Stackable semiconductor package

Ball Grid array package structure

Embedded integrated circuit package-on-package system

High reliability power module

Stack structure of semiconductor packages and method for fabricating the stack structure

Leadframe enhancement and method of producing a multi-row semiconductor package

Package for optical device and method of manufacturing the same

Memory circuit system having semiconductor devices and a memory

MULTI-DIE INDUCTOR

MOSFET power package

Semiconductor light emitting element

Multilayered white light emitting diode using quantum dots and method of fabricating the same

Oxynitride phosphor and a light emitting device

Semiconductor device using semiconductor chip

Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

High efficiency LED package

Surface mounting device-type light emitting diode

Package structure of light emitting device

Package base structure and associated manufacturing method

Sealed LED having improved optical transmissibility

Light source having both thermal and space efficiency

Semiconductor light emitting device with integrated electronic components

Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

Method for manufacturing memory card structure

Tail wire cutting method and bonding apparatus

Memory circuit having memory chips parallel connected to ports and corresponding production method

Method for Electroplating and Contact Projection Arrangement

Fabrication method for electronic system modules

Method for manufacturing a programmable system in package

Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test

Configurable IC with configurable routing resources that have asymmetric input and/or outputs

Method of manufacturing a through electrode

Substrate structure having a solder mask and a process for making the same

POP Semiconductor Device Manufacturing Method

Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Flip-chip mounting method and bump formation method

LED package and method for producing the same

LED package and method for producing the same

High-Power LED Chip Packaging Structure And Fabrication Method Thereof

Semiconductor laser device and method of manufacturing the same, and optical transmission module and optical disk apparatus using the semiconductor laser device

Method and apparatus for thin-film battery having ultra-thin electrolyte

Electronic device with lead-free metal thin film formed on the surface thereof

Semiconductor Laser Module and Method for Controlling the Same

Semiconductor memory device and defect remedying method thereof

Multilayer wiring board

Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same

Configurable IC's with logic resources with offset connections

Configurable IC with interconnect circuits that have select lines driven by user signals

Configurable IC with interconnect circuits that also perform storage operations

Variable width management for a memory of a configurable IC

Clock distribution in a configurable IC

Hybrid logic/interconnect circuit in a configurable IC

Embedding memory within tile arrangement of a configurable IC

Yellow light emitting Ce-activated silicate phosphor with new composition, manufacturing method thereof and white LEDs including phosphor

High light output lamps having a phosphor embedded glass/ceramic layer

White light apparatus with enhanced color contrast

Chip package

Solder joint flip chip interconnection having relief structure

ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME

Wiring board, semiconductor device using the same, and method for manufacturing wiring board

Programmable system in package

Conductive structures including titanium-tungsten base layers

Semiconductor apparatus and method of producing the same

Conductive structure for electronic device

Stacked integrated circuit package-in-package system

Electronic component device

Electronic component package

Direct-write wafer level chip scale package

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stacked integrated circuit package-in-package system

MULTICHIP PACKAGE SYSTEM

Overmolded semiconductor package with a wirebond cage for EMI shielding

RFID package structure

Stacked semiconductor device

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Optical display package and the method thereof

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Semiconductor device package with base features to reduce leakage

Alternative flip chip in leaded molded package design and method for manufacture

MESA-TYPE BIPOLAR TRANSISTOR

Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor

Light emitting diode package and fabrication method thereof

Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

Light emitting devices suitable for flip-chip bonding

LED package and method for producing the same

LED package and method for producing the same

Semiconductor light emitting device

Light emitting device and method for producing light emitting device

Photo coupler

Semiconductor light emitting device with first and second leads

LIGHT-EMITTING DIODE WITH LOW THERMAL RESISTANCE

Single-chip monolithic dual-band visible- or solar-blind photodetector

Camera module

Image sensor package structure and method for manufacturing the same

Multilayer printed wiring board and component mounting method thereof

Circuit device

Methods of Fabricating Application Specific Integrated Circuit (ASIC) Devices that Include Both Pre-Existing and New Integrated Circuit Functionality and Related ASIC Devices

Surface-mountable optoelectronic component

Apparatuses and methods to enhance passivation and ILD reliability

Stratified underfill in an IC package

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Chip carrier and fabrication method

Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same

SOLID-STATE IMAGE PICKUP DEVICE, A CAMERA MODULE AND A METHOD FOR MANUFACTURING THEREOF

Bonding Wire and Integrated Circuit Device Using the Same

Semiconductor die packages using thin dies and metal substrates

Semiconductor device

Surface structure of flip chip substrate

Combined semiconductor apparatus and a fabricating method thereof

Semiconductor device and method for fabricating the same

Hybrid stacking package system

Chip with power and signal pads connected to power and signal lines on substrate

SEMICONDUCTOR PACKAGE STRUCTURE

High frequency IC package and method for fabricating the same

Common Assembly Substrate and Applications Thereof

Integrated circuit package system with wire bond pattern

Semiconductor module having discrete components and method for producing the same

Single package wireless communication device

LED chip array module

Hybrid flip-chip and wire-bond connection package system

Power semiconductor module with flush terminal elements

Semiconductor device having an adhesion promoting layer and method for producing it

Substrate for a microelectronic package and method of fabricating thereof

Methods and apparatus for a reduced inductance wirebond array

Integrated circuit package system with ground ring

Chip package structure

METHOD AND SYSTEM FOR SEALING PACKAGES FOR OPTICS

Point-to-point connection topology for stacked devices

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Substrate having conductive traces isolated by laser to allow electrical inspection

Integrated circuit package system with net spacer

Apparatus, system and method for use in mounting electronic elements

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

Method, system, and apparatus for filling vias

Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip

Capacitor structure of semiconductor device and method of fabricating the same

Light source with compliant interface

Light emitting diode package including base body with thermal via and light emitting diode using the same

Light emitting diode package having anodized insulation layer and fabrication method therefor

Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION

Carrier arrangement with overvoltage protection

Wire bonding capillary tool having multiple outer steps

Devices with microjetted polymer standoffs

Multichip package system

Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device

Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator

QFN housing having optimized connecting surface geometry

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming passivation layer

Embedding device in substrate cavity

Method and structure for eliminating aluminum terminal pad material in semiconductor devices

Semiconductor-wafer processing method using fluid-like layer

Methods and materials useful for chip stacking, chip and wafer bonding

Room temperature metal direct bonding

Thin film transistor substrate and manufacturing method thereof

Methods of Packaging Using Fluid Resin

Semiconductor device fabricating method

Methods of forming semiconductor assemblies

Manufacturing method of wiring substrate and manufacturing method of semiconductor device

Semiconductor device manufacturing method

Process for fabricating a semiconductor package

Method for making a wedge wedge wire loop

Method of manufacturing semiconductor device

Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method

Optical Communication Module

Method of correcting bonding coordinates using reference bond pads

Semiconductor laser module driven in shunt-driving configuration

Optical semiconductor device and controlling method of the same

Load control device and method

Led module

Flip chip bonding structure

Circuit device

Integrated phased array antenna

Stacked integrated circuit package system with connection protection

Light emitting device and method for producing same

Luminescent Light Source, Method for Manufacturing the Same, and Light-Emitting Apparatus

White light emitting device

Light emitting device and method for producing same

Light-emitting device, method for producing the same and fluorescent device

Carbon nanotube via interconnect

Tape wiring substrate and tape package using the same

UNIVERSAL CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size

Packaged microelectronic devices recessed in support member cavities, and associated methods

Isolating chip-to-chip contact

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Semiconductor chip comprising a metal coating structure and associated production method

Ball grid array package construction with raised solder ball pads

Ball grid array housing having a cooling foil

Flip chip bonded package applicable to fine pitch technology

High-performance semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor packaging unit with sliding cage

Power semiconductor component with a power semiconductor chip and method for producing the same

Optical semiconductor element and optical semiconductor device

Interconnect structure with stress buffering ability and the manufacturing method thereof

CHIP CARRIER SUBSTRATE WITH A LAND GRID ARRAY AND EXTERNAL BOND TERMINALS

Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer

Multi-chip package for reducing parasitic load of pin

Semiconductor package stack with through-via connection

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Stacked integrated circuit

Method for fabricating chip package structure

MEMS device wafer-level package

Integrated circuit die with pedestal

Semiconductor device with lead frames

Memory card

Optical device package and optical semiconductor device using the same

Semiconductor device including a DC-DC converter

Folding chip planar stack package

Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same

Semiconductor radiation source and light curing device

Semiconductor device and memory card using the same

Integrated-circuit chip with offset external pads and method for fabricating such a chip

Semiconductor imaging device and method for manufacturing the same

SUBSTRATE STRIP AND COMPACT CAMERA MODULE UTILIZING THE SAME

Grounding structure of semiconductor device including a conductive paste

Semiconductor module with current connection element

Group III nitride compound semiconductor light emitting element, light emitting device using the light emitting element: and method for manufacturing the light emitting element

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS

Electronic component and electronic component module

Systems and methods for producing white-light light emitting diodes

Micro-element package module and manufacturing method thereof

SMT LED with high light output for high power applications

Semiconductor layer, process for forming the same, and semiconductor light emitting device

Semiconductor radiation source and light curing device

Light emitting device

Semiconductor light-emitting device

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Q silicone-containing composition, optoelectronic encapsulant thereof and device thereof

Radiation detection circuit

Optical encoder apparatus for removable connection with a printed circuit board and methods of assembling optical encoder apparatus.

Method of manufacturing an electronic component

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Solder layer and electronic device bonding substrate and submount using the same

Connecting device for electronic components

Thermopile element and infrared sensor by using the same

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB

Method of packaging integrated circuit devices using preformed carrier

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

System for making a semiconductor device using bump material including liquid

Semiconductor device and medium of fabricating the same

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Manufacturing method of a package structure

INDIUM FEATURES ON MULTI-CONTACT CHIPS

Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Camera module, method of manufacturing the same, and printed circuit board for the camera module

Semiconductor laser device

Light Emitting Diode Illuminating Apparatus and Method of Manufacturing the Same

Planar circuit housing

Semiconductor device

Single unit protection circuit module and battery pack using the same

Light emitting device and method for fabricating the same

Light-emitting device and phosphor

Light emitting device

Light emitting device, and lighting system, backlight for display and display using the same

SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS

On-die bond wires system and method for enhancing routability of a redistribution layer

Semiconductor device and fabrication process thereof

Structure and method to improve current-carrying capabilities of C4 joints

Chip package

Method for precision assembly of integrated circuit chip packages

Method and system for stacking integrated circuits

Semiconductor components with through wire interconnects

Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions

Stacked semiconductor device

Stack package utilizing through vias and re-distribution lines

Package structure and manufacturing method thereof

Semiconductor package structure

Wafer structure with a plurality of functional macro chips for chip-on-chip configuration

Electronic component having exposed surfaces

Semiconductor device and a method of manufacturing the same

Semiconductor devices and electrical parts manufacturing using metal coated wires

Chip package with a ring having a buffer groove that surrounds the active region of a chip

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device and manufacturing method of a semiconductor device

Crystalline semiconductor film, semiconductor device, and method for manufacturing thereof

METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF

Integrated circuit having a semiconductor sensor device with embedded column-like spacers

Semiconductor device

Forming a hybrid device

LED backlight unit without printed circuit board and method of manufacturing the same

Backlight unit equipped with light emitting diodes

LED DEVICE AND PRODUCTION METHOD THEREOF

Light-emitting-diode chip comprising a sequence of GAN-based epitaxial layers which emit radiation and a method for producing the same

Package structure of light-emitting diode

Light emitting diode lamp

Optoelectronic semiconductor device and light signal input/output device