Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Semiconductor component with plastic housing, and process for producing the same

Low fabrication cost, fine pitch and high reliability solder bump

Methods for attaching microfeature dies to external devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Methods for a multiple die integrated circuit package

Method for producing semiconductor device

Semiconductor Light Emitting Element and Method for Manufacturing the Same

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Au Alloy Bonding Wire

Semiconductor laser device which is capable of stably emitting short-wavelength laser light

High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver

Light-receiving element, optical head using the same, and optical recording/reproducing apparatus using the same

Semiconductor integrated circuit device including semiconductor integrated circuit board supplied with no high voltage

Power converter

Electric power converter

Multilayer printed wiring board

Multilayered printed wiring board

PRINTED CIRCUIT BOARD HAVING SUPPORTING PATTERNS

Lighting device

Semiconductor device

LED source with hollow collection lens

HIGH PERFORMANCE IC PACKAGE AND METHOD

Thin flip-chip method

Multi-chip module

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Top layers of metal for high performance IC's

Semiconductor device and fabricating method thereof

Stacked structure of chips and water structure for making the same

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device having pads

Electric component with a flip-chip construction

Packaged microdevices and methods for manufacturing packaged microdevices

Electronic Device and Package Used for the Same

Semiconductor package and method for manufacturing the same

Semiconductor device, substrate for producing semiconductor device and method of producing them

Metal core foldover package structures

Stackable packages for three-dimensional packaging of semiconductor dice

Module and mounted structure using the same

Semiconductive device having improved copper density for package-on-package applications

Systems and methods for low profile die package

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Method and flip chip structure for power devices

Image sensor

Optical semiconductor device and method for making the same

Semiconductor light-emitting element assembly

Light emitting apparatus with an opening part, manufacturing method thereof, and light unit

Light emitting diode package employing lead terminal with reflecting surface

LED with phosphor tile and overmolded phosphor in lens

Light emitting device and method of making the device

Omni-directional LED light source

Surface mounted infrared image detector systems and associated methods

Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip

Method for step-down transition of a solder head in the injection molding soldering process

WIRE BONDER

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Lead frame magazine cover

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Apparatus and method for bonding anisotropic conductive film using laser beam

Acceleration sensor chip package and method of producing the same

Process of forming a laminate ceramic circuit board

Planar array contact memory cards

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device and method for manufacturing same

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

Packaged integrated circuit having gold removed from a lead frame

Semiconductor package and method of manufacturing the same

Manufacturing method for resin sealed semiconductor device

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Semiconductor die package using leadframe and clip and method of manufacturing

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Methods of forming semiconductor light emitting device packages by liquid injection molding

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Surface-emission laser diode operable in the wavelength band of 1.1-1.7 micrometers and optical telecommunication system using such a laser diode

VCSEL with improved high frequency characteristics, semiconductor laser device, module, and optical transmission device

High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver

Light emitting module, lighting device, and display device

Chip carrier and fabrication method

Semiconductor package having laser-embedded terminals

Wiring Board for Light-Emitting Element

Monolithic capacitor, circuit board, and circuit module

High frequency line-to-waveguide converter and high frequency package

IMAGE DISPLAY DEVICE AND LIGHT EMISSION DEVICE

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Bond pad for wafer and package for CMOS imager

Semiconductor chip structure

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Substrate structure having N-SMD ball pads

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

REINFORCED SEMICONDUCTOR PACKAGE AND STIFFENER THEREOF

Plastic overmolded packages with mechanically decoupled lid attach attachment

MICRO-ELECTROMECHANICAL SYSTEMS DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Chip package structure and circuit board thereof

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor device and manufacturing method of the same

Stack type ball grid array package and method for manufacturing the same

Stackable ceramic FBGA for high thermal applications

Stackable semiconductor package

Stack microelectronic assemblies

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

Integrated circuit including clip

Integrated circuit package system with waferscale spacer

Transmission/reception semiconductor device with memory element and antenna on same side of conductive adhesive

Power semiconductor component

SURFACE MOUNT LIGHT EMITTING DIODE PACKAGE

Semiconductor light-emitting device and light-emitting display therewith

High power light emitting diode package and method of producing the same

Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device

High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver

Physical quantity detection device with pixel array column-aligned terminals and method of driving same

Method and system for depositing alloy composition

Apparatus, system and method for use in mounting electronic elements

Diamond heat sink

Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

Semiconductor element and manufacturing method thereof

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

Interconnect for improved die to substrate electrical coupling

Physical quantity sensor, lead frame, and manufacturing method therefor

Apparatus for manufacturing semiconductor device

Method of manufacturing semiconductor device

Multipath soldered thermal interface between a chip and its heat sink

Process for packaging components, and packaged components

Light emitting diode package and fabrication method thereof

LED of side view type and the method for manufacturing the same

Component arrangement provided with a carrier substrate

Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules

Microphone module and method for fabricating the same

Light unit display

Light emitting device

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Circuit board and chassis

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

Light-receiving element, optical head using the same, and optical recording/reproducing apparatus using the same

Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices

Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device

Solder elements with columnar structures and methods of making the same

Method for producing a component and device having a component

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Functional device-mounted module and a method for mounting functional device-mounted module

Semiconductor apparatus having improved thermal fatigue life

Semiconductor device and method for manufacturing the same

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Laser release process for very thin Si-carrier build

Semiconductor device and method of manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Interconnection structure of integrated circuit chip

CHIP PACKAGE

WIREBOND-LESS SEMICONDUCTOR PACKAGE

Package structure and heat sink module thereof

High density electronic packages

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Multi-chip structure

Integrated chip carrier with compliant interconnect

Semiconductor chip packages and assemblies with chip carrier units

Method for producing a module with components stacked one above another

Package substrate

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Packaging system for semiconductor devices

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Integrated circuit package system with supported stacked die

Quad flat package

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Process for precision placement of integrated circuit overcoat material

PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME

Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

Image sensor package

Light emitting diode package

Surface Mount Light Emitting Chip Package

Device chip carriers, modules, and methods of forming thereof

Light emitting device package and method for manufacturing the same

THERMALLY COUPLED LIGHT SOURCE FOR AN IMAGE PROJECTION SYSTEM

Surface mountable chip

Proximity payment card with user-actuated switch and methods of making the card

Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Acceleration sensor

MULTI-RANGE THREE-AXIS ACCELERATION SENSOR DEVICE

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

Mold compound cap in a flip chip multi-matrix array package and process of making same

Semiconductor device and method of manufacturing same

Structure and method of making sealed capped chips

Integrated circuit package system with down-set die pad and method of manufacture thereof

Reliability enhancement process

Chip scale package and method for manufacturing the same

METHOD OF PROVIDING INVERTED PYRAMID MULTI-DIE PACKAGE REDUCING WIRE SWEEP AND WEAKENING TORQUES

Method for fabricating chip-stacked semiconductor package

Method of fabricating a stacked die having a recess in a die BGA package

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Light emitting device, method of making the same, and light source device comprising the same

Optoelectronic module

Multiplexed RF isolator

Light emitting apparatus

High capacity thin module system and method

High capacity thin module system and method

Multi-layered printed circuit board

Power semiconductor device

BI-CURVATURE LENS FOR LIGHT EMITTING DIODES AND PHOTO DETECTORS

Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector

Differential signaling system and method of controlling skew between signal lines thereof

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Current sensor

Physical quantity sensor

Light-emitting device

LIGHT-EMITTING STRUCTURES

Chip-scale coils and isolators based thereon

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Power semiconductor devices having integrated inductor

Semiconductor switching module and method

Integrated circuit package-in-package system

Chip-stacked package structure

SIP semiconductor device and method for manufacturing the same

EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP

Electronic device including a conductive stud over a bonding pad region

Versatile Si-based packaging with integrated passive components for mmWave applications

Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Structure and method of making lidded chips

Bump pattern design for flip chip semiconductor package

Integrated circuit package system with molding vents

Interposer and semiconductor package with reduced contact area

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stackable multi-chip package system

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Integrated circuit package system including die stacking

Micro chip-scale-package system

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Integrated circuit package system employing wafer level chip scale packaging

Integrated circuit package-on-package stacking system

LEADFRAME AND NON-LEAD PACKAGE THEREWITH

Lead Frame and Fabrication Method thereof

Semiconductor device and method of manufacturing the same

Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

Method for placing material onto a target board by means of a transfer board

Integrated circuit package system with filled wafer recess

Semiconductor device

On-chip magnetic components

Solid state device

Injection apparatus, semiconductor light emitting apparatus, manufacturing apparatus, and manufacturing method of semiconductor light emitting apparatus

LED module and method of manufacturing the same

Light emitting diode package with positioning groove

LIGHTING STRUCTURE WITH LIGHT EMITTING DIODES AND METHOD OF FORMING SAME

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Wiring substrate and manufacturing method thereof, and semiconductor device

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

PHOSPHOR-CONTAINING CURABLE SILICONE COMPOSITION FOR LED AND LED LIGHT-EMITTING DEVICE USING THE COMPOSITION

Solder Ball Pad Structure

Electronic system modules and method of fabrication

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Electronic packages with roughened wetting and non-wetting zones

Light emitting diode package element with internal meniscus for bubble free lens placement

Composite photoresist for modifying die-side bumps

Multiplexed RF isolator circuit

Linear diode-laser array with series-connected emitters

Light source comprising edge emitting elements

Ceramic packaging for high brightness LED devices

Light-emitting heat-dissipating device and manufacturing method thereof

Substrate structure integrated with passive components

Display device

Method and architecture for power management of an electronic device

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Multi-die DC-DC buck power converter with efficient packaging

Light emitting diode replacement lamp

Methods for providing and using grid array packages

Microelectronic device connection structure

Silicon-based thin substrate and packaging schemes

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Method of forming hole in semiconductor device using mask

Semiconductor device

Semiconductor device with interface peeling preventing rewiring layer

Solder bumps in flip-chip technologies