Semiconductor device

Indirect lighting device for light guide illumination

Lighting device

Integrated circuit, and a mobile phone having the integrated circuit

Integrated snubber device on a semiconductor basis for switching load reduction, voltage limitation and/or oscillation attenuation

Optical device chip, and optical module and method for manufacturing the same

Semiconductor integrated circuit device with power lines improved

Optoelectronic device

Translucent laminate sheet and light-emitting device using the translucent laminate sheet

Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device

Semiconductor device and method of manufacturing thereof

Interconnect structure and formation for package stacking of molded plastic area array package

Semiconductor component with connecting elements and method for producing the same

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Method of wire bonding over active area of a semiconductor circuit

Device Comprising Circuit Elements Connected By Bonding Bump Structure

Integrated circuit package having exposed thermally conducting body

Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate

Semiconductor package with bypass capacitor

Semiconductor device

Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier

Quad flat no-lead chip carrier with stand-off

Semiconductor device

SYSTEM IN PACKAGE MODULE

METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION

Multilayer dielectric substrate and semiconductor package

Semiconductor device

Optical sensor assemblage and corresponding manufacturing method

Power semiconductor module

Nitride semiconductor light emitting device

IMAGE CHIP PACKAGE STRUCTURE AND THE METHOD OF MAKING THE SAME

Image sensor package having mount holder attached to image sensor die

Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device

Manufacturing method of multilayer core board

High density integrated circuit apparatus, test probe and methods of use thereof

Random pulse generation source, and semiconductor device, method and program for generating random number and/or probability using the source

Conductive adhesive composition

Method of providing solder bumps using reflow in a forming gas atmosphere

Semiconductor device having post-mold nickel/palladium/gold plated leads

Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

Electronic device substrate, electronic device and methods for making same

Multi-channel optical receiver module

Modular diode laser assembly

Modular diode laser assembly

Modular diode laser assembly

Electronic device substrate, electronic device and methods for fabricating the same

Electronic module with a semiconductor chip and a component housing and methods for producing the same

Stub-tuned wirebond package

Equalization in capacitively coupled communication links

Light unit with staggered electrodes

Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays

SEMICONDUCTOR PACKAGE

Semiconductor device

Integrated circuit package and multi-layer lead frame utilized

Integrated circuit having pads and input/output (I/O) cells

Metallization layer for a power semiconductor device

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

Dual-sided chip attached modules

Semiconductor device including electrically conductive bump and method of manufacturing the same

Manufacturing a bump electrode with roughened face

Dual MOSFET package

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES

Semiconductor device and method of manufacturing the same

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Circuit card module and method for fabricating the same

Integrated circuit package system with different mold locking features

Wafer level semiconductor chip packages and methods of making the same

Electronic component having a semiconductor power device

Flip chip MLP with folded heat sink

Copper straps

Dual side cooling integrated power device module and methods of manufacture

Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package

Integrated circuit having stress tuning layer

Top layers of metal for high performance IC's

Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication

Methods and apparatus having an integrated circuit attached to fused silica

SEMICONDUCTOR LASER DEVICE

Light-emitting devices and methods for manufacturing the same

Light emitting package and light emitting package array

Method for fabricating three-dimensional all organic interconnect structures

Method of producing an electronic component

Integrated circuit chip packaging

Air bridge structures and methods of making and using air bridge structures

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method and apparatus for manufacture and inspection of semiconductor device

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Super high density module with integrated wafer level packages

Image sensor device and method of manufacturing the same

OPTICAL BENCH, SLIM OPTICAL PICKUP EMPLOYING THE SAME AND METHOD OF MANUFACTURING THE OPTICAL BENCH

Semiconductor input control device

Light emitting device using a thermally activated coating and method of manufacturing

Metal oxide nanoparticles, production method thereof, light-emitting element assembly, and optical material

Electronic device having a dimensionally-stable electrically-conductive flexible substrate

Light source and vehicle lamp

LED reflector molding process, construction, and loader thereof

Jacketed LED assemblies and light strings containing same

Light-mixing type light-emitting apparatus

Electronic subassembly, electronic assembly, and method for producing an electronic assembly

Wiring board

Planar mixed-signal circuit board

Illumination source including photoluminescent material and a filter, and an apparatus including same

LED structure and fabricating method for the same

Phoshor and Light-Emitting Diode

Integrated circuit package system with contoured encapsulation

High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor

Module With Built-In Semiconductor And Method For Manufacturing The Module

Method for fabricating semiconductor package with multi-layer die contact and external contact

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having a chip stack on a rewiring plate

Semiconductor device

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

Semiconductor device and method of producing the same

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device

Circuit board, method for manufacturing the same, and semiconductor device

Stacked bump structure and manufacturing method thereof

Semiconductor device and chip structure thereof

Electronic device with integrated heat distributor

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method of fabricating microelectronic devices

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Integrated circuit device with semiconductor device components embedded in plastic housing composition

Semiconductor device having shifted stacked chips

SEMICONDUCTOR DEVICE

Semiconductor Housings Having Coupling Coatings

Devices and systems having at least one dam structure

Semiconductor Device

Lead frame and semiconductor device using the same

Optically blocked reference pixels for focal plane arrays

Semiconductor device and method for manufacturing the same

Power semiconductor module

Semiconductor device and method of manufacturing the same

Electronic component having at least one vertical semiconductor power transistor

Light emitting semiconductor apparatus

Side-view surface mount white LED

Light emitting device having a package formed with fibrous fillers

Light emitting device with a porous alumina reflector made of aggregation of alumina particles

Light emitting device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor light emitting device and a method for producing the same

Light emitting diode and wavelength converting material

Semiconductor device having microstructure and method of manufacturing microstructure

WIRE BONDING PROCESS FOR INSULATED WIRES

Capacitive vibration sensor and method for manufacturing same

Heat exchanger, light source apparatus, and projector

BACKLIGHT UNIT AND METHOD OF MANUFACTURING THE SAME

Method and system for fabricating a semiconductor device

Power management integrated circuit

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects

Interconnection structure, electronic component and method of manufacturing the same

Process for fabricating chip package structure

Phosphor composition and method for producing the same, and light-emitting device using the same

Light emitting device and lighting device

Printed circuit board

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

SEMICONDUCTOR CHIP FOR DRIVING LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND LIGHTING DEVICE

Inductor and electric power supply using it

Semiconductor module

Hybrid configurable circuit for a configurable IC

Light conversion structure and light-emitting device using the same

Fluorescent material, fluorescent device using the same, and image display device and lighting equipment

Electric rotating machine

Package structure

SEMICONDUCTOR MODULE

Increased interconnect density electronic package and method of fabrication

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Methods of forming blind wafer interconnects, and related structures and assemblies

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer

METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL

Process for forming bumps and solder bump

CHIP PACKAGE

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

CHIP STRUCTURE AND FABRICATING PROCESS THEREOF

Semiconductor device and method for manufacturing same

Flip chip type LED lighting device manufacturing method

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

Illuminator and Manufacturing Method

Low resistance integrated MOS structure

Lighting Device And Method

Multi-element LED lamp package

Light emitting device having light extraction structure and method for manufacturing the same

Phosphor

Transducer and method for mounting the same

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Heat resistant substrate incorporated circuit wiring board

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS

Method for positioning of wireless medical devices with short-range radio frequency technology

Manufacturing method of semiconductor device with a barrier layer and a metal layer

Process for bonding and electrically connecting microsystems integrated in several distinct substrates

Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same

Method of forming stackable package

Method of making wirebond electronic package with enhanced chip pad design

Method for manufacturing stacked package structure

3D interconnect with protruding contacts

Encapsulation for particle entrapment

Camera module package

Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same

Attaching heat sinks to integrated circuit packages

Pattern forming method, droplet discharging device and circuit module

Method of manufacturing circuit module, collective board for circuit module, and circuit module manufactured by the method

Ceramic substrate for mounting a light emitting element and method for manufacturing the same

Light emitting device, light-emitting module, lighting apparatus, and image projection apparatus

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Stackable semiconductor package

Wirebond pad for semiconductor chip or wafer

CHIP PACKAGING STRUCTURE

Method for forming C4 connections on integrated circuit chips and the resulting devices

Semiconductor device having a smaller electrostatic capacitance electrode

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

Circuit Apparatus

Power semiconductor module as H-bridge circuit and method for producing the same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Memory package structure

SEMICONDUCTOR DEVICE PACKAGE

Stacked die packages

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

PACKAGE-ON-PACKAGE STRUCTURES

Stackable integrated circuit structures and systems devices and methods related thereto

Molded SiP package with reinforced solder columns

Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same

Flip chip mounted semiconductor device package having a dimpled leadframe

Circuit apparatus and method of fabricating the apparatus

Packaging of integrated circuits to lead frames

Leadframe structures for semiconductor packages

Light emitting diode package with direct leadframe heat dissipation

System and method for providing a power bus in a wirebond leadframe package

Semiconductor device

Optical apparatus and optical module using the same

Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device

Electric circuit device, electric circuit module, and power converter

Surface mounting optoelectronic device

Light emitting apparatus

Light emitting apparatus

Light emitting apparatus

Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting Device

Light emitting apparatus

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

Polymer matrices for polymer solder hybrid materials

Process condition measuring device with shielding

Solder ball loading apparatus

Transceiver having mixer/filter within receiving/transmitting cavity

Semiconductor device with via hole of uneven width

Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same

Method of manufacturing semiconductor apparatus

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Method for fabricating multi-chip semiconductor package

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor die package including multiple dies and a common node structure

Method of making circuitized substrate with internal organic memory device

Led package and method for producing the same

Semiconductor device system and method for modifying a semiconductor device

Semiconductor element mounting board and optical transmission module

Multi-channel laser pump source for optical amplifiers

DOUBLE-SIDED MONOLITHICALLY INTEGRATED OPTOELECTRONIC MODULE WITH TEMPERATURE COMPENSATION

Light emitting device, lighting equipment or liquid crystal display device using such light emitting device

Multi chip LED lamp

Light source with a low color temperature

Surface mounting electronic component and manufacturing method thereof

Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip

Inductor element and method for production thereof, and semiconductor module with inductor element

Filter device substrate and filter device

Multi-substrate integrated sensor

Blue-light light-emitting diode

Semiconductor device, electronic apparatus and semiconductor device fabricating method

Semiconductor device

Integrated circuit devices with stacked package interposers

Power semiconductor component, power semiconductor device as well as methods for their production

IC chip package with minimized packaged-volume

SEMICONDUCTOR DEVICE

Semiconductor power module including epoxy resin coating

Semiconductor device and method for producing the same

Semiconductor device and method of manufacturing the same

Wafer level semiconductor module and method for manufacturing the same

Hard disk drive preamp heat dissipation methods

Utra-thin substrate package technology

Die protection process

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component