Contact structure having a compliant bump and a test pad

Semiconductor device and manufacturing method for the same

Contact structure having a compliant bump and a testing area

Substrate and process for semiconductor flip chip package

Solder connector structure and method

Mounting device for a semiconductor package

Multi-die DC-DC boost power converter with efficient packaging

Double-sided die

Substrate structure integrated with passive components

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Package structure having semiconductor chip embedded therein and method for fabricating the same

Semiconductor package

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME

CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Array-Processed Stacked Semiconductor Packages

Solid-state imaging apparatus

Image pickup device and method of manufacturing the same

Semiconductor device

Light-emitting heat-dissipating device and packaging method thereof

Light emitting diode package having multiple molding resins on a light emitting diode die

LED LAMP

Surface mounting device-type light emitting diode

Package for housing light-emitting element and method for manufacturing package for housing light-emitting element

Light emitting diode package with optical element

Integrated circuit module and method of forming the same

Memory element and semiconductor device

Thermal interconnect and interface materials, methods of production and uses thereof

Nonvolatile memory apparatus

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Bonding apparatus

Method for self-assembling microstructures

Bonding apparatus and method for cleaning tip of a bonding tool

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Pad structure design with reduced density

Multi Lead Frame Power Package

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Structure of image sensor module and a method for manufacturing of wafer level package

Substrate having stiffener fabrication method

Semiconductor device

LED color management and display systems

High power light-emitting diode package comprising substrate having beacon

Arrangement of Light-Emitting Diodes Of LED Lamp

Electronic component module and radio comunications equipment

Control module

Microcircuit card attached to an adapter base, card base and manufacturing method

Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same

Detection head

Configurable IC with configuration logic resources that have asymmetric inputs and/or outputs

Luminescent material

Method and apparatus for precisely aligning integrated circuit chips

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip chip mounting process and flip chip assembly

Leaded stacked packages having elevated die paddle

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR CHIP

Electronic component of VQFN design and method for producing the same

ELECTRONIC DEVICE WITH A PLURALITY OF SUBSTRATES AND METHOD FOR MANUFACTURING SAME

BLM structure for application to copper pad

Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Chip having two groups of chip contacts

Heat dissipating semiconductor package and heat dissipating structure thereof

CAPILLARY UNDERFILL AND MOLD ENCAPSULATION METHOD AND APPARATUS

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-in-package configuration and production method

Brick type stackable semiconductor package

Stack type semiconductor package and method of fabricating the same

Pillar Bump Package Technology

Hybrid Microelectronic Package

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

Chip package structure and manufacturing method thereof

Integrated circuit package system with laminate base

Surface mount multichip devices

Chip package structure

Leaded stacked packages having integrated upper lead

Interconnect structure for semiconductor package

Integrated circuit package system with offset stacked die

Image sensor unit and image sensor apparatus

Structure of image sensor module and a method for manufacturing of wafer level package

IMAGE SENSING MODULE

Semiconductor structure of a high side driver

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

Methods and apparatus for packaging integrated circuit devices

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

Yellow Emitting Phosphor And White Semiconductor Light Emitting Device Incorporating The Same

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

Semiconductor light-emitting means and light-emitting panel comprising the same

Light emitting diode chip with large heat dispensing and illuminating area

Semiconductor device and an information management system therefor

Interposer and electronic device using the same

Method, device and system for controlling heating circuits

Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof

Conductive adhesive rework method

Materials-based failure analysis in design of electronic devices, and prediction of operating life

Phototherapy Device and System

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Integrated circuit mount system with solder mask pad

Semiconductor device and manufacturing method for the same

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS

Method of fabricating a semiconductor chip package

Packaging structure with protective layers and packaging method thereof

System and method of attenuating electromagnetic interference with a grounded top film

Chip scale package (CSP) assembly apparatus and method

Mobile terminal equipment using fuel battery and fuel battery system for mobile terminal equipment

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

Transformer coils for providing voltage isolation

Semiconductor laser device

Liquid-filled LED lamp with heat dissipation means

METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS

Integrated circuit module

Method for producing a dielectric layer for an electronic component

ESD protection circuit for semiconductor device

Radio frequency identification tag

Thermally distributed integrated power amplifier module

Heat treatment jig and heat treatment jig set

Electronic package with epoxy or cyanate ester resin encapsulant

Aligned nanotube bearing composite material

Method for forming a molded circuit board

Chip structure

Semiconductor chip structure

Semiconductor chip package and method manufacturing method thereof

Method for producing chip packages, and chip package produced in this way

Wiring substrate, semiconductor device, and method of manufacturing the same

Chip structure with redistribution traces

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Light Emitting Diode Package

Cooling module against ESD and electronic package, assembly and system using the same

Integrated circuit heat spreader stacking method

Semiconductor device, electro-optical device, and method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor package and fabrication method thereof

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Method for the packaging of optical or optoelectronic components, and optical or optoelectronic package element producible according to the method

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

EMI ABSORBING GAP FILLING MATERIAL

Semiconductor Package Having Improved Adhesion and Solderability

Integrated circuit package system with flashless leads

Electronic assembly and manufacturing method having a reduced need for wire bonds

Integrated circuit package system employing an exposed thermally conductive coating

SEMICONDUCTOR DEVICE AND WIRELESS DEVICE USING THE SEMICONDUCTOR DEVICE

Integrated circuit package system including wafer level spacer

PACKAGING STRUCTURE OF AN OPTICAL MOTION SENSOR

LARGE AREA FLAT IMAGE SENSOR ASSEMBLY

Semiconductor with reduced pad pitch

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Leadframe-based packages for solid state light emitting devices

Optoelectronic semiconductor component and housing base for such a component

Substantially transparent material for use with light-emitting device

Two component photodiode detector

Two step molding process secured digital card manufacturing method and apparatus

Wire bonding apparatus

Build-up printed wiring board substrate having a core layer that is part of a circuit

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Underfill and mold compounds including siloxane-based aromatic diamines

Methods and systems for laser assisted wirebonding

Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device

Method of forming a semiconductor device

Arrangement for solder bump formation on wafers

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Quad flat no-lead (QFN) chip package assembly apparatus and method

Compressible films surrounding solder connectors

Structure of high performance combo chip and processing method

Integrated circuit package, panel and methods of manufacturing the same

PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME

Advanced Thin Flexible Microelectronic Assemblies and Methods for Making Same

Miniature optical element for wireless bonding in an electronic instrument

METHOD OF PACKAGING LIGHT EMITTING DIODES

Semiconductor device with electrode pad having probe mark

Optical module package and optical module

Semiconductor laser device

LED decorative lighting structure

Direct-type backlight unit having surface light source

Package board integrated with power supply

Load driving device

Power semiconductor module with connection elements electrically insulated from one another

Thermally conductive composite and uses for microelectronic packaging

LIQUID CRYSTAL DISPLAY DEVICE

Copper bonding compatible bond pad structure and method

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Semiconductor device and method of manufacturing the same

Integrated circuit and method for fabricating the same

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Packaging of hybrid integrated circuits

Solderability Improvement Method for Leaded Semiconductor Package

Superfine-circuit semiconductor package structure

Semiconductor device for pipe for passing refrigerant liquid

Flip chip package including a non-planar heat spreader and method of making the same

Heat-dissipating package structure and fabrication method thereof

Semiconductor constructions and assemblies, and electronic systems

SEMICONDUCTOR PACKAGE

Integrated circuit package system with ground bonds

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package system with stiffener

Integrated circuit package-in-package system

Package mounted module

Electronic module with switching functions and method for producing the same

Integrated circuit packaging system with ultra-thin die

Multi-chip semiconductor connector assemblies

Flip chip package and method of fabricating the same

Chip package structure and fabricating method thereof

Method of Manufacturing a Semiconductor Device

Semiconductor package, method of production of same, printed circuit board, and electronic apparatus

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package and method for producing the same

Semiconductor device

Light emitting diode package structure

Light-emitting device

Semiconductor light-emitting element and manufacturing method thereof

Sub-mount for mounting light emitting device and light emitting device package

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Wiring board and semiconductor device excellent in folding endurance

Bond and method for bonding two contact surfaces

Method for production of a semiconductor component

THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS

Bonding pad structure and method for making the same

Method of providing mixed size solder bumps on a substrate using a solder delivery head

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Semiconductor package substrate for flip chip packaging

Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method

Detachable stiffener for ultra-thin die

Nickel tin bonding system for semiconductor wafers and devices

Method for fabricating a wafer level package with device wafer and passive component integration

Transfer mold solution for molded multi-media card

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices

Wafer-level bonding for mechanically reinforced ultra-thin die

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Semiconductor device and method of manufacturing the semiconductor device

Tapered die-side bumps

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

RFID tag manufacturing methods and RFID tags

Fine pitch microcontacts and method for forming thereof

Phosphor, method for manufacturing same, and light emitting diode

Integrated microelectronic package temperature sensor

Structure and method of making lidded chips

LIQUID CRYSTAL DISPLAY DEVICE

Secure electronic entity such as a passport

Substrate with stiffener and manufacturing method thereof

Defining pin functionality at device power on

Illumination Device and Display Device Using Illumination Device

Integrated circuit incorporating wire bond inductance

Semiconductor device

Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation

Semiconductor device, wiring board, and manufacturing method thereof

Flip-chip package structure with stiffener

Semiconductor device comprising chip on chip structure

Stack package having pattern die redistribution

Stacked, interconnected semiconductor packages

Multiple-dies semiconductor device with redistributed layer pads

Integrated circuit (IC) chip and method for fabricating the same

STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME, WAFER-LEVEL STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

Semiconductor device having an inductor

Semiconductor package having embedded passive elements and method for manufacturing the same

Stack package with vertically formed heat sink

Microelectronic assembly having a periphery seal around a thermal interface material

POWER AMPLIFIER MODULE

Chip module for complete power train

Semiconductor package system and method of improving heat dissipation of a semiconductor package

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Planar array contact memory cards

Semiconductor package having optimal interval between bond fingers for reduced substrate size

System-in-package structure

Flipped, stacked-chip IC packaging for high bandwidth data transfer buses

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Electronic package and semiconductor device using the same

Exposed top side copper leadframe manufacturing

Method of fabricating an integrated circuit with etched ring and die paddle

Low inductance capacitors, methods of assembling same, and systems containing same

SINGLE PACKAGE DETECTOR AND DIGITAL CONVERTER INTEGRATION

Structure and method of making lidded chips

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Flip chip type LED lighting device manufacturing method

LED lamp

LED package with flexible polyimide circuit and method of manufacturing LED package