High intensity utility light

LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME

Electronic assembly with detachable components

Semiconductor device having improved wire-bonding reliability and method of manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

Nanoscale probes for electrophysiological applications

Integrated circuit package system with heat sink

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Package on package design a combination of laminate and tape substrate, with back-to-back die combination

Connection structure and method for fabricating the same

Method of fabricating semiconductor memory device and semiconductor memory device driver

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Method of fabricating a 3-D package stacking system

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Patterned gold bump structure for semiconductor chip

Chip with bump structure

Semiconductor device

Power semiconductor modules and method for producing them

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Encapsulation and methods thereof

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Stacked chip semiconductor device and method for manufacturing the same

Coreless substrate and manufacturing thereof

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Optical apparatus

Semiconductor device and method of manufacturing the same

Wire bond and redistribution layer process

Light emitting device and method of fabricating the same

Semiconductor device

LED Illumination Apparatus and Card-Type LED Illumination Source

Method of producing a semiconductor device by forming an oxide film on a resin layer

Light-emitting device and method for manufacturing the same

ILLUMINATING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME

Compact multi-LED light source with improved heat dissipation

OPTICAL COUPLING DEVICE

Contactless transponder

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method for forming a stud bump

Method for making a surface acoustic wave device package

Method for fabricating a through-hole interconnection substrate

Printed wiring board with component mounting pin and electronic device using the same

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Ceramic multilayer substrate

Printed circuit board, method of producing the same, and electronic unit

Encapsulant composition and electronic package utilizing same

Active area bonding compatible high current structures

Methods of forming metal layers using multi-layer lift-off patterns

Method for producing a surface-mountable semiconductor component

Method of forming a thin film capacitor

Method for manufacturing physical quantity sensor

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Solder bump confinement system for an integrated circuit package

Method of fabricating wafer level package

Composition and method for pre-surgical skin disinfection

Multichannel opticalcommunication module and method of producing multichannel opticalcommunication module

Method and structure for coupling two microcircuits

Optical device

Apparatus and method for manufacturing semiconductor device

LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members

Solid-state imaging device and electronic endoscope using the same

Radio communication device

Impedance matching commonly and independently

Vehicle Rotating Electric Machine

Light-emitting device

Phosphor based light source component

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device

Wafer level chip scale package (WLCSP) with high reliability against thermal stress

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

CHIP CONNECTOR

Semiconductor device having a bump formed over an electrode pad

Integrated circuit package system including zero fillet resin

Plurality of devices attached by solder bumps

Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Wiring board with conductive wirings and protrusion electrodes

Solder bump on a semiconductor substrate

Semiconductor device with an improved solder joint

Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device having through contact blocks with external contact areas

Package structure of a microphone

Semiconductor device

Module part

Stacked integrated circuit package system with face to face stack configuration

Semiconductor device package and methods for producing same

Stacked semiconductor device

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Bare chip embedded PCB

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Lead frame including suspending leads having trenches formed therein

Semiconductor device and manufacturing method thereof

Microelectromechanical semiconductor component with cavity structure and method for producing the same

Semiconductor device, electronic device, and manufacturing method of the same

Semiconductor device with visible indicator and method of fabricating the same

Interdigitated conductive lead frame or laminate lead frame for GaN die

Electronic module with stacked semiconductors

Light emitting diode having enhanced side emitting capability

Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same

Semiconductor light emitting device and its manufacture method

Light emitting diode package

Structure for a single light source multicolor LED

Semiconductor device having transparent member and manufacturing method of the same

Method of reeling a series of RFID tags and RFID tag roll

Bond capillary design for ribbon wire bonding

Method for setting capillary contact position data and wire bonding apparatus using the same

WIRE BONDING METHOD AND APPARATUS

Ground shields for semiconductors

Solder composition and method of bump formation therewith

Electronic circuit module and method for fabrication thereof

Gallium nitride based III-V group compound semiconductor device and method of producing the same

Method for forming multi-layer bumps on a substrate

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Method for fabricating a photosensitive semiconductor package

Method for manufacturing a surface mount device

Fabrication of an integrated circuit package

Method of packaging semiconductor die without lead frame or substrate

Composite interconnect structure using injection molded solder technique

Method of manufacturing semiconductor device

Hybrid multilayer substrate and method for manufacturing the same

LED illumination assembly with compliant foil construction

Micromechanical Getter Anchor

Operating device for an electrical appliance and electrical appliance having such an operating device

Method and apparatus for current and temperature measurement in an electronic power circuit

Probe For Semiconductor Devices

Phoshor and light-emitting diode

Semiconductor device and method of manufacturing thereof

Circuit device

Structure and method for bond pads of copper-metallized integrated circuits

Wiring board and semiconductor apparatus

Power semiconductor component having chip stack

Semiconductor device

Semiconductor device having tin-based solder layer and method for manufacturing the same

Bonding pad structure

Cascoded rectifier package

Wafer level chip scale package having a gap and method for manufacturing the same

Plastic ball grid array package with integral heatsink

Solder wall structure in flip-chip technologies

Thin integrated circuit device packages for improved radio frequency performance

Integrated circuit underfill package system

Semiconductor package

Waferscale package system

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Multi-chips stacked package

Semiconductor module having a semiconductor chip stack and method

Semiconductor die assembly

Stack of semiconductor chips

Functional device-mounted module and a process for producing the same

Semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS

Multi-chips module package and manufacturing method thereof

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor device

Series connection of a diode laser bar

Method of manufacturing semiconductor device including bonding pad and fuse elements

Semiconductor device including fuse elements and bonding pad

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level package having floated metal line and method thereof

LED package

Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device

Optical semiconductor device and circuit

Semiconductor light emitting device with transparent substrate and reflective slope

Structure for integrating LED circuit onto heat-dissipation substrate

Thin-film capacitor and method of manufacturing the same

Image sensing devices, image sensor modules, and associated methods

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Method of manufacturing multi-layer wiring board

Methods for fabricating stiffeners for flexible substrates

Method of packaging a semiconductor die and package thereof

Tooling for coupling multiple electronic chips

Three-dimensional package and method of making the same

Semiconductor apparatus manufacturing method

Fabrication and packaging of suspended microchannel detectors

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Optical bond-wire interconnections and a method for fabrication thereof

DEVICE HAVING AN ARRAY OF NON-VOLATILE MEMORY CELLS AND A METHOD FOR ALTERING A STATE OF A NON-VOLATILE MEMORY CELL

Dual path acoustic data coupling system and method

Illumination device with at least one LED as the light source

Phosphor and light emitting device using the same

Acoustic data coupling system and method

Mold flash removal process for electronic devices

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Flip-chip light emitting diode with high light-emitting efficiency

Apparatus for solder crack deflection

Semiconductor device and method for fabricating the same

Printed circuit board for semiconductor package and method of manufacturing the same

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Buried via technology for three dimensional integrated circuits

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Multichip stack structure

Low profile semiconductor system having a partial-cavity substrate

Integrated circuit package system including wide flange leadframe

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor memory card

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

CHIP CARD MODULE

Light emitting module and process thereof

Semiconductor photodetector with converging structure on light receiving surface sealed with optical transmitting resin containing micro particles

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device having flange structure

Padless die support integrated circuit package system

Integrated circuit package system with multiple molding

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Arrangements for an integrated sensor

Discrete stress isolator attachment structures for MEMS sensor packages

CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING

Group III nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same

Light emitting diode package with coaxial leads

Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same

Semiconductor light emitting device and semiconductor light emitting device assembly

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

Triaxial through-chip connection

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device, method of manufacturing the same, and camera module

Circuit board and package structure thereof

Methods for fabricating chip-scale packages having carrier bonds

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

Multi-chip stack package and fabricating method thereof

Electronic component and method for its assembly

Components, methods and assemblies for multi-chip packages

Method of forming a microelectronic package and microelectronic package formed according to the method

OVERMOLDED OPTICAL PACKAGE

LED arrangement

Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure

Dicing/die bonding film and method of manufacturing the same

Optical communication module

Semiconductor laser device, method for manufacturing the same and optical pickup apparatus

Nonvolatile memory system

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Interconnection pattern design

Digital camera module using stacked chip package

Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

Semiconductor device and electric apparatus

Circuit device

Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

Dispensed electrical interconnections

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Power configuration method for structured ASICs

Integrated circuit (IC) carrier assembly with suspension means

BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Semiconductor package and fabricating method thereof

Integrated circuit having second substrate to facilitate core power and ground distribution

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

Interconnects with interlocks

Semiconductor device having alignment post electrode and method of manufacturing the same

Carbon nanotube circuit component structure

Package board having internal terminal interconnection and semiconductor package employing the same

Thermally enhanced semiconductor package and method of producing the same

Thermal interconnect and interface systems, methods of production and uses thereof

Semiconductor package

Semiconductor wafer scale package system

Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package structure and fabrication method thereof

Semiconductor package with integrated heatsink and electromagnetic shield

Light emitting diode packaging structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadless lead-frame

Low cost method to produce high volume lead frames

Semiconductor package

Semiconductor package structure and fabrication method thereof

Semiconductor package and process for making the same

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Semiconductor device and fabrication method thereof

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

III nitride semiconductor crystal and manufacturing method thereof, III nitride semiconductor device manufacturing method thereof, and light emitting device

[LED LAMP]

Light emitting device and method for producing the same

Semiconductor chip with bond area

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Camera module for compact electronic equipments

Power-electronic-cooling device

Strip for integrated circuit packages having a maximized usable area

Stacked module and manufacturing method thereof