212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Optoelectronic device
#22502Phosphor, Production Method Thereof and Light Emitting Instrument
#22503Red light-emitting phosphor and light-emitting device
#22504Ball forming device in a bonding apparatus and ball forming method
#22505Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method
#22506Wire clamp gap control mechanism and method
#22507Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages
#22508COMPLIANT ELECTRICAL CONTACTS
#22509Method of manufacturing capacitor-embedded low temperature co-fired ceramic substrate
#22510Circuit-connecting material and circuit terminal connected structure and connecting method
#22511Optoelectronic device
#22512Methods of operating electronic devices, and methods of providing electronic devices
#22513Die configurations and methods of manufacture
#22514Method for applying solder to redistribution lines
#22515Manufacturing method package substrate
#22516Method of manufacturing a semiconductor device
#22517Manufacturing method for a leadless multi-chip electronic module
#22518Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
#22519Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#22520Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#22521Illuminated electric toothbrushes emitting high luminous intensity toothbrush
#22522Encapsulated optoelectronic device
#22523BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#22524Optical path converting member, multilayer print circuit board, and device for optical communication
#22525Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#22526Use of flexible circuits in a power module for forming connections to power devices
#22527Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink
#22528Ceramic substrate for light emitting diode where the substrate incorporates ESD protection
#22529Temperature controlled MEMS resonator and method for controlling resonator frequency
#22530Module composed of two light sources and generating tri-band white light with adjustable chromaticity diagram
#22531Die package and probe card structures and fabrication methods
#22532Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
#22533Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#22534SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#22535Integrated circuit package system with offset stack
#22536Semiconductor device having conductive adhesive layer and method of fabricating the same
#22537SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#22538Heat dissipating structure and method for fabricating the same
#22539RF power transistor having an encapsulated chip package
#22540Semiconductor device having heat spreader with center opening
#22541Package Using Selectively Anodized Metal and Manufacturing Method Thereof
#22542Embedded metal heat sink for semiconductor device and method for manufacturing the same
#22543Compliant integrated circuit package substrate
#22544Semiconductor package having functional and auxiliary leads, and process for fabricating it
#22545Semiconductor apparatus with decoupling capacitor
#22546In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit
#22547Integrated Circuits Having Controlled Inductances
#22548Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#22549Optoelectronic device
#22550Micro universal serial bus (USB) memory package
#22551Semiconductor light emitting device, illuminating device, mobile communication device, camera, and manufacturing method therefor
#22552Light emitting diode with direct view optic
#22553Light-Emitting Device
#22554Electroluminescent device with high refractive index and UV-resistant encapsulant
#22555Optoelectronic device
#22556Lens frame and optical focus assembly for imager module
#22557Multilayer printed wiring board
#22558Molding methods to manufacture single-chip chip-on-board USB device
#22559Top layers of metal for high performance IC's
#22560Top layers of metal for high performance IC's
#22561Microelectronic assembly with back side metallization and method for forming the same
#22562METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME HAVING THROUGH HOLES OR HOLLOWS THEREIN
#22563Manufacturing method of semiconductor device
#22564METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE
#22565Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
#22566Manufacturing method of wiring substrate
#22567Methods for manufacturing a sensor assembly
#22568Method for Manufacturing Transparent Windows in Molded Semiconductor Packages
#22569Method of fabricating a semiconductor device with a back electrode
#22570Light -Emitting Body,Lighting Device And Display Device Using The Same
#22571Small form factor camera module with lens barrel and image sensor
#22572Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement
#22573Light emitting device having a metal can package for improved heat dissipation
#22574Light source device and method of making the device
#22575Stacked semiconductor package having flexible circuit board therein
#22576IC packages with internal heat dissipation structures
#22577Image sensor, and image pickup apparatus using same, and manufacturing method for manufacturing image sensor
#22578Coupling for patch antennas
#22579Micro power converter and method of manufacturing same
#22580Method And System For Using One-Time Programmable (OTP) Read-Only Memory (ROM) To Configure Chip Usage Features
#22581Integrated circuit and method for writing information
#22582Method for producing a lens mold
#22583NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
#22584Integrated circuit (IC) package stacking and IC packages formed by same
#22585Multilayer bonding ribbon
#22586SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#22587Top layers of metal for high performance IC's
#22588Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
#22589Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device
#22590Stacked die package for MEMS resonator system
#22591SEMICONDUCTOR DEVICE HAVING INTERFACE CHIP INCLUDING PENETRATING ELECTRODE
#22592INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#22593Electrode pad on conductive semiconductor substrate
#22594Top layers of metal for high performance IC's
#22595Top layers of metal for high performance IC's
#22596Top layers of metal for high performance IC's
#22597Top layers of metal for high performance IC's
#22598Top layers of metal for high performance IC's
#22599Top layers of metal for high performance IC's
#22600Top layers of metal for high performance IC's
#22601Top layers of metal for high performance IC's
#22602Top layers of metal for high performance IC's
#22603Top layers of metal for high performance IC's
#22604Top layers of metal for high performance IC's
#22605Structure and method for producing multiple size interconnections
#22606Printed circuit board for package of electronic components and manufacturing method thereof
#22607Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#22608Semiconductor device having semiconductor element with back electrode on insulating substrate
#22609SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME
#22610CHIP STRUCTURE
#22611Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#22612Semiconductor package having dimpled plate interconnections
#22613High-frequency semiconductor device
#22614High frequency semiconductor device
#22615Stacking structure of chip package
#22616Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
#22617Light emitting diode module
#22618Printed circuit board and circuit structure for power supply
#22619Thermal improvement for hotspots on dies in integrated circuit packages
#22620DIE STACK CAPACITORS, ASSEMBLIES AND METHODS
#22621Nested integrated circuit package on package system
#22622MULTI-CHIP PACKAGE STRUCTURE
#22623Semiconductor device having a multi-layered semiconductor substrate
#22624Stacked packages and microelectronic assemblies incorporating the same
#22625Light emitting diode module
#22626Power semiconductor module and fabrication method thereof
#22627High power shunt switch with high isolation and ease of assembly
#22628IC chip package, and image display apparatus using same
#22629Multi-chip stacked package with reduced thickness
#22630Method of manufacturing nitride semiconductor light-emitting element and nitride semiconductor light-emitting element
#22631Package for a light emitting diode and a process for fabricating the same
#22632Package-on-package system
#22633Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
#22634Low inductance optical transmitter submount assembly
#22635Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
#22636Coreless cavity substrates for chip packaging and their fabrication
#22637Top layers of metal for high performance IC's
#22638Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#22639Methods of forming solder connections and structure thereof
#22640Substrate treating method and method of manufacturing semiconductor apparatus
#22641HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#22642Fabrication method of semiconductor integrated circuit device
#22643Semiconductor package and method of assembling the same
#22644Stacked Chips with Underpinning
#22645Method of manufacturing an integrated circuit
#22646Method of fixing curved circuit board and wire bonding apparatus
#22647Method of making light emitting device with multilayer silicon-containing encapsulant
#22648Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
#22649Magnetic shielding for magnetic random access memory
#22650Light source and vehicle lamp
#22651Wiring Board and Semiconductor Device
#22652Computer systems having an interposer including a flexible material
#22653Semiconductor device interconnecting unit, semiconductor device and high-frequency module having a millimeter wave band
#22654Embedding memory between tile arrangement of a configurable IC
#22655Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#22656Side illumination lens and luminescent device using the same
#22657Chip and flat panel display apparatus comprising the same
#22658Electronics package and associated method
#22659Electronic circuit arrangement
#22660STACKED CHIP PACKAGE
#22661Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#22662Top layers of metal for high performance IC's
#22663Top layers of metal for high performance IC's
#22664Top layers of metal for high performance IC's
#22665Top layers of metal for high performance IC's
#22666Integrated circuit having improved interconnect structure
#22667Semiconductor device having a resistance for equalizing the current distribution
#22668Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#22669Semiconductor device having improved contacts
#22670Top layers of metal for high performance IC's
#22671Wiring board and method for manufacturing the same, and semiconductor device
#22672Semiconductor Device
#22673Method of making thermally enhanced substrate-base package
#22674Flip-chip bonding structure using multi chip module-deposited substrate
#22675Integrated circuit package system with post-passivation interconnection and integration
#22676Integrated circuit (IC) carrier assembly incorporating serpentine suspension
#22677Mounting integrated circuit dies for high frequency signal isolation
#22678Semiconductor device package utilizing proud interconnect material
#22679Power semiconductor device connected in distinct layers of plastic
#22680Semiconductor device
#22681Stacked die package system
#22682DEVICE EMBEDDED WITH SEMICONDUCTOR CHIP AND STACK STRUCTURE OF THE SAME
#22683System-in-package device
#22684Electronic Part And Method Of Producing The Same
#22685Semiconductor device with improved high current performance
#22686Semiconductor device
#22687Interconnections resistant to wicking
#22688Package structure and lead frame using the same
#22689Methods and apparatus for a semiconductor device package with improved thermal performance
#22690Semiconductor package structure
#22691Semiconductor device having a bonding pad and fuse and method for forming the same
#22692SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#22693Casting for an LED module
#22694Light emitting diodes including transparent oxide layers
#22695Light emitting diode chip
#22696LED device with re-emitting semiconductor construction and reflector
#22697Nitride-based semiconductor light-emitting diode and illuminating device
#22698Composite semiconductor device and method of manufacturing the same
#22699GaN-based semiconductor light-emitting device, light illuminator, image display planar light source device, and liquid crystal display assembly
#22700Light emitting device including RGB light emitting diodes and phosphor
#22701Device clamp for reducing oxidation in wire bonding
#22702INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#22703Wire bonding method for forming low-loop profiles
#22704SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
#22705Drive train for a motor vehicle comprising an electric machine
#22706SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
#22707Resonating conductive traces and methods of using same for bonding components
#22708Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device
#22709Advanced multilayer coreless support structures and method for their fabrication
#22710Top layers of metal for high performance IC's
#22711Top layers of metal for high performance IC's
#22712Semiconductor device and method for fabricating the same
#22713Top layers of metal for high performance IC's
#22714Top layers of metal for high performance IC's
#22715Method of forming semiconductor packaged device
#22716Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
#22717Method and system for fabricating a semiconductor device
#22718Method for manufacturing wiring board
#22719METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#22720Multiple row exposed leads for MLP high density packages
#22721Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
#22722Manufacturing method of an acceleration sensing device
#22723Chip stack package and manufacturing method thereof
#22724Semiconductor device encapsulated with resin composition
#22725Solid state light emitting device and method of making same
#22726Lighting device and method of lighting
#22727Backages with buried electrical feedthroughs
#22728Device for passivating at least one component by a housing and method for manufacturing a device
#22729Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#22730Corrosion Protection for Pressure Sensors
#22731On-chip inductor using redistribution layer and dual-layer passivation
#22732Stacked contact bump
#22733INTEGRATED CURRENT SENSOR
#22734METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#22735Semiconductor package and method for fabricating the same
#22736Encapsulated electronic device
#22737Semiconductor device
#22738Stackable semiconductor package
#22739Top layers of metal for high performance IC's
#22740Top layers of metal for high performance IC's
#22741Top layers of metal for high performance IC's
#22742Top layers of metal for high performance IC's
#22743Top layers of metal for high performance IC's
#22744Top layers of metal for high performance IC's
#22745Top layers of metal for high performance IC's
#22746Top layers of metal for high performance IC's
#22747Interlayer dielectric and pre-applied die attach adhesive materials
#22748Top layers of metal for high performance IC's
#22749Semiconductor device and method for fabricating the same
#22750Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device
#22751Process to reform a plastic packaged integrated circuit die
#22752System and method to reduce metal series resistance of bumped chip
#22753Ball grind array package structure
#22754Multilayer electronic component, electronic device, and method for producing multilayer electronic component
#22755Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the Same
#22756Semiconductor package structure having enhanced thermal dissipation characteristics
#22757Integrated circuit package system with edge connection system
#22758Semiconductor package substrate and semiconductor package having the same
#22759Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
#22760Chip stack, method of fabrication thereof, and semiconductor package having the same
#22761Modular bonding pad structure and method
#22762Semiconductor integrated circuit device
#22763Method of manufacturing an electronic component package
#22764Multiple die stack apparatus employing T-shaped interposer elements
#22765Semiconductor device having a bonding wire and method for manufacturing the same
#22766Stacked package electronic device
#22767Stack structure of circuit board with semiconductor component embedded therein
#22768Stackable multi-chip package system
#22769Stackable semiconductor package
#22770Semiconductor device stack and method for its production
#22771Semiconductor package structure
#22772Microelectronic package having solder-filled through-vias
#22773Au-Ag based alloy wire for semiconductor package
#22774Lead frame and method of manufacturing the same and semiconductor device
#22775Leadframe IC packages having top and bottom integrated heat spreaders
#22776Method and structure for improving the reliability of leadframe integrated circuit packages
#22777Multilayer structures for magnetic shielding
#22778Electric circuit device and related manufacturing method
#22779Method of fabricating MEMS device
#22780Semiconductor device and method for manufacturing the same
#22781Semiconductor device with reduced parasitic inductance
#22782Semiconductor light emitting device and method of fabricating the same
#22783Light-emitting device manufacturing method and light-emitting device
#22784Light emitting device and a lighting apparatus
#22785Group III nitride semiconductor light-emitting device and method of producing the same
#22786Nitride-based semiconductor light emitting diode
#22787Light emitting device and method of manufacturing the same
#22788Camera module with premolded lens housing and method of manufacture
#22789Method for producing a chip-substrate connection
#22790ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AND ELECTRONIC DEVICE
#22791SUBSTRATE AND LAYOUT METHOD
#22792Camera module and camera module assembly
#22793Contact surrounded by passivation and polymide and method therefor
#22794Fabrication method of semiconductor device
#22795Separation method of semiconductor device
#22796Non-cyanide gold electroplating for fine-line gold traces and gold pads
#22797Method for manufacturing backside-illuminated optical sensor
#22798Methods and apparatus for directing light emitting diode output light
#22799Optoelectronic module, and method for the production thereof
#22800Electretization method and apparatus