Integrated inductors and compliant interconnects for semiconductor packaging

LSI package equipped with interface module, interface module and connection holding mechanism

Fluid cooled encapsulated microelectronic package

Integrated circuit with increased heat transfer

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Multiple power density chip structure

Substrate for producing semiconductor packages

System-on-a-chip with multi-layered metallized through-hole interconnection

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

Method and apparatus for manufacturing stacked-type semiconductor device

Electronic packages with dice landed on wire bonds

Stacked wafer scale package

QFN package and method therefor

Multi-path bar bond connector for an integrated circuit assembly

Method of producing a semiconductor device having a magnetic layer formed thereon

Semiconductor device and resin structure therefor

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material

Reflection-type optoelectronic semiconductor device

Light emitting diode systems

LED and method of manufacturing the same

Stretchable semiconductor elements and stretchable electrical circuits

Image-generation device, in particular for installation in the roof area or exterior rearview mirror of a motor vehicle

Heatslug to leadframe attachment

Bonded silicon, components and a method of fabricating the same

Electrical device

Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body

Superconductivity in boron-doped diamond thin film

High frequency module and manufacturing method thereof

LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device

Invertible microfeature device packages

Method to fill the gap between coupled wafers

Semiconductor element

Fluxless solder transfer and reflow process

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

Process and lead frame for making leadless semiconductor packages

Semiconductor attachment method

Methods and apparatuses for providing stacked-die devices

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Anisotropic conductive adhesive for fine pitch and COG packaged LCD module

Integrated audio codec with silicon audio transducer

Light-emitting apparatus and illuminating apparatus

Integrated circuit package including miniature antenna

Temperature controlled MEMS resonator and method for controlling resonator frequency

Probe for semiconductor devices

Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels

Low profile, chip-scale package and method of fabrication

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Stacked packages

Semiconductor device and manufacturing method of the same

Multilayered anisotropic conductive adhesive for fine pitch

Wafer level package, multi-package stack, and method of manufacturing the same

Fine pitch low-cost flip chip substrate

Hybrid integrated circuit device

Liquid metal thermal interface for an integrated circuit device

Systems and methods for wafer bonding by localized induction heating

Ceramic package, assembled substrate, and manufacturing method therefor

Electronic circuit device

Package structure

Electronic module with form in-place pedestal

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Memory card with an adaptor

Rugged CSP module system and method

Process and lead frame for making leadless semiconductor packages

Metal-metal bonding of compliant interconnect

Half-bridge package

System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack

Substrate for light emitting diodes

Luminescent material and light emitting diode using the same

Radio frequency identification (RFID) tag and manufacturing method thereof

Wire bond with improved shear strength

Apparatus and method for printing micro metal structures

Concave face wire bond capillary and method

Electronic circuit device

Circuit device manufacturing method

Programmable radio transceiver

Selectively coating bond pads

Method for fabricating semiconductor package with circuit side polymer layer

Wafer level package structure of optical-electronic device and method for making the same

Semiconductor device

Manufacturing method of semiconductor device

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method for processing a base that includes connecting a first base to a second base with an insulating film

Packaging structure and method of an image sensor module

Package structure for light emitting diode and method thereof

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Semiconductor structure

Radio frequency power amplifier module

Electrical contact encapsulation

Method for processing base

Semiconductor device with semiconductor components connected to one another

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits

Component arrangement having an evaluation circuit for detecting wear on connections

Mechanism and process for compressing chips

Film carrier tape for mounting of electronic part

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Micro device having micro system structure and method for method for manufacturing the same

Semiconductor package, method for fabricating the same, and semiconductor device

Method and apparatus for stacked die packaging

Stacked chip package with exposed lead-frame bottom surface

Semiconductor device

Structure with spherical contact pins

Stack type semiconductor apparatus package and manufacturing method thereof

Package structure for light emitting diode and method thereof

Light emitting diode package

Method and apparatus for forming metal contacts on a substrate

Method for making contactless cards

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

Bonding structure, wire bonding method, actuator device and liquid jet head

Optical or electronic module and method for its production

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Integrated radio front-end module with embedded circuit elements

Helical microelectronic contact and method for fabricating same

Interconnect assemblies and methods

Surface treatment for oxidation removal in integrated circuit package assemblies

Method of manufacturing semiconductor device with two-step etching of layer

Metal pad of semiconductor device and method for bonding the metal pad

Methods of forming wire bonds for semiconductor constructions

Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein

Chip package structure

Method of manufacturing circuit device

Image sensor package structure and method for fabricating the same

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Method for producing an optical or electronic module provided with a plastic package

Method for coating package with a filter profile

LED package for backlight unit

Illumination apparatus and method

Stacked chip electronic package having laminate carrier and method of making same

Control unit and method for producing the same

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Image capturing device

Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers

Power amplifier arrangement and method for processing a radiofrequency signal

White LEDs with tunable CRI

Luminescent powder, method for producing the luminescent powder and luminescent body provided with luminescent powder

Semiconductor device with signal line having decreased characteristic impedance

Front-end processing of nickel plated bond pads

Semiconductor device and method for manufacturing the same, package for LCD driver

Interconnects with interlocks

Electrical conducting structure and liquid crystal display device comprising the same

Semiconductor component having a CSP housing

Hermetic chip in wafer form

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Power semiconductor package having integral fluid cooling

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Semiconductor device and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Stacked flash memory chip package and method therefor

Methods of forming a multi-chip module having discrete spacers

Small structure and method for fabricating the same

Semiconductor chip having gettering layer, and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Chip-under-tape package structure and manufacture thereof

Semiconductor package with flip chip on leadless leadframe

Semiconductor package with stacked chips and method for fabricating the same

LOC semiconductor assembled with room temperature adhesive

Solderable metal finish for integrated circuit package leads and method for forming

Chip structure with redistribution traces

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

Metal bond pad for integrated circuits allowing improved probing ability of small pads

Semiconductor light-emitting device and method of manufacturing the same

Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component

LED package methods and systems

Surface mounting optoelectronic component and method for producing same

LED lamp for light source of lighting device

Apparatus and method for printing micro metal structures

Semiconductor package having a grid array of pin-attached balls

Electronic component embedded substrate and method for manufacturing the same

Electronic device and angular velocity detector

Methods for making device enclosures and devices with an integrated battery

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF

Method for fabricating pad redistribution layer

Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Thin-film battery devices and apparatus for making the same

Optical semiconductor device, optical connector and electronic equipment

Surface mount module

Layered board, and apparatus incorporated such layered board

Active plate-connector device with built-in semiconductor dies

Liquid crystal display and method for manufacturing the same having particular pad unit

Microelectronic component assemblies with recessed wire bonds and methods of making same

Bump ball device and placing method thereof

Collars, support structures, and forms for protruding conductive structures

Semiconductor device

Flip-chip semiconductor package with lead frame and method for fabricating the same

Formation method and structure of conductive bumps

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Structure and formation method of conductive bumps

Semiconductor device and method of manufacturing a semiconductor device

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Method for mounting a chip on a base and arrangement produced by this method

Flip chip package capable of measuring bond line thickness of thermal interface material

Heterogeneous organic laminate stack ups for high frequency applications

BGA package board and method for manufacturing the same

Semiconductor package and method for its manufacture

IC with stably mounted chip

Semiconductor package with heat sink

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Solid-state imaging apparatus and manufacturing method thereof

Optical package for a semiconductor sensor

Electronic module with layer of adhesive and process for producing it

Multi-chip image sensor package module

Reflective encoder with light shield and electronic device using such reflective encoder

Damascene patterning of barrier layer metal for C4 solder bumps

Wirebonding method and apparatus

Strap bonding machine and method of manufacturing a semiconductor device

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Mounting method and mounting device

Manufacturing method of a semiconductor device, and paste applicator

Pressure sensor

Encapsulating epoxy resin composition, and electronic parts device using the same

Circuit-connecting material and circuit terminal connected structure and connecting method

Reducing loadline impedance in a system

Housing for an electronic component

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Resin encapsulation molding method for semiconductor device

Method for fabricating a semiconductor component with contacts situated at the underside

Manufacturing method of semiconductor device and manufacturing method of lead frame

Method of manufacturing semiconductor device

Castellation wafer level packaging of integrated circuit chips

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Methods of manufacturing microelectronic imaging units with discrete standoffs

Temporary chip attach method using reworkable conductive adhesive interconnections

Chip handling methods and apparatus

Optoelectronic module and plug arrangement

Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device

High illumination light emitting diode

Light emitting diode replacement lamp

LED luminance enhancing construction

FINE-TUNABLE MIXING LIGHT FOR LIGHT EMITTING DIODE

LED array package with internal feedback and control

Substrate for mounting IC chip

Electronic assemblies and systems comprising interposer with embedded capacitors

Electronic apparatus

Magnetic detection device and method for manufacture

Light emitting device provided with a submount assembly for improved thermal dissipation

LED chip capping construction

LED chip capping construction

Semiconductor chip resin encapsulation method

Semiconductor package including rivet for bonding of lead posts

Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding

Top layers of metal for high performance IC's

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Semiconductor package

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Methods of bonding two semiconductor devices

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same

Electronic device with semiconductor chip including a radiofrequency power module

Heat dissipation device for integrated circuits

Device mounting board

Semiconductor package and method for its manufacture

Semiconductor device and manufacturing method therefor

Semiconductor chip assembly with metal containment wall and solder terminal

Integrated circuit die with pedestal

Wafer-level assembly method for semiconductor devices

Semiconductor package

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

Device for mounting a semiconductor package on a support plate via a base

Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device

Light extraction from a semiconductor light emitting device via chip shaping

IC package with an integrated power source

Surface-mountable light-emitting diode and/or photodiode and method for the production thereof

Light-emitting diode device with resecurable connection

Optoelectronic arrangement and a method for controlling the output power of a transmission component

Image sensor module structure with lens holder having vertical inner and outer sidewalls

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

IMPROVED DECAL SOLDER TRANSFER METHOD

Method of fabricating a semiconductor device and mounting equipment

Formation of a wire bond with enhanced pull

Bonding method and bonding apparatus

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

Method of manufacturing a wiring board

RFID tag and method of manufacturing RFID tag

Method of fabricating wiring board

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Stacked semiconductor chips