Semiconductor light emitting device

Piezoelectric vibrator and method of fabricating piezoelectric vibrator, and oscillator, electric apparatus, and radio wave timepiece having piezoelectric vibrator

Epoxy resin composition for encapsulating semiconductor and semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Resin-sealed electronic device and method of manufacturing the same

Wire bond integrated circuit package for high speed I/O

Semiconductor device including microstrip line and coplanar line

Semiconductor package and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Interconnects with Direct Metalization and Conductive Polymer

Microcircuit package having ductile layer

Semiconductor device and manufacturing method thereof

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Semiconductor chip and TAB package having the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Heat spreader for a multi-chip package

Wafer applied thermal-mechanical interface

Support body for semiconductor element, method for manufacturing the same and semiconductor device

Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

System-in-package (SiP) and method of manufacturing the same

Semiconductor device having elastic solder bump to prevent disconnection

Substrate for a flexible microelectronic assembly and a method of fabricating thereof

Stress decoupling structures for flip-chip assembly

Stacked die package

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Chip on leads

Semiconductor device and printed circuit board

Semiconductor chip and method of producing the same

Embedded array capacitor with top and bottom exterior surface metallization

Method for mounting semiconductor chips, and corresponding semiconductor chip system

Sensor module and method of manufacturing same

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Leadframe, semiconductor package and support lead for bonding with groundwires

Illumination device with semiconductor light-emitting elements

Side-emitting LED package and manufacturing method of the same

Thin film light emitting diode

Light emitting device and high refractive index layer

Transparent mirrorless light emitting diode

Textured phosphor conversion layer light emitting diode

Light emitting device having a mirror portion

Low thermal resistance high power LED

Light emitting device

Light emitting diode package and backlight unit having the same

Low side emitting light source and method of making the same

Metal silicate halide phosphors and LED lighting devices using the same

Flip-chip mounting resin composition and bump forming resin composition

Phosphor composition and method for producing the same, and light-emitting device using the same

Fluxless reflow process for bump formation

Amplified flow through pressure sensor

Component mounting apparatus and component mounting method

Compact chip package macromodels for chip-package simulation

Method for decapsulating package

Stacked structures and methods of fabricating stacked structures

Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device

Method and apparatus for linear die transfer

Reduction of damage to thermal interface material due to asymmetrical load

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Packaging substrate and manufacturing method thereof

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

Multilayer wiring board and its manufacturing method

Tb-DOPED LUMINESCENT COMPOUND, LUMINESCENT COMPOSITION AND LUMINESCENT BODY CONTAINING THE SAME, LIGHT EMITTING DEVICE AND SOLID-STATE LASER DEVICE

Semiconductor memory device having improved voltage transmission path and driving method thereof

Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the same

Solar-powered illuminator

White light emitting phosphor and light emitting module using the same

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Slim design main board

Circuit Device and Manufacturing Method of the Same

Optical Coupler

ELECTRODE, DEVICE AND ELECTRONIC APPARATUS HAVING THE DEVICE

PATTERN FORMING METHOD AND CIRCUIT BOARD

Patterning method, droplet discharging device and circuit board

Low cost chip package with integrated RFantenna

Radio frequency identification (RFID) tag and manufacturing method thereof

Light-emitting device and manufacturing method thereof

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES

Silica nanoparticles thermoset resin compositions

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Rotation joint and semiconductor device having the same

STRUCTURE FOR PREVENTING PAD PEELING AND METHOD OF FABRICATING THE SAME

Bond pad design to minimize dielectric cracking

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

Semiconductor device with no base member and method of manufacturing the same

Solder bump structure and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Flip-chip assembly and method of manufacturing the same

Semiconductor module and method of manufacturing the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

Semiconductor die with reduced bump-to-pad ratio

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Chip and manufacturing method and application thereof

Semiconductor module with at least two substrates

Balanced semiconductor device packages including lead frame with floating leads and associated methods

Heat dissipating semiconductor package and fabrication method therefor

Thermally enhanced semiconductor package

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE

STACKED CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Partially stacked semiconductor devices

Semiconductor device package

Module comprising polymer-containing electrical connecting element

Semiconductor Device And Production Method For Semiconductor Device

Leadframe finger design to ensure lead-locking for enhanced fatigue life of bonding wire in an overmolded package

Stamped leadframe and method of manufacture thereof

Collective and synergistic MRAM shields

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

APPARATUS FOR MANUFACTURING GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP

Light emitting diode package with large viewing angle

Leadframe-based packages for solid state emitting devices

Flip-chip packaging structure for light emitting diode and method thereof

Wavelength-Converted Semiconductor Light Emitting Device

HIGH LIGHT EXTRACTION EFFICIENCY SPHERE LED

Semiconductor device and display device having alignment mark

OPTICAL PREFORMS FOR SOLID STATE LIGHT EMITTING DICE, AND METHODS AND SYSTEMS FOR FABRICATING AND ASSEMBLING SAME

METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, LIGHTSOURCE CELL UNIT, LIGHT-EMITTING DIODE BACKLIGHT, LIGHT-EMITTING DIODE ILLUMINATING DEVICE, LIGHT-EMITTING DIODE DISPLAY, AND ELECTRONIC APPARATUS

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

Flanged transducer having improved rigidity

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

Solder ball loading method

Stacked Modules and Method

Spread spectrum isolator

Circuit device

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Method of making a contact on a backside of a die

Use of palladium in IC manufacturing with conductive polymer bump

Wire and solder bond forming methods

Wire and solder bond forming methods

WAFER SCALE THIN FILM PACKAGE

Method and apparatus for reducing stresses applied to bonded interconnects between substrates

Optical module

Control of stray light in camera systems employing an optics stack and associated methods

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Liquid crystal display apparatus

LED lamp for light source and method

Light source utilizing a flexible circuit carrier and flexible reflectors

Electronic component and method for manufacturing the same

Combination assembly of LED and liquid-vapor thermally dissipating device

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Information handling system utilizing circuitized substrate with split conductive layer

Light source using large area LEDs

Filter having impedance matching circuits

Embedding memory within tile arrangement of an integrated circuit

Magnetic sensor for input devices

Acoustic wave device

Method of Manufacturing a Ignition Device and a Semiconductor Device

Semiconductor device and method for manufacturing same

Semiconductor device

CONDUCTOR POLYMER COMPOSITE CARRIER WITH ISOPROPERTY CONDUCTIVE COLUMNS

Methods for manufacturing thermally enhanced flip-chip ball grid arrays

MULTI-CHIP STRUCTURE

Post passivation interconnection schemes on top of the IC chips

Semiconductor package and fabrication method thereof

BGA package with encapsulation on bottom of substrate

Heatplates for heatsink attachment for semiconductor chips

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Electronic component and method for manufacturing the same

Semiconductor package having structure for warpage prevention

Chip carrier film having leads with improved strength and semiconductor package utilizing the film

Method of packaging a device having a tangible element and device thereof

Semiconductor device, stacked semiconductor device and interposer substrate

Semiconductor package having improved heat spreading performance

Package structure having through hole in spacer thereof

Package structure of memory card and manufacturing method thereof

Wirebond Package Design for High Speed Data Rates

Method for producing a laser diode component, housing for a laser diode component, and laser diode component itself

Integrated battery pack with lead frame connection

WIRE BOND AND METHOD OF FORMING SAME

IC package keeping attachment level of leads on chip during molding process

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Packaged semiconductor chips

CMOS imager array with recessed dielectric

Substrate contact for a MEMS device

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME

Process for producing group III nitride compound semiconductor light emitting device, group III nitride compound semiconductor light emitting device and lamp

Semiconductor light emitting device

High-powered diode holder and a package thereof

IMAGE INPUT DEVICE

System and method for solder bump plating

Solder joint reliability in microelectronic packaging

Manufacturing process of the combining of optical lens and sensor chips

Method of manufacturing a memory card

ELECTRONIC DEVICE

Film and chip packaging process using the same

Method of making multi-chip package with high-speed serial communications between semiconductor dice

Laser lift-off of sapphire from a nitride flip-chip

Method of chip manufacturing

Method for manufacturing electronic component, and electronic component

Systems and arrangements to assess thermal performance

Power converter unit

Solid-state light source

Radiation-shielded semiconductor assembly

Module with carrier element

Electric Power Module

Memory module and memory device

Semiconductor integrated circuit and multi-chip module

PATTERN FILM, METHOD OF MANUFACTURING THE PATTERN FILM, AND PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE PATTERN FILM

Low loop height ball bonding method and apparatus

METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED CIRCUIT AND A WINDING ASSEMBLY

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor device and method for manufacturing same

Flip chip and wire bond semiconductor package

Electronic device and method of fabricating the same

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTECTING BONDABLE METAL CONTACTS AND IMPROVING MOLD COMPOUND ADHESION

Integrated circuit chips with fine-line metal and over-passivation metal

Semiconductor package with embedded die

Semiconductor package

Integration using package stacking with multi-layer organic substrates

Semiconductor device package

Multi stack package and method of fabricating the same

Bridge stack integrated circuit package system

Radiation hardened lateral MOSFET structure

Electronic assembly and circuit board

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Integrated circuit package system with encapsulation lock

Integrated circuit package system with heat sink

Component arrangement comprising a carrier

Integrated circuit package system

Through-wafer interconnects for photoimager and memory wafers

Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner

Replaceable through-hole high flux LED lamp

Light-emitting diode chip package body and packaging method thereof

Standing transparent mirrorless light emitting diode

Semiconductor light emitting device and method of manufacturing it

Light-emitting diode

Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus

Method of making circuitized substrate with solder paste connections

Method of sealing or welding two elements to one another

Device for controlling a vehicle

Method for fabricating semiconductor package free of substrate

METHOD FOR ATTACHING INTEGRATED CIRCUIT COMPONENT TO A SUBSTRATE

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method for producing color-converting light-emitting device using electrophoresis

Light-emitting diode chip package body and packaging method thereof

METHOD FOR FABRICATING LED LAMP AND HIGH-OUTPUT LED FABRICATED BY USING THE METHOD

Multilayered printed wiring board with a multilayered core substrate

Semiconductor Laser Apparatus, Method for Manufacturing the Same, and Optical Pickup Apparatus Using the Same

Light source unit, backlight unit and liquid crystal display including the same, and method thereof

Light emitting module and display device having the same

Wiring board and method of manufacturing the same

Circuit device and method of manufacturing the same

Ball grid array resonator

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

White LED, backlight using same and liquid crystal display

Phosphor and method for producing same, and light-emitting device using same and method for manufacturing such device

Power module and motor integrated control unit

Electrical component having external contacting

SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP

Electronic Device, a Chip Contacting Method and a Contacting Device

Component stacking for integrated circuit electronic package

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Gold wire for connecting semiconductor chip

Package structure and package substrate thereof

Semiconductor assembly with one metal layer after base metal removal

Semiconductor device and manufacturing method of the same

Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

Semiconductor module including components in plastic casing

Stacked integrated circuit package-in-package system

Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Semiconductor device and manufacturing method of the same

Thin, thermally enhanced flip chip in a leaded molded package

Semiconductor element and process of manufacturing semiconductor element

Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Sensor-type semiconductor package and fabrication

Coated package with filter profile

Micromachine Device

Semiconductor chip, semiconductor device and methods for producing the same

Power semiconductor module

Semiconductor device

Light-emitting diode chip package body and packaging method thereof

Light-emitting diode chip package body and packaging method thereof

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Semiconductor component emitting electromagnetic radiation and component housing

Light-emitting device

PRINTED CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR DEVICE PACKAGE, AND METHOD OF TESTING AND FABRICATING SEMICONDUCTOR DEVICE PACKAGE USING THE SAME

Solder ball mounting method and solder ball mounting apparatus

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Electronic component and wire bonding method