ESD analysis device and ESD analysis program used for designing semiconductor device and method of designing semiconductor device

LAMP AND A PROCESS FOR PRODUCING A LAMP

Solder ball mounting method and solder ball mounting substrate manufacturing method

Structure and method for improved heat conduction for semiconductor devices

Substrate with lossy material insert

Non-pull back pad package with an additional solder standoff

Method of making multi-chip electronic package with reduced line skew

Method of manufacturing complementary metal oxide semiconductor image sensor

Wafer level method of locating focal plane of imager devices

Method for manufacturing light emitting diode chip and light emitting diode light source module

Technique for forming a passivation layer without a terminal metal

Method of manufacturing printed circuit board

Bonding structure and fabrication thereof

LED module

Light emitting diode package having flexible PCT directly connected to light source

Laminated bond of multilayer circuit board having embedded chips

High-contrast laser mark on substrate surfaces

Base plate for a power semiconductor module

Light source device and liquid crystal display device having the same

Reflective Light Source Device and Manufacture Method Thereof

Variation of Conductive Cross Section and/or Material to Enhance Performance and/or Reduce Material Consumption of Electronic Assemblies

Double inductor loop tag antenna

Variable width writing to a memory of an IC

Power semiconductor device

Resilient carrier assembly for an integrated circuit

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Low fabrication cost, high performance, high reliability chip scale package

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS

Semiconductor device

Solder pillar bumping and a method of making the same

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Bonding structure

Semiconductor device and a method of manufacturing the same

Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Packaging with base layers comprising alloy 42

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Method and apparatus of power ring positioning to minimize crosstalk

Structure of package on package and method for fabricating the same

Insertion-type semiconductor device and fabrication method thereof

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Methods and apparatus for a Quad Flat No-Lead (QFN) package

Die-up integrated circuit package with grounded stiffener

Bondwire utilized for coulomb counting and safety circuits

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor device and a method of manufacturing the same

CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE

Stacked chip packaging with heat sink structure

Semiconductor device and method of manufacturing the same

Semiconductor device, method of manufacturing the same

MULTI-GROUND SHIELDING SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PACKAGE, AND METHOD OF PREVENTING NOISE USING MULTI-GROUND SHIELDING

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Chip package, method of making same and digital camera module using the package

Ultra-thin oxide bonding for S1 to S1 dual orientation bonding

Array quad flat no-lead package and method of forming same

Semiconductor integrated circuit and method for manufacturing the same

SMD diode holding structure and package thereof

LED package structure for increasing light-emitting efficiency and method of packaging the same

Light-emitting devices and related systems

Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package

Integrated heat spreaders for light emitting devices (LEDs) and related assemblies

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Apparatus for delivering shielding gas during wire bonding

Ceramic header method

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

Pressure sensor having improved arrangement of sensor chip for minimizing influence of external vibrations

Method for fabricating a leadframe

Resin composition for semiconductor encapsulation and semiconductor device

Integrated circuit leadless package system

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Flip chip metallization method and devices

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Chip packaging process

Electronic assemblies having a low processing temperature

Sawn power package and method of fabricating same

Method for producing portable memory devices

Stacked die with a recess in a die BGA package

Stacked chip package and method for forming the same

Ball grid array package and method thereof

Low profile ball grid array (BGA) package with exposed die and method of making same

Embedded capacitors for reducing package cracking

Method of treating the surface of copper and copper

Submount assembly and method of preparing optical module

LED lamp device

Method and apparatus for using light emitting diodes for the treatment of biological tissue

Multiple positioned light source to achieve uniform or graded illumination

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Single chip USB packages with swivel cover

Die Infrared Transceiver Bus

Illumination System Comprising a Radiation Source and a Luminescent Material

Light-Emitting Device

Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device

Partial Solder Mask Defined Pad Design

Semiconductor package and fabrication process thereof

Three dimensional device integration method and integrated device

Capacitive semiconductor sensor

Semiconductor mounting substrate and method for manufacturing the same

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

SEMICONDUCTOR DEVICE

Potted integrated circuit device with aluminum case

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Packaging for high power integrated circuits

Cooled Integrated Circuit

Semiconductor module arrangement

Integrated circuit component with passivation layer

Continuously Referencing Signals over Multiple Layers in Laminate Packages

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

Encapsulation type semiconductor device and manufacturing method thereof

Chip package for image sensor and method of manufacturing the same

Single chip USB packages with contact-pins cover

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Leadframe and mold compound interlock in packaged semiconductor device

Semiconductor device with recess portion over pad electrode

Audio Processing Device with Encapsulated Electronic Component

Flip-chip assembly of protected micromechanical devices

N-type group III nitride semiconductor stacked layer structure

LED PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor light emitting device, lighting module, illumination apparatus, surface mount LED, and bullet LED

Imager device with electric connections to electrical device

Light emitting diode device, method of fabrication and use thereof

Light emitting chip package and manufacturing method thereof

Semiconductor Device and Method of Fabricating the Same

Circuit substrate and method

Wire bonding and wire bonding method

Multilayer circuit board and manufacturing method thereof

Interposer, electrical package, and contact structure and fabricating method thereof

Systems and methods for providing two phase cooling

Electronic device handler for a bonding apparatus

SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTRIBUTE

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Terminal pad structures and methods of fabricating same

Composite solder TIM for electronic package

Method for fabricating heat dissipating package structure

Method for Manufacturing Semiconductor Device

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof

Stacked Modules and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Manufacturing device of semiconductor package and manufacturing method of semiconductor package

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Nitride phosphor and production process thereof, and light emitting device

High Power Light Emitting Diode Package

Lighting device having luminescent material between a reflective cup and a solid state light emitter

Substrate with built-in electronic component and method for manufacturing the same

Heat sink assembly

HEAT TRANSFER FOR A HARD-DRIVE WIRE-BOND PRE-AMP

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

White light emitting diode with yellow, green and red light emitting phosphor

Resin substrate and ultrasonic sensor using the same

Substrate with heat-dissipating dummy pattern for semiconductor packages

Bond pad structures and integrated circuit chip having the same

Semiconductor package and method for manufacturing the same

Circuit board assembly

Semiconductor device and method for manufacturing the same

Microelectronic packages and methods therefor

Stacked Modules and Method

Method of fabricating semiconductor package structure

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Substrate and manufacturing method of package structure

Semiconductor device with bonding pad support structure

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Stacked imager package

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Semiconductor device and wire bonding method therefor

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

I/O Architecture for integrated circuit package

SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT

Device having several contact areas

SIP package with small dimension

Stacked modules and method

CHIP PACKAGE STRUCTURE

Package on package and method thereof

Semiconductor integrated circuit device having reduced terminals and I/O area

Micro BGA package having multi-chip stack

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor apparatus

Semiconductor device having recessed connector portions

Semiconductor package having a bridged plate interconnection

Vertical light source package

Semiconductor device package of stacked semiconductor chips with spacers provided therein

Semiconductor package preventing generation of static electricity therein

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Materials, structures and methods for microelectronic packaging

Integrated Circuit with Back Side Conductive Paths

Chip package and chip packaging method

Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same

Semiconductor device and method for producing the same

Light emitting diode package

Light emitting device having a plurality of light emitting cells and package mounting the same

OPTICAL COUPLING TYPE SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING OPTICAL COUPLING TYPE SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Integrated-type LED and manufacturing method thereof

High-heat-resistant semiconductor device

Compound semiconductor element resistible to high voltage

Bumping electronic components using transfer substrates

Sensor system

Memory management method and system

Package for an implantable neural stimulation device

Method of providing solder bumps on a substrate using localized heating

OPTICAL COMMUNICATION LENS AND TUBE BODY CONSTITUTING OPTICAL ELEMENT MODULE

Film type package for fingerprint sensor

High power diode laser having multiple emitters and method for its production

3D chip arrangement including memory manager

Light emitting device package and manufacture method of light emitting device package

OPTICAL ELEMENT FOR A LIGHT-EMITTING DIODE, LED ARRANGEMENT AND METHOD FOR PRODUCING AN LED ARRANGEMENT

Lighting device and lighting method

Microbump function assignment in a buck converter

ELECTRONIC APPARATUS

Conductive heat transport cooling system and method for a multi-component electronics system

Semiconductor device and an information management system therefor

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE

Method for producing a semiconductor component and substrate for carrying out the method

Gold-Tin Solder Joints Having Reduced Embrittlement

Bonding and probing pad structures

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

Wiring board

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Thermally Enhanced BGA Packages and Methods

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device

Edge connect wafer level stacking

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Light-emitting device

Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these

Microelectronic component assemblies and microelectronic component lead frame structures

Electronic device and lead frame

Wafer level chip scale package of image sensor and manufacturing method thereof

Semiconductor image sensor die and production method thereof, semiconductor image sensor module, image sensor device, optical device element, and optical device module

Package structure of MEMS microphone

Light emitting device

AC/DC light emitting diodes with integrated protection mechanism

SEMICONDUCTOR DEVICE

Moveable arm assembly for a wire bonder

Combination wedge bonding and ball bonding transducer

HYBRID BONDED FLEX CIRCUIT

Dual layer dielectric stack for microelectronics having thick metal lines

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUFACTURING METHOD THEREOF

Methods of forming a single layer substrate for high capacity memory cards

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins

Manufacturing Method of Semiconductor Apparatus

Wafer level package structure of optical-electronic device and method for making the same

Wiring board and semiconductor device

Electronic device including a nickel-palladium alloy layer

Electronic device and method of manufacturing the same

Oxynitride Phosphor and Light-Emitting Device

Lighting systems using light active sheet material with integrated leadframe, and methods for manufacturing the same

Light source having LED and frame structure

LED lighting apparatus with transparent flexible circuit structure

Illuminated devices utilizing light active sheet material with integrated light emitting diode (LED), methods of producing illuminated devices, and kits therefor

Memory card and method of manufacturing the same

Electrical Circuit Package

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

LIGHT EMITTING APPARATUS

Method of making a light emitting device having a molded encapsulant

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

LAYER FOR CHIP CONTACT ELEMENT

Substrate slot design for die stack packaging

Integrated circuit package system with pad to pad bonding

Semiconductor element comprising a supporting structure and production method

Managing forces of semiconductor device layers

Electronic device and method of manufacturing the same

Electronic device and method of manufacturing the same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Focused stress relief using reinforcing elements

Electronic device and method of manufacturing the same

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Die arrangement and method for producing a die arrangement

Circuit board arrangement and method for producing a circuit board arrangement

PACKAGE FOR MIXED SIGNAL MCU WITH MINIMAL PIN COUNT

Embedded array capacitor with side terminals

Semiconductor-embedded substrate and manufacturing method thereof

Power semiconductor arrangement

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Micro-via structure design for high performance integrated circuits

Semiconductor device