212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
METHOD FOR FORMING BUMP STRUCTURE
#1502Double-encapsulated power semiconductor module and method for producing the same
#1503Embedded semiconductive chips in reconstituted wafers, and systems containing same
#1504Heterojunction semiconductor device having source and drain pads with improved current crowding
#1505Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#1506Package-on-package structure with through molding via
#1507Package-on-package assembly with wire bond vias
#1508Systems and methods for bonding semiconductor elements
#1509Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
#1510FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#1511Integrated circuit packages and methods for forming the same
#1512Semiconductor module
#1513Electronic device
#1514Method and structure of three-dimensional chip stacking
#1515Integrated circuit package assembly
#1516Wedge bonding component
#1517Radio frequency (RF) devices
#1518Semiconductor package
#1519Conductive connections, structures with such connections, and methods of manufacture
#1520Package on-package structure
#1521Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
#1522Package assembly
#1523Semiconductor device and method of forming PoP semiconductor device with RDL over top package
#1524Lead frame and method of fabricating the same
#1525Electronic components with integral lead frame and wires
#1526Semiconductor device and measurement device
#1527Magnetic memory device
#1528Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same
#1529SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH DISPERSIVE OPTICAL UNIT AND ILLUMINATION DEVICE COMPRISING THE SAME
#1530Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#1531Semiconductor device having a junction portion contacting a Schottky metal
#1532Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#1533Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#1534Semiconductor device
#1535Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#1536Mechanisms for forming bonding structures
#1537Semiconductor device including interconnected package on package
#1538Stud bump structure for semiconductor package assemblies
#1539Methods for forming shielded radio-frequency modules having reduced area
#1540Semiconductor package and manufacturing method of the same
#1541Semiconductor component and method of manufacture
#1542Repackaged integrated circuit assembly method
#1543Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#1544PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#1545Mounting structure and method for manufacturing same
#1546Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#1547Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#1548Package-on-package type semiconductor device including fan-out memory package
#1549Packaging mechanisms for dies with different sizes of connectors
#1550Integrated circuit (IC) chip comprising an identification circuit
#1551Light-emitting apparatus
#1552Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#1553Method of producing a semiconductor device with through-substrate via covered by a solder ball
#1554Semiconductor packages and methods of fabrication thereof
#1555Field emission devices and methods of making thereof
#1556Camera module and electronic device
#1557Semiconductor package
#1558Hybrid bonding systems and methods for semiconductor wafers
#1559Ring-frame power package
#1560Circuit board and electronic device provided with same
#1561Low-profile clip with reduced electrical noise
#1562Light emitting device with wavelength converting side coat
#1563Devices and methods related to singulated radio-frequency devices
#1564Semiconductor device including antistatic die attach material
#1565Power module
#1566High reliability housing for a semiconductor package
#1567Half-bridge power semiconductor module and method of manufacturing same
#1568Methods of assembling a flip chip on a locking dual leadframe
#1569Methods of forming wire interconnect structures
#1570Bump on pad (BOP) bonding structure in semiconductor packaged device
#1571Thermal flow meter
#1572Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance
#1573SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICATION METHODS AND SEMICONDUCTOR PACKAGES
#1574Mounting jig for semiconductor device
#1575Electrode structure of optoelectronic device
#1576Method of fabricating a post-passivation interconnect structure
#1577Semiconductor package and fabrication method thereof
#1578Semiconductor device and method of manufacture
#1579Manufacturing method of semiconductor package and manufacturing method of semiconductor device
#1580Packaged semiconductor devices and packaging devices and methods
#1581Methods for Forming Ceramic Substrates with Via Studs
#1582Racetrack layout for radio frequency isolation structure
#1583Ball forming device for wire bonder
#1584Double plated conductive pillar package substrate
#1585Bond pad structure for bonding improvement
#1586Floating die package
#1587CTE compensation for wafer-level and chip-scale packages and assemblies
#1588Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#1589Method of fabricating a circuit module
#1590Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#1591Stacked wafer-level packaging devices
#1592Semiconductor light emitting device
#1593Integrated circuit assembly that includes stacked dice
#1594Chip arrangements
#1595Method for forming interconnect structure
#1596Single layer integrated circuit package
#1597Semiconductor die assemblies with heat sink and associated systems and methods
#1598Power MOSFET
#1599System-in-package module with memory
#1600MEMS grid for manipulating structural parameters of MEMS devices
#1601Reflector markers and systems and methods for identifying and locating them
#1602Stacked semiconductor devices
#1603Thermal dissipation through seal rings in 3DIC structure
#1604Semiconductor device and method for manufacturing the same
#1605Sensor
#1606Optical sensor module and sensor chip thereof
#1607Chip on package structure and method
#1608Locking dual leadframe for flip chip on leadframe packages
#1609Semiconductor device having an inductor
#1610Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#1611Manufacturing method of semiconductor package
#1612Crystal packaging with conductive pillars
#1613Thin film light emitting diode
#16143D semiconductor structure and device
#1615Power module and power conversion apparatus having a warpage suppression portion
#1616Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#1617Computer modules with small thicknesses and associated methods of manufacturing
#1618Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
#1619Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate
#1620Package for an implantable neural stimulation device
#1621Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#1622Embedded chip packages and methods for manufacturing an embedded chip package
#1623Light emitting device package
#1624Method and device for controlling operation using temperature deviation in multi-chip package
#1625Package on package structure and method for forming the same
#1626Alignment mark design for packages
#1627Curable heat radiation composition
#1628Phosphor and light-emitting equipment using phosphor
#1629Electronic component having a reinforced hollowed structure
#1630Light emitting device and method of manufacturing the same
#1631Semiconductor device and method for production of semiconductor device
#1632Image sensing device with cap and related methods
#1633Integrated system and method of making the integrated system
#1634Die stack assembly using an edge separation structure for connectivity through a die of the stack
#1635Package-on-package semiconductor device
#1636Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#1637SYSTEM AND METHOD FOR MANUFACTURING A FABRICATED CARRIER
#1638Resin composition
#1639Semiconductor device using EMC wafer support system and fabricating method thereof
#1640Semiconductor device and method of forming embedded wafer level chip scale packages
#1641Dual lead frame semiconductor package and method of manufacture
#1642Semiconductor device and semiconductor device mounting structure having conductor plates
#1643Bonded structures for package and substrate
#1644Interconnect structure and method of forming same
#1645Leadframe leads having fully plated end faces
#1646Interconnection structure with confinement layer
#1647Spatially selective roughening of encapsulant to promote adhesion with functional structure
#1648CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
#1649Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#1650Printed adhesion deposition to mitigate integrated circuit delamination
#1651EMI/RFI shielding for semiconductor device packages
#1652Stacked chip-on-board module with edge connector
#1653Heat sink for cooling of power semiconductor modules
#1654Chip on film package and display apparatus having the same
#1655Semiconductor device and method of forming MEMS package
#1656Optical sensor device
#1657Light emitting device having vertical structure and package thereof
#1658Imaging apparatus and electronic apparatus
#1659Methods of making semiconductor device packages and related semiconductor device packages
#1660Semiconductor device
#1661Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#1662Integrated circuit package and methods of forming same
#1663Alignment mark design for packages
#1664Semiconductor package having multi-phase power inverter with internal temperature sensor
#1665Method for singulating packaged integrated circuits and resulting structures
#1666Chip capacitor, circuit assembly, and electronic device
#1667Semiconductor package incorporating redistribution layer interposer
#1668Method of manufacturing printed circuit board
#1669Fan-out package structure and method for forming the same
#1670Integrated circuit chip packaging
#1671Integrated circuit chip packaging including a heat sink topped cavity
#1672LED filament and LED light bulb
#1673Semiconductor photomultiplier
#1674Semiconductor device and manufacturing method
#1675Light emitting apparatus, illumination apparatus and display apparatus
#1676Multichip modules and methods of fabrication
#1677POP structures with dams encircling air gaps and methods for forming the same
#1678Integrated clip and lead and method of making a circuit
#1679Methods for making multi-die package with bridge layer
#1680Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#1681Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#1682Carrier, carrier leadframe, and light emitting device
#1683Wire setting apparatus of tabbing apparatus and wire setting method using same
#1684Wire transfer apparatus of tabbing apparatus
#1685Power device on bulk substrate
#1686Power converter monolithically integrating transistors, carrier, and components
#1687Method of controlling bump height variation
#1688Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#1689Capillary jig for wire bonding and method of installing a capillary
#1690Inter-chip alignment
#1691Method for a stacked and bonded semiconductor device
#1692Methods of manufacturing an integrated circuit having stress tuning layer
#1693Hall-effect sensor isolator
#1694Attaching chip attach medium to already encapsulated electronic chip
#1695Electrode terminal, semiconductor device, and power conversion apparatus
#1696Sintering tool for the lower die of a sintering device
#1697Semiconductor devices and methods of manufacture thereof
#1698Power semiconductor device load terminal
#16993D semiconductor device and system
#1700Sensor, filter element comprising a sensor and use of said type of filter element
#1701Sintering tool and method for sintering an electronic subassembly
#1702Electric power conversion apparatus
#1703Semiconductor device reducing parasitic loop inductance of system
#1704Device and method for establishing electric contact between an energy storage cell and a conductor plate structure using a conductor cable
#1705Semiconductor device, manufacturing method thereof, and electronic apparatus
#1706Semiconductor device, manufacturing method thereof, and electronic apparatus
#17073D semiconductor device and structure
#1708Low switching loss high performance power module
#1709Sawing underfill in packaging processes
#1710Semiconductor device
#1711Capillary alignment jig for wire bonder
#1712Light emitting apparatus
#1713Apparatus and associated method
#1714Semiconductor packages having redistribution substrate
#1715Semiconductor device
#1716Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
#1717Methods for forming interconnect assemblies with probed bond pads
#1718Mold release film, process for its production, and process for producing semiconductor package
#1719Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#1720Production method for a detection apparatus and detection apparatuses
#1721Optical module
#1722Wire bonded electronic devices to round wire
#1723Power overlay structure and reconstituted semiconductor wafer having wirebonds
#1724Carrier-free semiconductor package and fabrication method
#1725Method and materials for warpage thermal and interconnect solutions
#1726Directional backlights with light emitting element packages
#1727Power semiconductor device integrated with ESD protection circuit under source pad, drain pad, and/or gate pad
#1728Photonic integrated circuit package
#1729Semiconductor device and portable apparatus using the same
#1730Multi-channel MCM with test circuitry for inter-die bond wire checking
#1731Radio frequency power component and radio frequency signal transceiving device
#1732Package substrate, method for fabricating the same, and package device including the package substrate
#1733Leadless electronic packages for GAN devices
#1734Wire support for a leadframe
#1735Semiconductor package, semiconductor device using the same and manufacturing method thereof
#1736Power semiconductor device
#1737Handler bonding and debonding for semiconductor dies
#1738Printed adhesion deposition to mitigate integrated circuit package delamination
#1739Conductor pad for flexible circuits and flexible circuit incorporating the same
#1740Semiconductor image sensor module and method of manufacturing the same
#1741Method of producing an integrated power transistor circuit having a current-measuring cell
#1742Semiconductor device and method for manufacturing semiconductor device
#1743Microelectronic package with horizontal and vertical interconnections
#17443D semiconductor memory device and structure
#1745Semiconductor module
#1746Semiconductor package
#1747Semiconductor device and semiconductor device manufacturing method
#1748Semiconductor package structure based on cascade circuits
#1749Semiconductor device and method of forming inductor over insulating material filled trench in substrate
#1750Semiconductor package
#1751Power semiconductor arrangement
#1752Structure for die probing
#1753Semiconductor device, electronic control unit and vehicle apparatus
#1754Power semiconductor device including a semiconductor switching element
#1755Flexible electronic system with wire bonds
#1756Wire bond free wafer level LED
#1757Flipped die stacks with multiple rows of leadframe interconnects
#1758Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad
#1759Semiconductor device
#1760Semiconductor device
#1761Semiconductor devices comprising getter layers and methods of making and using the same
#1762Method of fabricating low-profile footed power package
#1763Integrated circuit packages with temperature sensor traces
#1764Semiconductor device and electric power control apparatus
#1765Memory devices with controllers under memory packages and associated systems and methods
#1766Method for producing a bondable coating on a carrier strip
#1767Electronic package having a supporting board and package carrier thereof
#1768Three dimensional device integration method and integrated device
#1769Semiconductor package system and related methods
#1770MEMS grid for manipulating structural parameters of MEMS devices
#1771Automotive electronic device having a cover with fins to reduce gel vibration
#1772Semiconductor light-emitting device, method for producing same, and display device
#1773Capacitor formed on heavily doped substrate
#1774Method of manufacturing a semiconductor device
#1775Edge interconnect packaging of integrated circuits for power systems
#1776Semiconductor device, package, and vehicle
#1777Flat no-lead packages with electroplated edges
#1778Semiconductor device and method for manufacturing semiconductor device
#1779Thermally conductive sheet and semiconductor device
#1780Semiconductor device
#1781Electronic device component with an integral diamond heat spreader
#1782Method for fabricating stack die package
#1783Memory package including buffer, expansion memory module, and multi-module memory system
#1784Half-bridge power semiconductor module and manufacturing method therefor
#1785Stackable molded microelectronic packages
#1786Bonding apparatus and method of estimating position of landing point of bonding tool
#1787Methods of forming connector pad structures, interconnect structures, and structures thereof
#1788Heterojunction semiconductor device for reducing parasitic capacitance
#1789Semiconductor module that have multiple paths for heat dissipation
#1790Compact system with memory and PMU integration
#1791Adhesive film and semiconductor package using adhesive film
#1792Broadband radio frequency power amplifiers, and methods of manufacture thereof
#1793Semiconductor device having polyimide layer
#1794Power electronic switching device comprising a plurality of potential surfaces
#1795Sintering materials and attachment methods using same
#1796Single-package wireless communication device
#1797Multi-die fine grain integrated voltage regulation
#1798Microelectronic package with stacked microelectronic units and method for manufacture thereof
#1799Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#1800Semiconductor chip mounted on a packaging substrate