Wiring board and capacitor to be built into wiring board

Process condition sensing wafer and data analysis system

Acceleration sensor

Antenna designs for radio frequency identification tags

Compliant electrical contacts

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Fabrication of stacked microelectronic devices

Semiconductor device and a method of manufacturing the same

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method of fabricating a semiconductor stacked multi-package module having inverted second package

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)

Chip-stacked semiconductor package and method for fabricating the same

Device packages having stable wirebonds

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Light emitting device and method of making the same

Semiconductor module

Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly

Image pick-up inspection equipment and method

Integrated transformer structure and method of fabrication

LED device having diffuse reflective surface

Light emitting film, luminescent device, method for manufacturing light emitting film and method for manufacturing luminescent device

Novel method for copper wafer wire bonding

Semiconductor device

Through-substrate interconnect structures and assemblies

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Bump structure of semiconductor device and method of manufacturing the same

Printed wires arrangement for in-line memory (IMM) module

Chip scale package and method for manufacturing the same

Device package

Semiconductor package system with cavity substrate

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Stacked type semiconductor device and method of fabricating stacked type semiconductor device

Electronic device and method for fabricating the same

Semiconductor device

Sealed-by-resin type semiconductor device

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Method and apparatus for packaging an electronic chip

Integrated circuit device having encapsulant dam with chamfered edge

Circuit board and semiconductor device

LED package frame and LED package having the same

Red line emitting phosphor materials for use in LED applications

Micro-LED based high voltage AC/DC indicator lamp

Light receiving or light emitting modular sheet and process for producing the same

Light emitting diode

Semiconductor device

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Transducer assembly, capillary and wire bonding method using the same

Electric power steering system using wound lead storage battery as power supply, and motor and inverter used in same

Molding tool and a method of forming an electronic device package

Printed wiring board having a solder pad and a method for manufacturing the same

Electronic device manufacture

Semiconductor manufacturing method for die bonding

Forming buried via hole substrates

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Method for encapsulating an electronic component using a foil layer

Hermetic packaging

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Integrated circuit die connection methods and apparatus

Thermal enhanced package for block mold assembly

LED package structure and mass production method of making the same

Optical transmission and/or receiving device

Insulating sheet and method for producing it, and power module comprising the insulating sheet

Optical detector, optical head device, optical information processing device, and optical information processing method

Light emitting apparatus

Communication module

Semiconductor package and semiconductor module

Electronic component for radio frequency applications and method for producing the same

Optical scanner package having heating dam

Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method

Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same

Semiconductor device and method of fabricating the same

Battery protection IC chip

Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof

Light emitting device

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device and method for producing the same

IC chip package structure and underfill process

Semiconductor device

Structure and manufacturing method of a chip scale package

Semiconductor device

Display apparatus

Semiconductor device and method of manufacturing a semiconductor device

Flexible wiring base material and process for producing the same

Semiconductor package with crossing conductor assembly and method of manufacture

Package structure and fabrication method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device

Method and apparatus for reducing stresses applied to bonded interconnects between substrates

Bilayer aluminum last metal for interconnects and wirebond pads

Surface mount semiconductor device

Chip package and producing method thereof

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Chip on board leadframe for semiconductor components having area array

Semiconductor device and method of manufacturing the same

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Luminescent body and optical device including the same

High performance MEMS packaging architecture

Semiconductor device with sense structure

Optical semiconductor device with improved illumination efficiency

Lighting module and method for the production thereof

Chip component and method for producing a chip component

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Packaging designs for LEDs

Heterogeneous integrated high voltage DC/AC light emitter

Packaging designs for LEDs

LED and a lighting apparatus using the LED

Localized hermetic sealing of a power monitor on a planar light circuit

Tape manufacturing

Method and apparatus for forming a low profile wire loop

Wire bonding apparatus

Ribbon bonding tool and process

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

Electronic circuit board

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

Pressure sensor featuring pressure loading of the fastening element

Two-fluid spray cooling system

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

HIGH SPEED OPTICAL SUB-ASSEMBLY WITH CERAMIC CARRIER

Method for designing integrated circuit package and method for manufacturing same

System-in-package wireless communication device comprising prepackaged power amplifier

VSAT block up converter (BUC) chip

Card type LED illumination source

Method of making a compliant interconnect assembly

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Substrate bump formation

Semiconductor device and manufacturing method thereof

Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier

Methods relating to forming interconnects

Under bump metallurgy in integrated circuits

White-light emitting devices and methods for manufacturing the same

Method in the fabrication of a memory device

Fabrication of stacked microelectronic devices

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Data carrier with a module with a reinforcement strip

Interconnection structure through passive component

Semiconductor device and display module using same

Heat sink for surface-mounted semiconductor devices

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Image display device and light emission device

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Electronic component, electro-optical device, and electronic apparatus

Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material

Flip-chip package structure with direct electrical connection of semiconductor chip

Signal redistribution using bridge layer for multichip module

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Semiconductor device and method for producing the same

LED PACKAGING METHOD AND PACKAGE STRUCTURE

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Multimedia card and transfer molding method

Semiconductor device and method of fabricating same

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe

Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method

Semiconductor device, display module, and manufacturing method of semiconductor device

Semiconductor device and manufacturing the same

Semiconductor integrated circuit and method of manufacturing the same

Photodetector sealing resin is a boride or an oxide of micro particles

Semiconductor light emitting device mounting substrates including a conductive lead extending therein

Light-emitting diode, backlight device and method of manufacturing the light-emitting diode

Light emitting device

Semiconductor light emitting device

Systems and methods for producing white-light emitting diodes

Light emitting device

Charged plate,CDM simulator and test method

Integrated sensor chip unit

Infrared sensor having no package can

Solder ball loading method and solder ball loading unit background of the invention

Camera-assisted adjustment of bonding head elements

Apparatus of clamping semiconductor devices using sliding finger supports

Cooling structure of solid state and formation thereof with integrated package

Method for the thermal testing of a thermal path to an integrated circuit

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Remote-control light receiving unit and electronic apparatus using the same

Integrated and monolithic package structure of acoustic wave device

Integrated packaged having magnetic components

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Dielectric resonator, dielectric resonator frequency adjusting method, and dielectric resonator integrated circuit

Semiconductor device

Shared bond pad for testing a memory within a packaged semiconductor device

Current sensor

Wavelength converting substance and light emitting device and encapsulating material comprising the same

Semiconductor apparatus and manufacturing method

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Electronic component and leadframe for producing the component

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor chip stack package having dummy chip

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Lead-frame-based semiconductor package and lead frame thereof

Method to manufacture a universal footprint for a package with exposed chip

Lead frame routed chip pads for semiconductor packages

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Image sensor device and method of manufacturing same

Optical semiconductor unit

Surface mount LED

Semiconductor light emitting element and semiconductor light emitting device

Photo-detection device and manufacturing method thereof

Solid state relay, electronic device, and method for manufacturing solid state relays having a first control terminal, a first output terminal and a second output terminal as lead terminals

Semiconductor device with split pad design

Support device for monolithically integrated circuits

Multi-function card device

Enhanced reliability semiconductor package

Wire loop, semiconductor device having same and wire bonding method

Wire clamping plate

Anti-intrusion smart card

Encapsulated electronic component and production method

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Power semiconductor module

Method for manufacturing surface acoustic wave device

Electronic component assembly

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for fabricating module of semiconductor chip

Integrated die bumping process

Signal transfer film, display apparatus having the same and method of manufacturing the same

Method of manufacturing a cavity package

Ceramic substrate, ceramic package for housing light emitting element

Optoelectronic molding compound that transmits visible light and blocks infrared light

Solder composition

Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same

White-light emitting device and the use thereof

Low-inductance circuit arrangement

Electronic component package including heat spreading member

Thermal interface apparatus, systems, and fabrication methods

Micro-optoelectromechanical system packages for a light modulator and methods of making the same

Image sensor having color wheel

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Semiconductor device having signal line and reference potential planes separated by a vertical gap

RFID tag with thermal conductive cover

Light-emitting device and phosphor

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor package and fabrication method of the same

Semiconductor device package and manufacturing method thereof

Electronic parts packaging structure

Printed circuit board having reduced mounting height

Flip chip package structure

ON-CHIP COOLING

Semiconductor interconnect having dome shaped conductive spring contacts

Electronic device

BGA package substrate and method of fabricating same

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Structure of substrate

Semiconductor package having passive component disposed between semiconductor device and substrate

Method for manufacturing semiconductor device having a pair of heat sinks

Semiconductor devices having post passivation interconnections and a buffer layer

Multilayer board and a semiconductor device

Lead frame for semiconductor device

NANO IC packaging

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

DFN semiconductor package having reduced electrical resistance

Leadframe designs for plastic cavity transistor packages

Semiconductor package having enhanced heat dissipation and method of fabricating the same

Flexible substrate for package

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Semiconductor device

Electro-optic integrated circuits with connectors and methods for the production thereof

Light emitting diode package and process of making the same

Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate

Wire bonds having pressure-absorbing balls

System and method for cooling an integrated circuit device by electromagnetically pumping a fluid

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Method of forming pad and fuse in semiconductor device

Method of forming contact pads