Light emitting diode backlight package

Method of manufacturing a light emitting device

Light emitting device with multiple layers of quantum dots and method for making the device

Surface acoustic wave device package

Bond pad for ball grid array package

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Semiconductor device

Multi-chip module

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method for manufacturing the same

Substrate package structure and packaging method thereof

Bond pad structure for gold wire bonding to copper low K dielectric silicon devices

Wire bond interconnection

Semiconductor device

Heat stud for stacked chip package

Chip package mechanism

Pulse transformer package and method for making the same

Semiconductor die attachment for high vacuum tubes

Package of a semiconductor device with a flexible wiring substrate and method for the same

Stack package for high density integrated circuits

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Light transmissive cover, device provided with same and methods for manufacturing them

Semiconductor chip and tab package having the same

Semiconductor device with improved heat dissipation

connection arrangement for micro lead frame plastic packages

Microelectronic assemblies incorporating inductors

Simplified multichip packaging and package design

Semiconductor device

Method and apparatus for polymer dielectric surface recovery by ion implantation

Integrated circuit including silicon wafer with annealed glass paste

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Light emitting diode chip with large heat dispensing and illuminating area

Semiconductor light-emitting device, method for manufacturing same, and linear light source

Method and device for mounting electric component

Ultrasonic head

Resonator, ultrasonic head, and ultrasonic bonder using the same

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Wiring board manufacturing method

Semiconductor device and manufacturing method thereof

Package for a semiconductor device

Forming an intermediate layer in interconnect joints and structures formed thereby

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Method for removing resin mask layer and method for manufacturing solder bumped substrate

Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Leadframe with enhanced encapsulation adhesion

Method for two-stage transfer molding device to encapsulate MMC module

Method for stacking BGA packages and structure from the same

Multilayered circuit substrate, semiconductor device and method of producing same

Film adhesive and semiconductor package using the same

Optical turn system for optoelectronic modules

Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical interconnects and manufacturing methods thereof

Optical device and optical apparatus

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Apparatus and methods for cooling semiconductor integrated circuit package structures

Image pickup module and manufacturing method of image pickup module

RFID tag in a substrate

Semiconductor device, method and apparatus for fabricating the same

Microelectronic assemblies and methods of making microelectronic assemblies

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Solder for fabricating solder bumps and pumping process

Semiconductor device for fingerprint recognition

Integrated circuit package and assembly thereof

Power module, and phase leg assembly

Semiconductor component package

Multi-chip package and method of fabricating the same

Multi-chip package using an interposer

Package structure of memory card and packaging method for the structure

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Leadframe designs for integrated circuit plastic packages

Light emitting element

Semiconductor device and method of fabricating the same

Optical device

ESD protection apparatus for an electrical device

Insulating substrate and semiconductor device having a thermally sprayed circuit pattern

LED fabrication via ion implant isolation

LED device and method for manufacturing the same

Stacked module systems and methods

Electronic device and method of manufacturing the same

Method of manufacturing semiconductor apparatus and method of forming viscous liquid layer

Semiconductor chip package having an adhesive tape attached on bonding wires

Techniques for microchannel cooling

Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips

Method of removing integrated circuit chip package and detachment jig therefor

Method for ambiguity resolution in location determination

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Fabrication method of semiconductor integrated circuit device

Assembly process

Electronic device with high lead density

Overmolded lens over LED die

Molded lens over LED die

Encapsulated light emitting diodes and methods of making

Method of making light emitting device with silicon-containing encapsulant

Method of making light emitting device with silicon-containing encapsulant

Optical semiconductor module

Hybrid card

Edge plated printed wiring boards

Heat-dissipating device

Fluidic cooling systems and methods for electronic components

Vehicle light

Power amplifier module

System-in-package type semiconductor device

Methods and systems for rise-time improvements in differential signal outputs

LED device and method for manufacturing the same

Highly efficient stable oxynitride phosphor

Led-based illumination unit

Die attach material for TBGA or flexible circuitry

Semiconductor chip capable of implementing wire bonding over active circuits

Module substrate and disk apparatus

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

BGA package having substrate with exhaust hole

REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF

Heat sinking structure

Heat dissipating packages structure and method for fabricating the same

Semiconductor integrated circuit chip packages having integrated microchannel cooling modules

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Substrate design to improve chip package reliability

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Wiring board having connecting wiring between electrode plane and connecting pad

Modular construction component with encapsulation

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Semiconductor module with conductive element between chip packages

Apparatus for stacking electrical components using insulated and interconnecting via

Multi-chip semiconductor package

Multi-chip package

Semiconductor apparatus

Carrier for substrate film

Integrated circuit package system with leadframe substrate

Contact image capturing structure

SER immune cell structure

Multilayered lead frame for a semiconductor light-emitting device

Optical element housing package

LED heat dissipation support

Package Structure of a Surface Mount Device Light Emitting Diode

Semiconductor light emitting device capable of increasing its brightness

Wavelength converted light emitting apparatus using phosphor and manufacturing method thereof

Wide emitting lens for LED useful for backlighting

Bump formation method and bump forming apparatus for semiconductor wafer

Semiconductor system with fine pitch lead fingers

Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Component with ultra-high frequency connections in a substrate

Semiconductor chip heat transfer device

Integrated thermoelectric cooling devices and methods for fabricating same

Adhesion apparatus

Lamp

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Electrical connector

Active area bonding compatible high current structures

Cooling system for a semiconductor device and method of fabricating same

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Tolerance bondwire inductors for analog circuitry

Micro lead frame packages and methods of manufacturing the same

Injection molded metal bonding tray for integrated circuit device fabrication

Electronic device and method of manufacturing same

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Flip chip underfilling

Method for wafer level stack die placement

CPU power delivery system

Electronic component module having electronic component with piezoelectric device

Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses

Illumination assembly using circuitized strips

Image sensor assembly and method for fabricating the same

Wire positioning and mechanical attachment for a radio-frequency indentification device

Radar-transceiver for microwave and millimetre applications

RFID tag

Packaged electronic components for producing a sub-harmonic frequency signal at millimetric frequencies

Electronic circuitry

White light emitting diode package and method of manufacturing the same

Semiconductor device

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

Semiconductor chip capable of implementing wire bonding over active circuits

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Semiconductor device having flip-chip package and method for fabricating the same

Substrate via pad structure providing reliable connectivity in array package devices

Semiconductor device with crack-resistant multilayer copper wiring

Wafer structure, chip structure and bumping process

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Staggered wirebonding configuration

Semiconductor wafer with electrically connected contact and test areas

Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Chip package with grease heat sink

Semiconductor module

Substrate for electrical device and methods for making the same

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Interconnect shunt used for current distribution and reliability redundancy

Multi chip package

Electronic device package and electronic equipment

IC chip package with isolated vias

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Stepped integrated circuit packaging and mounting

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having post-mold nickel/palladium/gold plated leads

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

High-powered light emitting device with improved thermal properties

Electronic package for image sensor, and the packaging method thereof

Sensor device

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package

Integrated circuit die with logically equivalent bonding pads

Multi-chip package

Flip chip type LED lighting device manufacturing method

Semiconductor light-emitting device, lighting module and lighting apparatus

Structured semiconductor element for reducing charging effects

Light emitting diode component

Lens module structure

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Method for making a surface acoustic wave device package

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

Semiconductor device

Methods for designing and tuning one or more packaged integrated circuits

Electrical contact and connector and method of manufacture

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Bumping process

Bumping process and structure thereof

Fabrication method of a wafer structure

Integrated circuit die configuration for packaging

Method for reducing semiconductor die warpage

Packaging and manufacturing of an integrated circuit

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Die stacking scheme

Methods of manufacturing interposers with flexible solder pad elements

Semiconductor package substrate with embedded resistors and method for fabricating the same

Method of manufacturing a wafer assembly

Resin molding equipment and resin molding method

Digital still camera module

Surface-emission laser diode operable in the wavelength band of 1.1-1.7 um and optical telecommunication system using such a laser diode

Optical device and method of manufacturing the same

Power supply noise reduction circuit and power supply noise reduction method

Light emitting module, optical head, and optical disc recording and reproducing apparatus

Lighting source unit, illuminating apparatus using the same and display apparatus using the same

Stacked module systems

Multilayered chip capacitor array

Method of creating an RFID tag with substantially protected rigid electronic component

Variation of conductive cross section and/or material to enhance performance and/or reduce material consumption of electronic assemblies

Phosphor mixture and light emitting device

Semiconductor device and method for manufacturing same

Cavity-down Package and Method for Fabricating the same

Bond pad structure for integrated circuit chip

LED with self aligned bond pad

Semiconductor device and method for fabricating the same

Flip chip BGA process and package with stiffener ring

Electronic component comprising external surface contacts and a method for producing the same

Multi-chip stack package

Circuitized substrate with trace embedded inside ground layer

Method of mounting an electronic part to a substrate

Wiring board and method for producing same

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device, circuit board, electro-optic device, electronic device

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Cavity-down thermally enhanced package

High heat dissipation flip chip package structure

Semiconductor package with heat sink and method for fabricating same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor module, process for producing the same, and film interposer

Semiconductor device and a method for manufacturing of the same

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Flexible leaded stacked semiconductor package

Sensor chip packaging structure

Chip package having flat transmission surface of transparent molding compound and method for manufacturing the same

Semiconductor device and manufacturing process thereof

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Low cost power MOSFET with current monitoring

Film circuit substrate having Sn-In alloy layer

Ceramic thin film on base metal electrode

Image sensor chip package and method of fabricating the same