212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Light emitting diode package
#23402Semiconductor component having test pads and method and apparatus for testing same
#23403METHOD OF MANUFACTURING CIRCUIT DEVICE
#23404Electronic component and its manufacturing method
#23405Physical quantity sensor and lead frame used for same
#23406Power transistor and power semiconductor device
#23407Stacked integrated circuit package-in-package system
#23408Method of manufacturing wafer level stack package
#23409Method for forming metal bumps
#23410Method for manufacturing bump of wafer level package
#23411Semiconductor wafer coat layers and methods therefor
#23412Manufacturing method of a semiconductor device
#23413Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#23414Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
#23415Power electronics equipments
#23416Method for producing semiconductor package
#23417Plating apparatus, plating method and manufacturing method for semiconductor device
#23418INTEGRATED CIRCUIT PACKAGE HAVING STACKED INTEGRATED CIRCUITS AND METHOD THEREFOR
#23419Manufacturing method of semiconductor device
#23420Microelectronic devices and methods for manufacturing microelectronic devices
#23421Semiconductor component having test pads and method and apparatus for testing same
#23422OPTICAL COMMUNICATION MODULE
#23423Optocoupler for converting optical signals into electrical signals and vice versa
#23424Electret condenser
#23425Optical semiconductor device
#23426Laser diode package utilizing a laser diode stack
#23427Laser diode package utilizing a laser diode stack
#23428Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#23429Power electronics equipment for transmitting signals to switching devices through air-cored insulating transformer
#23430Wavelength-converting casting composition and light-emitting semiconductor component
#23431Illumination assembly with enhanced thermal conductivity
#23432Electronic component integrated module
#23433Memory card structure and method for manufacturing the same
#23434Flip-chip type semiconductor device
#23435Carrierless chip package for integrated circuit devices, and methods of making same
#23436Micro-element package having a dual-thickness substrate and manufacturing method thereof
#23437Aluminum bump bonding for fine aluminum wire
#23438Device having a contacting structure
#23439Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
#23440Power semiconductor module
#23441METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#23442Multichip module with improved system carrier
#23443Integrated circuit package system
#23444Semiconductor package with heat spreader
#23445Multichip package system
#23446Integrated circuit package on package system
#23447Integrated circuit package-in-package system
#23448Semiconductor package with enhancing layer and method for manufacturing the same
#23449Semiconductor device
#23450Semiconductor package containing multi-layered semiconductor chips
#23451Semiconductor device
#23452Chip-scale package
#23453Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#23454Leadless leadframe implemented in a leadframe-based BGA package
#23455Connecting a plurality of bond pads and/or inner leads with a single bond wire
#23456Chip Package Structure
#23457Chip package and wafer treating method for making adhesive chips
#23458Method for making QFN package with power and ground rings
#23459Semiconductor chip assembly
#23460Semiconductor Device Including a Plurality of Semiconductor Chips Packaged in a Common Housing
#23461Chip packaging structure for improving reliability
#23462Vertical semiconductor power switch, electronic component and methods of producing the same
#23463Integrated passive device substrates
#23464Image sensor package structure
#23465Microelectromechanical system assembly and method for manufacturing thereof
#23466SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#23467Power semiconductor device
#23468GaAs integrated circuit device and method of attaching same
#23469Light emitting diode package structure and method of manufacturing the same
#23470Semiconductor light emitting element mounting member, and semiconductor light emitting device employing it
#23471Light emitting device with resin layer containing blue, green and red emitting phosphors which emits white light when excited by ultraviolet light
#23472Compound semiconductor light-emitting device with AlGaInP light-emitting layer formed within
#23473Production system
#23474Epoxy resin composition for encapsulating semiconductor and semiconductor device
#23475Wire bonding method for preventing polymer cracking
#23476Method, system, and apparatus for gravity assisted chip attachment
#23477Method and structure for improving bonding reliability in bond pads
#23478Method for fabricating a semiconductor package
#23479Method for manufacturing semiconductor device
#23480Method and device including reworkable alpha particle barrier and corrosion barrier
#23481Silicone Adhesive
#23482Method for manufacturing semiconductor device
#23483Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
#23484Laser assembly with integrated photodiode
#23485Backlight module and driving circuit board of light emitting diodes
#23486Light module, light multiple module and use of a light module or light multiple module for illumination or backlighting
#23487High-density illumination system
#23488Liquid crystal display systems including LEDs
#23489Imager module optical focus and assembly method
#23490Image Sensor Package and Method for Manufacturing the Same
#23491RF power module
#23492MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
#23493Composite bump
#23494Multi-chip package
#23495Method of forming a bump and a connector structure having the bump
#23496Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
#23497Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
#23498Integrated circuit package on package system
#23499Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#23500Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods
#23501Semiconductor device
#23502Board on chip package and manufacturing method thereof
#23503Integrated circuit package system having interconnect stack and external interconnect
#23504Stacked microelectronic device assemblies
#23505Structure of stacked integrated circuits and method for manufacturing the same
#23506Integrated device having a plurality of chip arrangements and method for producing the same
#23507Stacked integrated circuits package system with passive components
#23508Semiconductor device and method of manufacturing the same
#23509Package structure for electronic device
#23510Gold-bumped interposer for vertically integrated semiconductor system
#23511Integrated circuit package system
#23512Integrated circuit package in package system
#23513Semiconductor package system with substrate having different bondable heights at lead finger tips
#23514Chip carrier with reduced interference signal sensitivity
#23515Micro-element package and manufacturing method thereof
#23516Semiconductor device
#23517GaAs power transistor
#23518Lighting device and display device provided with the same
#23519Lead frame and light emitting device package using the same
#23520Stacked image sensor optical module and fabrication method
#23521Electronic component with varying rigidity leads using Pb-free solder
#23522Integrated circuit leaded stacked package system
#23523Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#23524Semiconductor device and manufacturing process thereof
#23525Ball grid array substrate having window and method of fabricating same
#23526Method for removing residual flux
#23527Method for forming reinforced interconnects on a substrate
#23528Wafer bonding of damascene-patterned metal/adhesive redistribution layers
#23529Semiconductor device and method of manufacturing the same
#23530SiP module with a single sided lid
#23531FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#23532Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#23533Fiber-coupled optical device mounted on a circuit board
#23534Optical device and method for manufacturing the same
#23535Semiconductor device
#23536Integrating a heat spreader with an interface material having reduced void size
#23537Electronic substrate, semiconductor device, and electronic device
#23538Red line emitting phosphors for use in led applications
#23539Yellow light emitting device with high luminance
#23540Chip package and method for fabricating the same
#23541Stacked semiconductor device and device stacking method
#23542Layer between interfaces of different components in semiconductor devices
#23543Solder bump structure for flip chip package and method for manufacturing the same
#23544SEMICONDUCTOR DEVICE WITH BATTERY
#23545Bond pad structure for wire bonding
#23546Semiconductor device having capacitors for reducing power source noise
#23547Microelectromechanical microphone packaging system
#23548Microelectonic packages and methods therefor
#23549Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means
#23550Semiconductor package structure and method for manufacturing the same
#23551MEMS microphone with a stacked PCB package and method of producing the same
#23552Thin film capacitor device used for a decoupling capacitor and having a resistor inside
#23553SEMICONDUCTOR LIGHT-EMITTING DEVICE
#23554Method for diffusion soldering
#23555Horn-holder pivot type bonding apparatus
#23556Compliant wirebond pedestal
#23557Circuit device and method of manufacturing the same
#23558Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#23559Wireless communication system
#23560Sub-assembly
#23561STACKED CONTACT BUMP
#23562MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#23563Chip packaging process
#23564Semiconductor package and method for fabricating the same
#23565Semiconductor package
#23566Method for manufacturing semiconductor device
#23567Method for fabricating stacked semiconductor components with through wire interconnects
#23568Motor drive
#23569Electronic device
#23570Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same
#23571Semiconductor device and method of manufacturing semiconductor device
#23572Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus
#23573Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
#23574Semiconductor device
#23575Semiconductor Chip For Driving Light Emitting Element, Light Emitting Device And Lighting Equipment
#23576Semiconductor device with semiconductor device components embedded in plastic package compound
#23577Stackable integrated circuit package system with multiple interconnect interface
#23578Wiring configuration for semiconductor component
#23579System for fabricating semiconductor components with through wire interconnects
#23580Electronic assembly and method for forming the same
#23581METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE
#23582Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
#23583Wiring board with connection electrode formed in opening and semiconductor device using the same
#23584Stacked integrated circuit package system
#23585Chip package
#23586Post passivation interconnection schemes on top of the IC chips
#23587Semiconductor apparatus
#23588Semiconductor device, electronic device and fabrication method of the same
#23589Base semiconductor chip, semiconductor integrated circuit device, and semiconductor integrated circuit device manufacturing method
#23590Flip-Chip Device Having Underfill in Controlled Gap
#23591Bond pad structures with reduced coupling noise
#23592Stackable integrated circuit package system
#23593Thermally-enhanced ball grid array package structure and method
#23594Semiconductor device and semiconductor module therewith
#23595Power semiconductor device and method for producing it
#23596Printed board and semiconductor integrated circuit
#23597Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
#23598INTEGRATED CIRCUIT CHIP AND PACKAGE
#23599Image sensor package
#23600Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#23601No lead package with heat spreader
#23602Multi-row lead frame
#23603Integrated circuit package system including die stacking
#23604Transmission line substrate and semiconductor package
#23605Semiconductor bulk resistance element
#23606Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device
#23607LED ASSEMBLY AND MANUFACTURING METHOD
#23608Light emitting device package and method of manufacturing the same
#23609Housed optoelectronic component
#23610Light emitting device
#23611Power surface mount light emitting die package
#23612Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
#23613Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
#23614CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE
#23615Manufacturing method of semiconductor module including solid-liquid diffusion joining steps
#23616Semiconductor device and manufacturing method for the same
#23617Processed wafer via
#23618Semiconductor element
#23619Method for manufacturing thin film transistor
#23620Method of resin sealing electronic part
#23621Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
#23622Manufacturing method of semiconductor device
#23623Manufacturing method of semiconductor device
#23624Method and apparatus for forming stacked die and substrate structures for increased packing density
#23625Manufacturing method of semiconductor device
#23626Semiconductor device and manufacturing the same
#23627Stacked chip-based system and method
#23628Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
#23629Method of manufacturing light emitting diode package
#23630Epoxy resin composition and semiconductor device
#23631Compact camera module and the substrate thereof
#23632Optical device, optical connector, electronic device, and electronic equipment
#23633DC/DC converter
#23634Memory module device
#23635Overload protection for controllable current consumers
#23636Packaging structure and method of an image sensor module
#23637Light emitting diode substrate, method of manufacturing the same, and liquid crystal display device using the same
#23638Method of assembling and testing an electronics module
#23639Semiconductor device and method of manufacturing semiconductor device
#23640Light emitting device including adhesion layer
#23641White light emitting device
#23642Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same
#23643Phosphor, production method thereof and light emitting instrument
#23644Light emitting apparatus and method for producing the same
#23645Light emitting diode package structure and fabricating method thereof
#23646Integrated circuit package system with L-shaped leadfingers
#23647Integrated circuit package system with bonding lands
#23648Cap layer for an aluminum copper bond pad
#23649Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
#23650Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package
#23651Semiconductor device
#23652Integrated circuit architecture for reducing interconnect parasitics
#23653Apparatus for integrated input/output circuit and verification method thereof
#23654Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device
#23655Power semiconductor modules having a cooling component and method for producing them
#23656Redistributed solder pads using etched lead frame
#23657Substrate having a functionally gradient coefficient of thermal expansion
#23658Ball grid array package
#23659SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#23660Electronic circuit, a semiconductor device and a mounting substrate
#23661Substrate of chip package and chip package structure thereof
#23662Pressure contact power semiconductor module
#23663Semiconductor package including transformer or antenna
#23664Chip package and stacked structure of chip packages
#23665Integrated circuit package system with die on base package
#23666Stacked integrated circuit package-in-package system with recessed spacer
#23667LIGHT EMITTING DIODE PACKAGE AND FABRICATING METHOD THEREOF
#23668Semiconductor module and method of manufacturing the same
#23669Semiconductor device
#23670Semiconductor apparatus containing multi-chip package structures
#23671Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies
#23672Light emitting diode module
#23673Light emitting device having vertical structure, package thereof and method for manufacturing the same
#23674Light emitting diode package
#23675Optical data communication module
#23676Light emitting device package and method of manufacturing the same
#23677Light emitting diode package and method of manufacturing the same
#23678White-Light Emitting Device, and Phosphor and Method of Its Manufacture
#23679Compact optical module for fluorescence excitation and detection
#23680Bonding method and apparatus
#23681Semiconductor pressure sensor and die for molding a semiconductor pressure sensor
#23682Method of manufacturing circuit device
#23683Method of manufacturing an inlet member for an electronic tag
#23684LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN
#23685RF module including control IC without the aid of a relay pad
#23686Semiconductor device and method for manufacturing the semiconductor device
#23687Circuit structure with multifunction circuit cover
#23688Hermetically sealed ceramic package
#23689Printed board with a pin for mounting a component
#23690Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
#23691Method for manufacturing a substrate with cavity
#23692Wafer level packaging to lidded chips
#23693Electronic device and method of manufacturing the same
#23694Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
#23695Semiconductor chip package having an adhesive tape attached on bonding wires
#23696Wafer level chip packaging
#23697Integrated circuit package system with exposed interconnects
#23698Method of manufacturing semiconductor device
#23699METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
#23700Image sensor packaging structure and method of manufacturing the same