CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Stack type semiconductor device package

Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Pin Array No Lead Package and Assembly Method Thereof

Plastic surface mount large area power device

INTERDIGITATED LEADFINGERS

Reworkable passive element embedded printed circuit board

Process of forming an electronic device including an inductor

Sensor-type package and fabrication method thereof

Fingerprint Sensor and Interconnect

Arrangement for cooling a power semiconductor module

Light emitting diode package structure

Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal

Method of uniform phosphor chip coating and LED package fabricated using method

Illuminated devices utilizing transparent light active sheet material with integrated light emitting diode (LED), and methods and kit therefor

CHIP STRUCTURE

Method of assembling carbon nanotube reinforced solder caps

Manufacturing method and manufacturing apparatus of printed wiring board

Device mounting board and semiconductor module

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

Pressure sensor package structure

Copper bonding or superfine wire with improved bonding and corrosion properties

Method of manufacturing semiconductor device

Method of forming metal lines and bumps for semiconductor devices

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Method of making a semiconductor package and method of making a semiconductor device

Manufacturing method of semiconductor device

Lead frame routed chip pads for semiconductor packages

Method for fabrication of group III nitride semiconductor

Wire Bump Material

DIGITAL CAMERA MODULE AND ASSEMBLING METHOD WITH SAME

Structure and method for optical connection between optical transmitter and optical receiver

Optical interconnect device and method for manufacturing the same

Structure and manufacturing method of inversed microphone module and microphone chip component

SEMICONDUCTOR MEMORY DEVICE

Compact high-intensty LED-based light source and method for making the same

Circuit arrangement

Elimination of RDL using tape base flip chip on flex for die stacking

Electronic controller

LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof

Method of making a light emitting device

Methods of connecting an antenna to a transponder chip

Semiconductor device and manufacturing method thereof

Electronic device and method for production

Wire pad of semiconductor device

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Semiconductor device and method of manufacturing the same

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Integrated circuit package system for chip on lead

Semiconductor device and method for manufacturing the same

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Multiple integrated circuit die package with thermal performance

Sintered metallic thermal interface materials for microelectronic cooling assemblies

Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies

CHIP PACKAGE AND CHIP PACKAGE ARRAY

ELECTRONIC DEVICE AND PRODUCTION METHOD

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and semiconductor system in package using the same

Integrated circuit package system with stacked die

Semiconductor package and semiconductor device

Electronic component device

Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device package

Semiconductor package and stacked semiconductor package

Semiconductor package with inner leads exposed from an encapsulant

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

Module with a shielding and/or heat dissipating element

Electromagnetic shielding using through-silicon vias

Stacked imager package

Methods and materials useful for chip stacking, chip and wafer bonding

Light-receiving diode

Semiconductor device

Modified gold-tin system with increased melting temperature for wafer bonding

Semiconductor device and method of fabricating the same

Method of manufacturing high power light-emitting device package and structure thereof

Memory card

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

Deep access large ribbon bond head

Multi-part capillary

Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface

Interposer and method for manufacturing the same

Variable depth microchannels

Method of forming an inlay substrate having an antenna wire

Illuminated electric toothbrushes and methods of use

Semiconductor device and manufacturing method thereof

Method for fabricating resin-molded semiconductor device having posts with bumps

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

LED including photonic crystal structure

Optical semiconductor device and method of manufacturing thereof

Removing dry film resist residues using hydrolyzable membranes

Set of resin compositions for preparing system-in-package type semiconductor device

Circuit module with interposer and method for manufacturing the same

Optical device and method for making the same

Semiconductor light-emitting device with improved heatsinking

Phosphor-based LED apparatus with UV reflector

Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Programmable system in package

Light emitting device

LIGHT EMITTING MODULE

Semiconductor apparatus and method of producing the same

Integrated circuit package system with encapsulation lock

Method and apparatus for prevention of solder corrosion

Semiconductor assembly with component attached on die back side

Pad over active circuit system and method with meshed support structure

Bonding pad for contacting a device

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Electrical interconnection structure formation

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Via structure

Modularized Die Stacking System and Method

Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same

Semiconductor device package with groove

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Stacked die semiconductor device having circuit tape

Integrated circuit devices with multi-dimensional pad structures

Stacked multi-chip package with EMI shielding

Electronic component package and electronic component device

Reduction in thickness of semiconductor component on substrate

METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR

Electronic component package with EMI shielding

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW

Microelectronic component assemblies and microelectronic component lead frame structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

Package semiconductor and fabrication method thereof

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Simultaneous bidirectional cable interface

Chip-mounted film package

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Semiconductor device

Image display device and light emission device

Light emitting device

Flexible circuit light-emitting structures

Flexible circuits having improved reliability and thermal dissipation

Electronic packages with fine particle wetting and non-wetting zones

Radiation imaging device and radiation imaging method

Image sensor package structure and method for manufacturing the same

Method of forming metal and metal alloy features

Printed circuit board for package and manufacturing method thereof

Process for manufacturing semiconductor devices

Process of fabricating a semiconductor package

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Flip chip packaging method that protects the sensing area of an image sensor from contamination

Method for manufacturing semiconductor device

Methods using die attach paddle for mounting integrated circuit die

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby

Semiconductor device having curved leads offset from the center of bonding pads

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Perimeter matrix ball grid array circuit package with a populated center

LIGHT EMITTING APPARATUS AND METHOD FOR THE SAME

GNSS receiver package

Semiconductor device having a plurality of memory chips

Light efficient LED assembly including a shaped reflective cavity and method for making same

LED module

Vapor heat spreader

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

Pad over active circuit system and method with frame support structure

Configurable IC with logic resources with offset connections

Semiconductor package and fabrication method thereof

Bonding wire and bond using a bonding wire

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Copper alloy bonding wire for semiconductor device

Packaging board, semiconductor module, and portable apparatus

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor module

Methods for packaging and sealing an integrated circuit die

Semiconductor apparatus

Method for producing a circuit module comprising at least one integrated circuit

Stacked chip package structure with leadframe having bus bar

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Mounting structure for IC tag and IC chip for mounting

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Semiconductor component having a semiconductor die and a leadframe

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

Micro electro-mechanical system module package

INTEGRATED CIRCUIT PACKAGE

Semiconductor device package and manufacturing method

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Shielding noisy conductors in integrated passive devices

Electronic circuit package and fabricating method thereof

Packaged stacked semiconductor device and method for manufacturing the same

Stacked dual MOSFET package

PHOTOSENSITIVE CHIP MOLDING PACKAGE

PHOTO-SENSITIVE CHIP MODULE PACKAGE

Semiconductor device

Semiconductor device having circuit blocks in a single crystal layer, and bumps on certain blocks

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

LIGHT EMITTING DEVICE WITH HIGH HEAT-DISSIPATING CAPABILITY

PHOTOSENSITIVE CHIP PACKAGE

Underfill for light emitting device

Method of fabricating light emitting device and thus-fabricated light emitting device

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER

Package for an implantable neural stimulation device

Circuit-connecting material and circuit terminal connected structure and connecting method

CHIP LOCATION IDENTIFICATION

Method for manufacturing SIP semiconductor device

Flexible core for enhancement of package interconnect reliablity

Method of manufacturing a combined multilayer circuit board having embedded chips

Method of manufacturing a semiconductor device

Map type semiconductor package

Microelectronic devices and methods for manufacturing microelectronic devices

Redistribution layers for microfeature workpieces, and associated systems and methods

Method for manufacturing a white LED

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET

Semiconductor laser device

Three-Dimensional Memory Module (3D-MM) Excelling Contemporary Micro-Drive (CMD)

Illumination apparatus having a plurality of semiconductor light-emitting devices

Lead pin for mounting semiconductor and printed wiring board

Electronic part module and method of making the same

Component embedded printed circuit board

IMAGE SENSOR PACKAGE, RELATED METHOD OF MANUFACTURE AND IMAGE SENSOR MODULE

CHIP FILM PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

Compact impedance transformation circuit

Semiconductor memory device and semiconductor device

Optical coupling element and electronic device

High temperature operating package and circuit design

IC package with a protective encapsulant and a stiffening encapsulant

Stacking integrated circuit dies

Semiconductor device, relay chip, and method for producing relay chip

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same

Semiconductor device and method of producing the same

Semiconductor device and fabricating method thereof

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Structure of wafer level package with area bump

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

Method for implementing component placement suspended within grid array packages for enhanced electrical performance

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

MULTI-CHIP ASSEMBLY

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME

Flexible core for enhancement of package interconnect reliability

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

Wire bonding method, wire bonding apparatus and semiconductor device

POP package and method of fabricating the same

Stacked die packages

Multi-chip package with spacer for blocking interchip heat transfer

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Embedded package in package

Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers

Stacked-die electronics package with planar and three-dimensional inductor elements

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Semiconductor package and method therefor

Semiconductor device

Integrated circuit package system with interlock

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

Semiconductor package

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

Semiconductor die package including stacked dice and heat sink structures

Semiconductor device and method of manufacturing same

POWER MODULE WITH LAMINAR INTERCONNECT

Light emitting device and the manufacture method thereof

Semiconductor light emitting device

Light emitting device packages, light emitting diode (LED) packages and related methods

Light emitting device and manufacturing method thereof

Encapsulant profile for light emitting diodes

Phosphor position in light emitting diodes

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Circuit-connecting material and circuit terminal connected structure and connecting method

Optical encoder having lens integrally molded with housing

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wire bonders and methods of wire-bonding

STRIP LINE DEVICE, PRINTED WIRING BOARD MOUNTING MEMBER, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FORMING SAME

Printed wiring board

Microstructured sensor

Method of manufacturing a component-embedded printed circuit board

Camera module and assembling process thereof

Top layers of metal for high performance IC's