPD, and/or wire mount in a package