Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure

Semiconductor device and method of manufacturing the same

Power semiconductor device having lines within a housing

Package structure of light emitting diode

Composite phosphor powder, light emitting device using the same and method for manufacturing composite phosphor powder

Light emitting diode package with diffuser and method of manufacturing the same

Substrate-based white light diode

Light source with UV LED and UV reflector

White light LED

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

Angular velocity mount arrangement

Package structure for an acceleration sensor

Method of manufacturing wiring board

BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for producing semiconductor device and semiconductor device

Electronic package for image sensor, and the packaging method thereof

Bonding program

Opto-electronic package, and methods and systems for making and using same

Vehicle lighting device and LED light source therefor

Method for producing an electronic component or module and a corresponding component or module

Liquid crystal display device and manufacturing method thereof

High frequency package, transmitting and receiving module and wireless equipment

Actuator and bonding apparatus

Two layer substrate ball grid array design

Encapsulated chip scale package having flip-chip on lead frame structure and method

Printed circuit board and method thereof and a solder ball land and method thereof

Semiconductor device and method of producing the same

Multi-chip package for reducing parasitic load of pin

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method of packaging and interconnection of integrated circuits

Thermally enhanced cavity down ball grid array package

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Heat-conducting packaging of electronic circuit units

Underfilled semiconductor die assemblies and methods of forming the same

Semiconductor component comprising an interposer substrate

Power semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device

Semiconductor power component with a vertical current path through a semiconductor power chip

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Semiconductor device

MOSFET package

MOSFET package

Leadframe package with dual lead configurations

Method of manufacturing an insulating target material

High current semiconductor device system having low resistance and inductance

Partially etched leadframe packages having different top and bottom topologies

Micromechanical component

Bi-directional switch, and use of said switch

Semiconductor connection component

Semiconductor device and capacitance regulation circuit

Semiconductor device and capacitance regulation circuit

LED package and fabrication method thereof

METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY

Method for forming metal pad in semiconductor device

Method and apparatus for fine pitch solder joint

Manufacturing method of semiconductor device

Semiconductor device and a manufacturing method of the same

Multichip packages with exposed dice

Semiconductor package with contact support layer and method to produce the package

Method And Device For Enhancing Solderability

Bonding apparatus

Bonding pattern discrimination device

Bonding pattern discrimination program

System and method for optically interconnecting memory devices

Lighting system and display apparatus using the same

Phosphor and optical device using same

Thickness tapered substrate launch

Semiconductor chip and multi-chip package

Semiconductor device, laminated semiconductor device, and wiring substrate

Bonded structure and bonding method

Semiconductor device with improved contacts

Semiconductor device and method of manufacturing the same

Semiconductor Apparatus and Semiconductor Module

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Multi-chip semiconductor device package

Stack structure with semiconductor chip embedded in carrier

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Thin IC package for improving heat dissipation from chip backside

Differential chip performance within a multi-chip package

Stackable single package and stacked multi-chip assembly

Semiconductor module

Semiconductor device and a manufacturing method of the same

Semiconductor device electronic component, circuit board, and electronic device

Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector

Optical semiconductor device and method of manufacturing the same

Package frame and semiconductor package using the same

Semiconductor assembly and packaging for high current and low inductance

Microelectronic imaging units

Semiconductor device

Insulated gate semiconductor device and manufacturing method thereof

Diode housing

PLCC package with integrated lens and method for making the package

Green-emitting LED

Light emitting device

Photosensitive device that easily achieves a required photosensitive response

Image sensor chip package

Semiconductor device

Circuit board and manufacturing method thereof

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Packaged integrated circuit having a heat spreader and method therefor

Mounting structure, electro-optical device, and electronic apparatus

Copper-metallized integrated circuits having electroless thick copper bond pads

Solder composition for electronic devices

LED package having recess in heat conducting part

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

Liquid crystal display devices

Display device having an anisotropic-conductive adhesive film

Mobile telephone with built in camera and flash

Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component

Method for fabricating semiconductor package with heat sink

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Chip packaging structure without leadframe

Electrical component having a reduced substrate area

Board-on-chip package and stack package using the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Semiconductor device

Integrated circuit with low-stress under-bump metallurgy

Package module having a stacking platform

SEMICONDUCTOR DEVICE

Integrated circuit package and method of assembling the same

Multilayered circuit substrate and semiconductor package structure using the same

Power plane design and jumper wire bond for voltage drop minimization

Stack package implementing conductive support

Semiconductor pressure sensor

SEMICONDUCTOR DEVICE

Jig structure for manufacturin a stacked memory card

Semiconductor device and method of manufacturing the same

Enhanced multi-die package

Radio frequency over-molded leadframe package

Inter-chip ESD protection structure for high speed and high frequency devices

Radiation sensor, waver, sensor module, and method for the production a radiation sensor

Package Structure and Wafer Level Package Method

Integrated sensor and circuitry and process therefor

Polysilicon film with increased roughness

LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the method

Nitride semiconductor light-emitting device

LED package and method for fabricating the same

Packages for semiconductor light emitting devices utilizing dispensed encapsulants

Blue light-emitting phosphor and light-emitting device using the same

Side-view light emitting diode having protective device

Light emitting chip carrier structure

Semiconductor device

Image sensing module and process for packaging the same

SEMICONDUCTOR DEVICE

Multilayer printed wiring board

Physical quantity sensor and manufacturing method therefor

Fluxless bumping process

Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound

Semiconductor device and method of manufacturing the same

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

Metal pad or metal bump over pad exposed by passivation layer

No flow underfill device and method

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Method of making a stacked die package

Roll-to-roll fabricated encapsulated semiconductor circuit devices

Roll-to-roll fabricated electronically active device

Methods of bonding two semiconductor devices

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Electronic device and thermal type flow meter on vehicle

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Bidirectional transceiver assembly for POF application

System and method for optically interconnecting memory devices

Embedded actives and discrete passives in a cavity within build-up layers

Electronic package and method of cooling electronics

Scalable subsystem architecture having integrated cooling channels

Liquid crystal display and method for manufacturing the same having particular pad unit

Liquid crystal display and method for manufacturing the same

Micro-mirror device package and method for fabricating the same

Radio frequency power amplifier module

Output match transistor

High frequency power amplifier

Semiconductor power device and RF signal amplifier

Connection unit, a board for mounting a device under test, a probe card and a device interfacing part

Phosphor based on a combination of quantum dot and conventional phosphors

Luminophore-Based Led and Corresponding Luminous Substance

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Semiconductor device

Planar bond pad design and method of making the same

Semiconductor element with conductive bumps and fabrication method thereof

Flip chip interface including a mixed array of heat bumps and signal bumps

Semiconductor package

Flip chip package with reduced thermal stress

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

On-chip test circuit for assessing chip integrity

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Dual BGA alloy structure for improved board-level reliability performance

Method of fabricating self-assembled electrical interconnections

Self-assembled interconnection particles

Semiconductor device, electronic module, and method of manufacturing electronic module

Semiconductor package with ferrite shielding structure

Microelectronic bond pad

Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Integrated circuit chip and integrated device

Semiconductor device, power amplifier device and PC card

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Semiconductor device having capacitors for reducing power source noise

Integrated circuit cooling system and method

LED package structure and manufacturing method, and LED array module

Substrate based IC-package

Copper substrate with feedthroughs and interconnection circuits

Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Method of manufacturing an IC card

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor package and manufacturing method thereof

Package structure having recession portion on the surface thereof and method of making the same

Chip package with asymmetric molding

Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package

Semiconductor device and oscillator

Semiconductor device

Semiconductor element

Led lighting source and led lighting apparatus

Semiconductor apparatus having conductive layers and semiconductor thin films

Feed through structure for optical semiconductor package

Image sensor chip package

RFID tag and manufacturing process thereof

Wire bonding method and device of performing the same

Packaging method

Method and system for customized radio frequency shielding using solder bumps

Sensor device having a buffer element between the molding and the sensing element

Biocompatible bonding method and electronics package suitable for implantation

Semiconductor device that suppresses variations in high frequency characteristics of circuit elements

Semiconductor device

Method for modifying surface of substrate and method for manufacturing semiconductor device

Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device

Electrical connections in substrates

Methods for forming flexible column die interconnects and resulting structures

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Self alignment features for an electronic assembly

Forming of conductive bumps for an integrated circuit

Multilayer structure having a warpage-compensating layer

Method for forming high reliability bump structure

Manufacturing process for chip package without core

Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography

Circuit board structure integrated with semiconductor chip and method of fabricating the same

Method and apparatus for attaching microelectronic substrates and support members

Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate

Low profile, chip-scale package and method of fabrication

Semiconductor device having a ferroelectric capacitator

Packaging method for segregating die paddles of a leadframe

Optical module

Sub-mount for mounting optical component, manufacturing method thereof, and light transmission and reception module

Light emitting diode package having dual lens structure for lateral light emission

Device, system and electric element

Transient voltage protection circuit boards and manufacturing methods

Micro camera module and method of manufacturing the same

Optical device, optical device apparatus, camera module, and optical device manufacturing method

Image sensor device and methods thereof

Low pass filter and electronic device

Magnetic sensor

Lighting and/or signalling device for a vehicle, associated with electronics with a high level of integration

Phosphor, production method thereof and light-emitting device using the phosphor

Oxynitride phosphor and light-emitting instrument

Device and method for emitting output light using multiple light sources with photoluminescent material

Piezoelectric device

Integrated circuit pad with separate probing and bonding areas

Relay board with bonding pads connected by wirings

Connection element for a semiconductor component and method for producing the same

Method and apparatus for attaching microelectronic substrates and support members

Stress and force management techniques for a semiconductor die

Polygonal, rounded, and circular flip chip ball grid array board

Security apparatus

Dummy structures extending from seal ring into active circuit area of integrated circuit chip

Semiconductor integrated circuit device and process for manufacturing the same

Wafer-level-chip-scale package and method of fabrication

Reduced inductance in ball grid array packages

Multi-component integrated circuit contacts

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Ball grid array package and substrate within

Semiconductor device

Semiconductor chip package

Wiring substrate and semiconductor package implementing the same

Image sensor package, optical glass used therein, and processing method of the optical glass

Electronic component and electronic configuration

Semiconductor device and method of manufacturing the same

Packaging for high speed integrated circuits

Composite metal column for mounting semiconductor device

Semiconductor device and method of manufacturing the same

Optimized multi-apparation assembly

Stacked semiconductor package having adhesive/spacer structure and insulation

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Large die package structures and fabrication method therefor

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Electronic device and carrier substrate for same

Light sensor receiving light from backside

High-frequency device including high-frequency switching circuit

Side view LED with improved arrangement of protection device