Magnetic device having a conductive clip

Power module with a magnetic device having a conductive clip

Method of forming a magnetic device having a conductive clip

Contact carriers (tiles) for populating larger substrates with spring contacts

Radiation-emitting component provided with metallic injected-molded carrier

Method and apparatus for facilitating proximity communication and power delivery

CHIP PACKAGE STRUCTURE

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Semiconductor device with pad electrode for testing and manufacturing method of the same

Semiconductor chip and semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and a manufacturing method of the same

Semiconductor package

Semiconductor device for radio frequency applications and method for making the same

Method of forming a molded array package device having an exposed tab and structure

Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices

Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die

Integrated circuit package system with multi-surface die attach pad

LIGHT EMITTING DIODE AND THE PACKAGE STRUCTURE THEREOF

Composite semiconductor device having a thyristor structure

High power light emitting diode package

Optical device

Light emitting apparatus

Packaging structure of a light-sensing element with reduced packaging area

Semiconductor failure analysis tool

Method for reducing loadline impedance in a system

Method of forming a power module with a magnetic device having a conductive clip

Semiconductor device and method for manufacturing the same

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor constructions comprising multi-level patterns of radiation-imageable material

Depopulation of a ball grid array to allow via placement

Die package and method for making the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method and system for hermetically sealing packages for optics

Methods for protecting metal surfaces

Packaged microphone with electrically coupled lid

Transmitter optical subassembly and a transmitter optical module installing the same

Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology

Packaged electronic devices and process of manufacturing same

Light emitting device package and backlight unit using the same

Image sensor and method of manufacturing thereof

High-efficiency led-based illumination system with improved color rendering

Light emitting device and method for manufacturing the same

Coil construction

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Modular bonding pad structure and method

Stacked die semiconductor package

Flash memory card

Semiconductor device featuring large reinforcing elements in pad area

Semiconductor device having shield structure

Flash memory card

Packaged die on PCB with heat sink encapsulant and methods

Cavity chip package

Semiconductor IC-embedded substrate and method for manufacturing same

Package with barrier wall and method for manufacturing the same

Semiconductor sensor device with sensor chip and method for producing the same

Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip

Chip stacking structure

Integrated circuit solder bumping system

Package of leadframe with heatsinks

Power semiconductor module with MOS chip

Molded semiconductor package

Radio recognition semiconductor device and its manufacturing method

INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Method for producing a solid-state imaging device

Optoelectronics processing module and method for manufacturing thereof

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

Semiconductor light-emitting device and method

Light emitting device

LSI design support apparatus and LSI design support method

Method and system of trace pull test

Method of manufacturing a contactless card

Electronic plug unit

Semiconductor device and a method of manufacturing the same

Method for manufacturing substrate with cavity

Semiconductor manufacturing method

Method of forming an electrical contact

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Method for manufacturing substrate with cavity

Method of forming a semiconductor device

Method for manufacturing substrate with cavity

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Decoupling capacitor closely coupled with integrated circuit

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Optical module with can package

Illumination device for providing directionally guided light

Lens having fresnel lens surface(s) and lighting apparatus using it

Cooling system for a semiconductor device and method of fabricating same

Ceramic capacitor

Solid-state imaging device

Wire sweep resistant semiconductor package and manufacturing method therefor

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Display device and manufacturing method of the same

Semiconductor device

Chip package structure and bumping process

Method for forming component mounting hole in semiconductor substrate

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

Semiconductor package with internal shunt resistor

BGA package with stacked semiconductor chips and method of manufacturing the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Chip package structure and bumping process

Integrated circuit protruding pad package system

Light emitting diode package and light emitting diode system having at least two heat sinks

Integrated circuit package system with adhesive restraint

Method for producing bonding connection of semiconductor device

Electronic assembly that includes pads having a bowl shaped upper section

DISPLACEMENT DETECTION DEVICE

Semiconductor apparatus integrating an electrical device under an electrode pad

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor package

LED package

Semiconductor laser device and manufacturing method thereof

LED reflecting plate and LED device

Radiation sensor device and method

Image sensing device package structure

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Monitoring deformation and time to logically constrain a bonding process

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

INDUCTIVE STRUCTURE

Flexible assembly of stacked chips

Rigid-flexible printed circuit board for package on package and manufacturing method

Manufacturing method of a semiconductor device to suppress generation of whiskers

Method of forming an electrical contact

Semiconductor package with a support structure and fabrication method thereof

Method of manufacturing quad flat non-leaded semiconductor package

Multiple chip semiconductor package

Method for manufacturing semiconductor package

Optical module and data communication system including the optical module

Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device

Condenser microphone

Front end module

Lighting device with light guide plate illuminated by LED

Apparatuses and methods for high speed bonding

Illumination device and display device provided with the same

Semiconductor chip having bond pads

Integrated circuit die configuration for packaging

Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package

Method of manufacturing a semiconductor device

Semiconductor device having metallic plate with groove

External contact material for external contacts of a semiconductor device and method of making the same

Semiconductor device

Semiconductor device

Semiconductor package having plate interconnections

Semiconductor chip having bond pads and multi-chip package

Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof

Integrated circuit package and method of manufacture thereof

System in package (SIP) structure

Image sensing chip package structure

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Structure of IC packaging and method forming the same

Semiconductor component and method of assembling the same

Power semiconductor device and method therefor

Double-sided package for power module

Interconnects for semiconductor light emitting devices

Package structure for an optical sensor

Digital camera module for detachably mounting with flex printed circuit board

Image sensor chip package fabrication method

Digital camera module package fabrication method

Component mounting method and component-mounted body

Semiconductor device and automotive AC generator

Electronic component embedded board and its manufacturing method

Method for fabricating a contact grid array

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Integrated die bumping process

Multi-chip stack structure

Carrier-free semiconductor package with stand-off member and fabrication method thereof

Method of fabricating organic electroluminescent devices

Wafer level chip size package for CMOS image sensor module and manufacturing method thereof

Metal duplex method

Optical module

Optical transmitting module including laser diode mounted on driver circuit

Manufacturing method of electronic device

Low profile light source utilizing a flexible circuit carrier

Electronic circuit module and manufacturing method thereof

Semiconductor device with operation mode set by external resistor

Liquid crystal display device, semiconductor device, electronic device, and manufacturing method of the liquid crystal display device

Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same

Motor driving inverter circuit module, motor driving apparatus having the motor driving inverter circuit module, and inverter integrated circuit package

Support with solder ball elements and a method for populating substrates with solder balls

Chip structure and chip package structure

Flip-chip packaging process using copper pillar as bump structure

Semiconductor device and method for fabricating the same

Metal duplex method

Integrated circuit chip and manufacturing process thereof

Protective barrier layer for semiconductor device electrodes

Electronic device and method of manufacturing thereof

Semiconductor device and manufacturing method thereof

Semiconductor wafer level chip package and method of manufacturing the same

Electronic device and method of manufacturing same

Semiconductor chip package and method of manufacturing the same

Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Encapsulated electronic part packaging structure

Semiconductor device having a probing region

High density interconnect assembly comprising stacked electronic module

Semiconductor package and manufacturing method thereof

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Multi-chip stacking package structure

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Low height vertical sensor packaging

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device

Resin mold type semiconductor device

Semiconductor package with a conductive post and wiring pattern

Die pad for semiconductor packages and methods of making and using same

Semiconductor device having pads and which minimizes defects due to bonding and probing processes

Metal contact systems for semiconductor-based pressure sensors exposed to harsh chemical and thermal environments

Semiconductor device and power conversion apparatus using the same

Nitride-based semiconductor light-emitting device and method of manufacturing the same

Light emitting diode and method for manufacturing the same

Stack type package module and method for manufacturing the same

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE UTILIZING THE SAME

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Method for producing means of connecting and/or soldering a component

Semiconductor device and method of packaging the same

Bumping process and structure thereof

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Chip package structure and method for manufacturing bumps

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Methods for forming through-wafer interconnects and structures resulting therefrom

Semiconductor device and method of manufacturing the same

Radiant energy heating for die attach

Multi-chip package type semiconductor device

Microfeature workpieces, carriers, and associated methods

Wafer-level package and IC module assembly method for the wafer-level package

Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices

Thin film led

Optical module and optical module package

Receiver chip for forming receiving paths of dual frequency bandwidths on monolithic semiconductor integrated circuit substrate

Semiconductor device integrated with opto-electric component and method for fabricating the same

Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly

Semiconductor module

Edge-lit backlight having light recycling cavity with concave transflector

Illumination assembly and system

Solid image pickup unit and camera module

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Integrated process condition sensing wafer and data analysis system

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Surface acoustic wave device and manufacturing method thereof

Double mold optocoupler

Computing device including a stacked semiconductor device

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Pad open structure

Chip package and bump connecting structure thereof

Board having electronic parts mounted by using under-fill material and method for producing the same

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Method for forming a double embossing structure

Semiconductor packages for surface mounting and method of producing same

Alpha particle shields in chip packaging

Lead-containing solder bumps

Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Lead-containing solder paste

Lead-containing anodes

Semiconductor device and semiconductor chip

Chip package structure

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Wafer integrated rigid support ring

Backside ground type flip chip semiconductor package

Semiconductor device package

Semiconductor multi-chip package including two semiconductor memory chips having different memory densities

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Land grid array semiconductor device packages

Wiring board construction including embedded ceramic capacitors(s)

Wiring board and ceramic chip to be embedded

Printed circuit board assembly with strain-alleviating structures

Quad flat pack (QFP) package and flexible power distribution method therefor

Test carrier for semiconductor components having conductors defined by grooves

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device with reduced thickness of the semiconductor substrate

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

STACKING SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Reversible-multiple footprint package and method of manufacturing

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Methods of forming blind wafer interconnects