212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Semiconductor integrated device and method for manufacturing same
#27302Adhesive of folder package
#27303Method of manufacturing a semiconductor device
#27304Windowed package having embedded frame
#27305Method for cutting lead terminal of package type electronic component
#27306Thermal interface structure with integrated liquid cooling and methods
#27307Semiconductor package having semiconductor constructing body and method of manufacturing the same
#27308Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
#27309Light emitting diode and fabricating method thereof
#27310Plating apparatus and plating method
#27311Array optical sub-assembly
#27312Light-emitting device, and illumination apparatus and display apparatus using the light-emitting device
#27313Jacketed LED assemblies and light strings containing same
#27314Semiconductor device
#27315Double-sided electronic module for hybrid smart card
#27316Packaging for electronic modules
#27317Stacked electronic component and manufacturing method thereof
#27318Arrangement for energy conditioning
#27319Semiconductor device with mechanism for leak defect detection
#27320Scanning micro-mirror package, method for fabricating the same, and optical scanning device employing the same
#27321Intelligent high-power amplifier module
#27322Light emitting diode assembly using alternating current as the power source
#27323Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
#27324Chip support of a leadframe for an integrated circuit package
#27325Layered microelectronic contact and method for fabricating same
#27326Solder structures for out of plane connections
#27327Semiconductor device and method for manufacturing the same
#27328Semiconductor device and fabrication method thereof
#27329Method of forming a bonding pad structure
#27330Copper interconnect
#27331Semiconductor device for high frequency power amplification
#27332Semiconductor device having exposed heat dissipating metal plate
#27333Integrated circuit packaging device and method for matching impedance
#27334Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#27335Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module
#27336Microelectronic package having stacked semiconductor devices and a process for its fabrication
#27337High power light emitting diode device
#27338Thermal interface structure with integrated liquid cooling and methods
#27339One step capillary underfill integration for semiconductor packages
#27340Micromechanical getter anchor
#27341Substrate for semiconductor devices and semiconductor device
#27342Power semiconductor device
#27343Semiconductor device
#27344Multi-chip package structure
#27345Stacked ball grid array packages
#27346Method of manufacturing semiconductor device
#27347Stack chip package
#27348Microelectronic packages using a ceramic substrate having a window and a conductive surface region
#27349Accessible electronic storage apparatus
#27350Semiconductor device package
#27351Stacked-type semiconductor device
#27352One step capillary underfill integration for semiconductor packages
#27353Optoelectronic component and a module based thereon
#27354Resin-encapsulated package, lead member for the same and method of fabricating the lead member
#27355Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
#27356Method for wafer stacking using copper structures of substantially uniform height
#27357Semiconductor integrated circuit device and method of manufacturing the same
#27358Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
#27359Semiconductor package and lead frame therefor
#27360Semiconductor device and method of fabricating the same
#27361INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER
#27362IC substrate with over voltage protection function
#27363IC substrate with over voltage protection function
#27364Ball grid array IC substrate with over voltage protection function
#27365IC substrate with over voltage protection function
#27366IC substrate with over voltage protection function
#27367Power core devices
#27368Semiconductor device and manufacturing method of the same
#27369Semiconductor device and radio communication device
#27370Power semiconductor module
#27371Flip-chip bonding structure of light-emitting element using metal column
#27372Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes
#27373Diode housing
#27374Light source module and method for production thereof
#27375Light-emitting diode lamp and light-emitting diode display device
#27376Light emitting diode package and process of making the same
#27377Solid-state imaging device and radiation imaging system
#27378Semiconductor device and manufacturing method therefor
#27379Electronic device including a substrate structure and a process for forming the same
#27380Pressure sensor with integrated structure
#27381Curable encapsulant composition, device including same, and associated method
#27382Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device
#27383Connection ball positioning method and device for integrated circuits
#27384Method for constructing contact formations
#27385Hot-Melt Underfill Composition and Methos of Application
#27386Wafer structure, chip structure, and fabricating process thereof
#27387Method of marking a low profile packaged semiconductor device
#27388Method for making a neo-layer comprising embedded discrete components
#27389Packaged semiconductor die and manufacturing method thereof
#27390Manufacturing method of semiconductor device
#27391Integrated circuit packaging using electrochemically fabricated structures
#27392Package that integrates passive and active devices with or without a lead frame
#27393Methods of forming semiconductor packages
#27394Injection-molded package for MEMS inertial sensor
#27395Semiconductor package with a controlled impedance bus
#27396Light-emitting device with spherical photoelectric converting element
#27397Arrangement of luminescent materials, wavelength-converting casting compound and light source
#27398Memory module and connection interface between the memory module and circuit board
#27399Module
#27400Leadframe and packaged light emitting diode
#27401Semiconductor optical modulator integrated resistor for impedance matching using semiconductor doped layer and method of fabricating the same
#27402Wafer based camera module and method of manufacture
#27403LED array package structure and method thereof
#27404Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
#27405Light emitting device
#27406Power semiconductor package
#27407Bonding pad structure
#27408Light emitting module
#27409Carrier with metal bumps for semiconductor die packages
#27410Circuit device with circuit board and semiconductor chip mounted thereon
#27411Semiconductor device and manufacturing method therefor
#27412PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE
#27413Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
#27414Multi lead frame power package
#27415Integrated circuit coolant microchannel with movable portion
#27416Ball grid array substrate having window and method of fabricating same
#27417Repairable three-dimensional semiconductor subsystem
#27418System for implementing a configurable integrated circuit
#27419Semiconductor device with a substrate having a spiral shaped coil
#27420Manufacturing method of a quad flat no-lead package structure
#27421Coating for enhancing adhesion of molding compound to semiconductor devices
#27422Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#27423Multi-chip package structure
#27424Multi-chip package structure
#27425System for coupling wire to semiconductor region
#27426Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus
#27427Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
#27428Package for semiconductor device
#27429Packaged electronic devices, and method for making same
#27430Semiconductor device package with reduced leakage
#27431Methods of making and using a floating lead finger on a lead frame
#27432Packages for encapsulated semiconductor devices and method of making same
#27433Use of a down-bond as a controlled inductor in integrated circuit applications
#27434Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#27435Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film
#27436Monolithic microwave integrated circuit compatible FET structure
#27437Multi-layer printed circuit board comprising a through connection for high frequency applications
#27438Illumination assembly and method of making same
#27439Illumination assembly and method of making same
#27440Light emitting diodes including pedestals
#27441Illumination assembly and method of making same
#27442Light emitting device and the use thereof
#27443LED Lamp
#27444Semiconductor laser, manufacturing the same and semiconductor laser device
#27445Light-emitting apparatus
#27446Method of manufacturing a contactless card
#27447RFID tag and method of manufacturing the same
#27448RFID tag and method of manufacturing the same
#27449Method of manufacturing a semiconductor device
#27450Thermal attach and detach methods and system for surface-mounted components
#27451Method of manufacturing wiring substrate to which semiconductor chip is mounted
#27452PCB, manufacturing method thereof and semiconductor package implementing the same
#27453Wired circuit board
#27454Acceleration sensor
#27455Semiconductor device and manufacturing method thereof
#27456Solder bump composition for flip chip
#27457Method for re-routing lithography-free microelectronic devices
#27458Nitride semiconductor device comprising bonded substrate and fabrication method of the same
#27459Memory package
#27460Methods of using sonication to couple a heat sink to a heat-generating component
#27461Semiconductor device package
#27462Method of manufacturing semiconductor device and support structure for semiconductor substrate
#27463Compact system module with built-in thermoelectric cooling
#27464Wafer bonding of micro-electro mechanical systems to active circuitry
#27465BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD
#27466Optical element, optical module, and optical transmission device
#27467Semiconductor laser apparatus
#27468Stacked DRAM memory chip for a dual inline memory module (DIMM)
#27469Light-emitting diode flash module with enhanced spectral emission
#27470Electronic component with a housing package
#27471Housing for power semiconductor modules
#27472Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
#27473Cornerbond assembly comprising three-dimensional electronic modules
#27474Protection of an integrated capacitor
#27475Image pickup module, method of manufacturing the same, and spacer with infrared ray cut film
#27476Display, method of manufacturing display and apparatus for manufacturing display
#27477Light-emitting diode display with compartment
#27478Transceiver using low temperature co-fired ceramic method
#27479B-stageable underfill encapsulant and method for its application
#27480Semiconductor device having a bonding pad structure including an annular contact
#27481Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#27482Multi-chip module
#27483Method of making wafer level ball grid array
#27484Flip chip package with anti-floating structure
#27485Apparatus and method for manufacturing semiconductor device
#27486Flip chip device
#27487Method for solder bumping, and solder-bumping structures produced thereby
#27488Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures
#27489Test system for semiconductor components having conductive spring contacts
#27490Method for fabricating semiconductor components with conductive spring contacts
#27491Semiconductor apparatus
#27492Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#27493Semiconductor device and manufacturing method thereof
#27494Metallization structure over passivation layer for IC chip
#27495Multi-chip module having bonding wires and method of fabricating the same
#27496Thermally enhanced package for an integrated circuit
#27497Heat dissipating semiconductor package and fabrication method thereof
#27498Semiconductor device and manufacturing method thereof
#27499High density package interconnect wire bond strip line and method therefor
#27500Semiconductor device
#27501Flash preventing substrate and method for fabricating the same
#27502Lead frame for semiconductor device
#27503Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
#27504Semiconductor package, manufacturing method thereof and IC chip
#27505Integrated circuit with stacked-die configuration utilizing substrate conduction
#27506Photo-detector and related instruments
#27507Multi-part lead frame with dissimilar materials
#27508Semiconductor device and a method of manufacturing the same
#27509Electrical-interference-isolated transistor structure
#27510Semiconductor package having improved adhesion and solderability
#27511Semiconductor device comprising a memory portion and a peripheral circuit portion
#27512Zener diode and methods for fabricating and packaging same
#27513Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer
#27514Electronic component and a panel
#27515Back-illuminated type solid-state imaging device
#27516Semiconductor light emitting device and method for manufacturing the same
#27517Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
#27518Ceramic composite material for light conversion and use thereof
#27519Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
#27520Thin gallium nitride light emitting diode device
#27521Method for manufacturing GaN-based light emitting diode using laser lift-off technique and light emitting diode manufactured thereby
#27522Forming of high aspect ratio conductive structure using injection molded solder
#27523Production of an optoelectronic component that is enclosed in plastic, and corresponding methods
#27524Transparent optical component for light emitting/receiving elements
#27525Optically blocked reference pixels for focal plane arrays
#27526Method of packaging flip chip and method of forming pre-solders on substrate thereof
#27527Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
#27528Chain extension for thermal materials
#27529Wireless communication system
#27530Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
#27531Bonding structure and fabrication thereof
#27532Three-dimensional device fabrication method
#27533Methods for fabricating stiffeners for flexible substrates
#27534Carrier-free semiconductor package and fabrication method thereof
#27535Wafer-level underfill process making use of sacrificial contact pad protective material
#27536Method of fabrication of stacked semiconductor devices
#27537Manufacturing process of light-emitting device
#27538Photocurable-resin application method and bonding method
#27539Surface emitting semiconductor laser and communication system using the same
#27540Semiconductor memory device and defect remedying method thereof
#27541Thermal management of surface-mount circuit devices
#27542Circuit component module, electronic circuit device, and method for manufacturing the circuit component module
#27543Liquid metal thermal interface material system
#27544Coolant cooled type semiconductor device
#27545Optical device and illumination device
#27546Image pickup module
#27547Process for manufacturing a light-emitting device
#27548Printed circuit board having a bond wire shield structure for a signal transmission line
#27549Low voltage logic operation using higher voltage supply levels
#27550Light-emitting diode, led light, and light apparatus
#27551Method for encasing plastic array packages
#27552Method and system for wavelength specific thermal irradiation and treatment
#27553Apparatus and method for molding simultaneously a plurality of semiconductor devices
#27554Semiconductor device, its manufacturing method, and radio communication device
#27555Semiconductor device, having a through electrode semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode
#27556Packaging structure with a plurality of drill holes formed directly below an underfill layer
#27557Semiconductor device and the method of producing the same
#27558Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
#27559Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device
#27560Integrated circuit cooling system and method
#27561Thermal expansion compensating flip chip ball grid array package structure
#27562Use of visco-elastic polymer to reduce acoustic and/or vibration induced error in microelectromechanical devices and systems
#27563Semiconductor package and fabrication method thereof
#27564Semiconductor device and method of fabricating the same
#27565Stacked electronics for sensors
#27566Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging
#27567Multi-level semiconductor module and method for fabricating the same
#27568Stackable frames for packaging microelectronic devices
#27569Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
#27570Ball assignment schemes for integrated circuit packages
#27571Electronic component device
#27572Memory module having interconnected and stacked integrated circuits
#27573Semiconductor package, memory card including the same, and mold for fabricating the memory card
#27574Liquid metal thermal interface material system
#27575Lead frame assemblies and decoupling capacitors
#27576Sharp corner lead frame
#27577Semiconductor device
#27578Semiconductor package and manufacturing method thereof
#27579Power semiconductor device
#27580Bi-directional power switch
#27581Semiconductor device
#27582Electronic microcircuit having internal light enhancement
#27583Optical semiconductor device method
#27584Light emitting device package
#27585Headlamp
#27586Semiconductor device and method of manufacturing the same
#27587Solder interconnect structure and method using injection molded solder
#27588Roller wire brake for wire bonding machine
#27589Process for producing light-emitting diode element emitting white light
#27590Spray cooling with spray deflection
#27591Memory cards and method of fabricating the memory cards
#27592Method of making a circuitized substrate
#27593Method of fabricating semiconductor device using low dielectric constant material film
#27594Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#27595Die-to-die connection method and assemblies and packages including dice so connected
#27596Methods for assembling a stack package for high density integrated circuits
#27597Attachment of flip chips to substrates
#27598Laminated ceramic substrate and manufacturing method therefor
#27599Hermetically sealing using a cold welded tongue and groove structure
#27600Laser diode module with a built-in high-frequency modulation IC