Light emitting diode

Light emitting diode device having advanced light extraction efficiency and preparation method thereof

Light emitting diodes with improved light collimation

Surface mount type photo-interrupter and method for manufacturing the same

Light-emitting component provided with a luminescence conversion element

Wiring board and manufacturing method for wiring board

Method and apparatus for providing a solder area on a leadframe

Systems and components for enhancing rear vision from a vehicle

Semiconductor pressure sensor

Electronic component assembly

Electrically connecting substrate with electrical device

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

Fabrication method of semiconductor circuit device

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

Semiconductor device and manufacturing method thereof

Adhesive/spacer island structure for multiple die package

Method for forming bump protective collars on a bumped wafer

Semiconductor device and method of manufacturing thereof

Copper alloy for electronic machinery and tools and method of producing the same

Sub-mount for mounting optical component and light transmission and reception module

Display driver integrated circuit device, film, and module

Shared memory bus architecture for system with processor and memory units

Universal PCB and smart card using the same

Interposer including air gap structure, methods of forming the same, semiconductor device including the interposer, and multi-chip package including the interposer

Light-emitting device

Closed ring structure of electrostatic discharge circuitry

Bumped die and wire bonded board-on-chip package

Semiconductor device and a manufacturing method of the same

ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE

Integrated circuit device and electronic instrument

Method and structure for reduction of soft error rates in integrated circuits

Probing pads in kerf area for wafer testing

Electronic component unit

Semiconductor device

Semiconductor device and electronic apparatus of multi-chip packaging

Self alignment features for an electronic assembly

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Semiconductor power module with SiC power diodes and method for its production

Tape wiring substrate and chip-on-film package using the same

MEMS packaging method for enhanced EMI immunity using flexible substrates

Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

Electronic parts packaging structure and method of manufacturing the same

Semiconductor module

Chip package without core and stacked chip package structure thereof

Packaging of a microchip device

Package substrate and semiconductor package using the same

Semiconductor package having pre-plated leads and method of manufacturing the same

MEMS package using flexible substrates, and method thereof

Isolation structure configurations for modifying stresses in semiconductor devices

Solid state image pickup device and endoscope

Direct FET device for high frequency application

GaN-based light emitting-diode chip and a method for producing same

Light emitting diode package with coaxial leads

Wavelength-convertible light emitting diode package

Light-emitting-diode packaging structure having thermal-electric element

White semiconductor light emitting device

High brightness light-emitting device and manufacturing process of the light-emitting device

Electronic circuit

Method of making an electronic device using an electrically conductive polymer, and associated products

Micro-package, multi-stack micro-package, and manufacturing method therefor

Electronic component package including joint material having higher heat conductivity

Apparatus for authenticating the validity of a device

Method of encapsulating LED light source with embedded lens component

Temperature dependent semiconductor module connectors

Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device

Manufacturing method improving the reliability of a bump electrode

Method of manufacturing optical device having transparent cover and method of manufacturing optical device module using the same

Electronic substrate manufacturing method

Micro-optics on optoelectronics

OPTOELECTRONIC MODULE AND MANUFACTURING METHOD OF SAID MODULE

Semiconductor laser unit and optical pickup device

Electronic substrate and electronic device

Package structure for a semiconductor device incorporating enhanced solder bump structure

Integrated circuit for driving semiconductor device and power converter

Electronic component and manufacturing method thereof

Semiconductor device having a resin protrusion with a depression and method manufacturing the same

Wire-bonding method and semiconductor package using the same

Microelectronic assembly with underchip optical window, and method for forming same

Structure and method for producing multiple size interconnections

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Semiconductor package having dual interconnection form and manufacturing method thereof

Semiconductor device

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

Seedless wirebond pad plating

Semiconductor device

Stack type package

Semiconductor device

Semiconductor device protective structure and method for fabricating the same

High frequency package device with internal space having a resonant frequency offset from frequency used

Ball grid array package enhanced with a thermal and electrical connector

SEMICONDUCTOR MULTI-CHIP PACKAGE

Surface mount package

Semiconductor device, manufacturing method for semiconductor device, and electronic equipment

Method for manufacturing semiconductor chip package

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Optical package with double formed leadframe

Advanced leadframe having predefined bases for attaching passive components

Method of manufacturing a passive integrated matching network for power amplifiers

Method of providing an optoelectronic element with a non-protruding lens

Semiconductor sensor and manufacturing method therefor

Semiconductor device

Backside-illuminated photodetector

White-Light Emitting Device

Light-emitting device

Cavity ball grid array apparatus having improved inductance characteristics

Phosphor and light-emitting equipment using phosphor

IMAGE CAPTURING ELEMENT PACKAGE FOR ELECTRONIC ENDOSCOPE

Method for producing a circuit module

Method for self-assembling microstructures

Method for manufacturing optical module

Method and System for Applying an Adhesive Substance on an Electronic Device

Semiconductor storage device

Biocompatible bonding method and electronics package suitable for implantation

Molding composition and method, and molded article

Curable composition and method

Molding composition and method, and molded article

Multi-step etch for metal bump formation

Trenched MOSFET termination with tungsten plug structures

Substrate warpage control and continuous electrical enhancement

Packaging method for circuit board

Method of reducing warpage in an over-molded IC package

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Chip and multi-chip semiconductor device using the chip, and method for manufacturing same

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

Optical module and optical transmission device

Structure of laser

Planar light source device

PRINTED CIRCUIT BOARD ASSEMBLY

LED array module

Light-emitting device with fluorescent layer

Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material

Bonding apparatus and method

Semiconductor device with semiconductor device components embedded in a plastics composition

Semiconductor device

Semiconductor device with improved signal transmission characteristics

Method of interconnecting terminals and method of mounting semiconductor devices

Semiconductor device advantageous in improving water resistance and oxidation resistance

Semiconductor device and manufacturing method of the same

Under bump metallization design to reduce dielectric layer delamination

Semiconductor device

Stacked semiconductor package

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Anti-warp heat spreader for semiconductor devices

Semiconductor packaging structure

Semiconductor device and method of manufacturing the same

Package for electronic device and method for manufacturing electronic device

System and method for venting pressure from an integrated circuit package sealed with a lid

Apparatus having reduced warpage in an over-molded IC package

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor memory device and manufacturing method thereof

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Semiconductor die package and method for making the same

Semiconductor device and portable apparatus and electronic apparatus comprising the same

Semiconductor device and package, and method of manufacturer therefor

Multi-part lead frame with dissimilar materials

Semiconductor device

Die package with asymmetric leadframe connection

Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion

Semiconductor device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor device and method of manufacturing the same

Vertical structure LED and fabricating method thereof

Semiconductor device for emitting light and method for fabricating the same

Side-view light emitting diode having improved side-wall reflection structure

Coating process for a light-emitting diode (LED)

Semiconductor device and manufacturing method thereof

Semiconductor components and assemblies including vias of varying lateral dimensions

Circuit device and method of manufacturing the same

Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith

Bonding apparatus and method

System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects

Methods of operating electronic devices, and methods of providing electronic devices

Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures

Circuitry component and method for forming the same

Ultrathin semiconductor circuit having contact bumps

Spacer die structure and method for attaching

Methods for bonding and micro-electronic devices produced according to such methods

Method and apparatus for bonding wafers

NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Three dimensional device integration method and integrated device

Stacked die in die BGA package

Manufacturing method for packaged semiconductor device

Heat-dissipating semiconductor package and fabrication method thereof

High Temperature Packaging for Electronic Components, Modules and Assemblies

Grid array connection device and method

Semiconductor device and manufacturing method thereof

Method for manufacturing device having optical semiconductor element

Semiconductor laser device

Mounting and adhesive layer for semiconductor components

Mechanical integrity evaluation of low-k devices with bump shear

Optical device and method for manufacturing the same, optical module, and optical transmission device

Semiconductor light emitting device

Magnetic sensor and current sensor

Post passivation structure for a semiconductor device and packaging process for same

Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof

Semiconductor half-bridge module with low inductance

Radio frequency receiver chip with improved electrostatic discharge level

Semiconductor device

Relay switch including an energy detection circuit

Semiconductor device and method for manufacturing the same

Multi-chip device and method for producing a multi-chip device

Semiconductor device

Semiconductor device and a method of manufacturing the same

Stacked semiconductor component

Semiconductor device and manufacturing method of the same

Intrinsic thermal enhancement for FBGA package

Packaging logic and memory integrated circuits

Stacked memory card and method for manufacturing the same

MEMORY ELEMENT CONDUCTING STRUCTURE

Lead-free semiconductor package

Alignment using fiducial features

Reliable integrated circuit and package

Lead frame for semiconductor package

Semiconductor device

Semiconductor device having firmly secured heat spreader

Semiconductor device

Method for preparing light emitting diode device having heat dissipation rate enhancement

Multiple-chromatic light emitting device

Surface mount light emitting diode (LED) assembly with improved power dissipation

Illuminating device and display device including the same

White-emitting LED having a defined color temperature

OPTOELECTRONIC SEMICONDUCTOR COMPONENT WITH HIGH LIGHT-EMITTING EFFICIENCY

Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip

Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board

Method of manufacturing semiconductor device

Contact Structures Comprising A Core Structure And An Overcoat

Multi-chip device and method for producing a multi-chip device

Semiconductor wafer package and manufacturing method thereof

Method of manufacturing a semiconductor device

Semiconductor device having through electrode and method of manufacturing the same

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Semiconductor packages and methods of manufacturing thereof

Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package

Semiconductor device and system having semiconductor device mounted thereon

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material

Package for light emitting element and manufacturing method thereof

Structure of laser and method of manufacturing the same

Wireless local area network communications module and integrated chip package

Two-beam semiconductor laser apparatus

Lamp, optical module, vehicle headlight including the same, and method for controlling color tone of emitted light

Method for making a pre-laminated inlet

Micro solder pot

Split thin film capacitor for multiple voltages

Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit

Electronic board, method of manufacturing the same, and electronic device

Electronic board, method of manufacturing the same, and electronic device

LED structure for flip-chip package and method thereof

Chip-on-board assemblies

Semiconductor device and circuit board

Low stress chip attachment with shape memory materials

Component with sensitive component structures and method for the production thereof

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

Light-emitting device and light source apparatus using the same

Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module with built-in component

Module having stacked chip scale semiconductor packages

Chip stack package having same length bonding leads

Memory card stack circuit wiring structure

System for hermetically sealing packages for optics

Package structure of chip and the package method thereof

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Chip-package structure and fabrication process thereof

Electronic component comprising a cooling surface

Wafer and single chip having circuit rearranged structure and method for fabricating the same

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

Manufacturing method for a semiconductor device

Power semiconductor module

Light emitting diode device using electrically conductive interconnection section

Light emitting diode package with metal reflective layer and method of manufacturing the same

Side-emitting LED package and manufacturing method of the same

Light-emitting module

Light emitting diode with larger illumination area

Light emitting device and phosphor for the same

Metal salts of maleimide compounds as conductivity promoters

Method for manufacturing optocoupler

Method for recording identification information on semiconductor chip, and imaging device

Method of soldering or brazing articles having surfaces that are difficult to bond

Bond head link assembly for a wire bonding machine

Wiring board, method for manufacturing same, and semiconductor package

Wiring board and method for manufacturing the same

Method of manufacturing a carrier member for electronic components

Apparatus and method for solder ball placement

Curable composition and process for producing cured fluorinated product

Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same

Remote chip attachment