212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Radiant energy heating for die attach
#28202Interconnection structure of integrated circuit chip
#28203Electronic circuit including circuit-connecting material
#28204Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#28205Semiconductor device having a switch circuit
#28206Heat dissipation for chip-on-chip IC packages
#28207Electronic package having a folded package substrate
#28208Chip structure
#28209Semiconductor device
#28210Semiconductor package, and fabrication method and carrier thereof
#28211Assembly for stacked BGA packages
#28212Materials, structures and methods for microelectronic packaging
#28213Stacked die infrared transceiver bus
#28214Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
#28215Semiconductor device package
#28216Heat spreader for non-uniform power dissipation
#28217Semiconductor device and semiconductor device unit
#28218Method and apparatus for removing molding residues from lead-frames
#28219High brightness light emitting diode
#28220Redistributed solder pads using etched lead frame
#28221Optical semiconductor device, optical communication device, and electronic equipment
#28222Nitride semiconductor light emitting device having electrostatic discharge (ESD) protection capacity
#28223Submount for use in flipchip-structured light-emitting device including transistor
#28224Light emitting device
#28225Infrared sensor, infrared gas detector and infrared ray source
#28226Component for detecting electromagnetic radiation, particularly infrared radiation, infrared optical imaging unit including such a component and process for implementing it
#28227PHOTOSENSITIVE BONDING PACKAGE STRUCTURE
#28228Solder interconnection array with optimal mechanical integrity
#28229Motion control device for wire bonder bondhead
#28230Integrated radio frequency module
#28231Microelectronic packaging and components
#28232Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
#28233Wafer level packages and methods of fabrication
#28234Wire bond pads
#28235Method for producing bumps on an electrical component
#28236Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
#28237Semiconductor device, its manufacture method and electronic component unit
#28238Semiconductor device and manufacturing method of the same
#28239Thin glass chip for an electronic component and manufacturing method
#28240Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices
#28241Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
#28242Fabricating method of wafer protection layers
#28243Wafer stacking package method
#28244Method of forming a wafer backside interconnecting wire
#28245Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
#28246Method for forming a redistribution layer in a wafer structure
#28247Method for packaging chip and package assembly produced thereby
#28248Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same
#28249Method of forming a surface mountable IC and its assembly
#28250Methods for producing phosphor based light sources
#28251LED package and method for producing the same
#28252Illuminative light communication device
#28253Using a phase change memory as a replacement for a buffered flash memory
#28254Power module package having excellent heat sink emission capability and method for manufacturing the same
#28255Light-emitting semiconductor device having an overvoltage protector
#28256Antennae for radio frequency identification tags in the form of artwork such as a logo, brand name, graphics, trademark, or the like
#28257Semiconductor module
#28258Illumination device with at least one LED as the light source
#28259Light emitting device
#28260Rotor for rotating electric machine
#28261Semiconductor package having flash-free contacts and techniques for manufacturing the same
#28262Sensor device having stopper for limitting displacement
#28263Semiconductor device and a method of assembling a semiconductor device
#28264Copper interconnect
#28265Copper interconnect
#28266Copper interconnect
#28267Copper interconnect for semiconductor device
#28268Semiconductor equipment having a pair of heat radiation plates
#28269Method of making a solder ball
#28270Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
#28271Semiconductor packages
#28272Method for producing chip stacks
#28273Semiconductor device and manufacturing method thereof
#28274Semiconductor device and method for fabricating the same
#28275Bonding wire and bonded connection
#28276Method of fabricating a semiconductor die package having improved inductance characteristics
#28277Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
#28278Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#28279Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
#28280Bump structure
#28281Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#28282Methods of forming semiconductor packages
#28283Packaging with metal studs formed on solder pads
#28284Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
#28285Semiconductor device with temperature control mechanism
#28286Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor
#28287Apparatus for and method of packaging semiconductor devices
#28288Chip carrier with oxidation protection layer
#28289Wiring board, method of manufacturing the same, and semiconductor device
#28290Multi-chip package structure
#28291Semiconductor device
#28292Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted
#28293Chip package assembly produced thereby
#28294Surface mount hermetic package for power semiconductor die
#28295Wireless chip and manufacturing method of the same
#28296Sealed surface acoustic wave element package
#28297LED package with zener diode protection circuit
#28298Robust power semiconductor package
#28299Semiconductor packages
#28300Integrated circuit package with open substrate
#28301Field device incorporating circuit card assembly as environmental and EMI/RFI shield
#28302Semiconductor device having multiple substrates
#28303Led package
#28304Light emitting device and method of producing same
#28305Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
#28306Light source assembly having high-performance heat dissipation means
#28307Semiconductor laser apparatus
#28308Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment
#28309Spectrally tunable detector
#28310IC card and method of manufacturing the same
#28311Method for supplying solder
#28312Methods for forming conductive bumps and wire loops
#28313Method of measuring thickness of bonded ball in wire bonding
#28314Substrate structure, a method and an arrangement for producing such substrate structure
#28315Using special visibility materials proximate candidate component locations to enhance recognition
#28316Joining apparatus
#28317Anisotropic-electroconductive adhesive, circuit connection method and structure using the same
#28318Physical quantity sensor, lead frame, and manufacturing method therefor
#28319Sensor device
#28320Surface mount saw device manufacturing method
#28321Top layers of metal for high performance IC's
#28322Bump structure of semiconductor package and method for fabricating the same
#28323Module assembly and method for stacked BGA packages
#28324Method for fabricating conductive bump of circuit board
#28325Method of clearing electrical contact pads in thin film sealed OLED devices
#28326Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
#28327Method and apparatus for a stacked die configuration
#28328Method of manufacturing a semiconductor device
#28329Method of forming precision leads on a chip-supporting leadframe
#28330Electronic assemblies having a low processing temperature
#28331Technique for attaching die to leads
#28332Method for manufacturing electronic component-mounted board
#28333Method for bonding flip chip on leadframe
#28334Methods for packaging image sensitive electronic devices
#28335Methods for packaging image sensitive electronic devices
#28336Methods for packaging image sensitive electronic devices
#28337Chip assembly reinforcement
#28338Optical transmitter and receiver module
#28339Buffered thin module system and method
#28340High capacity thin module system and method
#28341Package having dummy package substrate and method of fabricating the same
#28342Chip-on-chip type semiconductor device
#28343Integrated antenna type circuit apparatus
#28344Electronic device provided with a magnetic screening
#28345Surface acoustic wave device and method for manufacturing the same
#28346Method for producing an optical or electronic module provided with a plastic package and an optical or electronic module
#28347Transparent resin composition for optical sensor filter, optical sensor, and process of producing method therefor
#28348Chip module
#28349Semiconductor package having a partial slot cover for encapsulation process
#28350Flip chip metal bonding to plastic leadframe
#28351Semiconductor chip stack structure and method for forming the same
#28352Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby
#28353Grooved substrates for uniform underfilling solder ball assembled electronic devices
#28354Semiconductor device having tin-based solder layer and method for manufacturing the same
#28355Semiconductor device mounting structure for reducing thermal stress and warpage
#28356Semiconductor device and method for manufacturing semiconductor device
#28357Flat chip semiconductor device and manufacturing method thereof
#28358Thin module system and method with thermal management
#28359Thin module system and method with skew reduction
#28360Integrated semiconductor circuit and method for producing an integrated semiconductor circuit
#28361Semiconductor device and method of manufacturing semiconductor device
#28362Semiconductor device, lead frame, and methods for manufacturing the same
#28363Semiconductor device and wire bonding chip size package therefor
#28364Capacitance type semiconductor sensor
#28365High density interconnect power and ground strap and method therefor
#28366Module assembly for stacked BGA packages
#28367Substrate-based housing component with a semiconductor chip
#28368Package having dummy package substrate and method of fabricating the same
#28369Method of manufacturing a semiconductor device
#28370Semiconductor device
#28371Lead frame and semiconductor device having the lead frame
#28372Surface acoustic wave device and manufacturing method of the same
#28373Semiconductor device and method for fabricating the same
#28374System and method for providing a low frequency filter pole
#28375High power LED array
#28376Light-emitting device and glass seal member therefor
#28377Surface mount LED
#28378Solid-state optical device
#28379Light emitting diode (LED) packaging
#28380Solid state white light emitter and display using same
#28381Direct attach optical receiver module and method of testing
#28382Solid state device and light-emitting element
#28383Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication
#28384Method for connecting a chip and a substrate
#28385Methods for forming vias varying lateral dimensions
#28386Through-substrate interconnect fabrication methods
#28387Method of making circuitized substrate
#28388Manufacturing method of stack-type semiconductor device
#28389Method for reducing lead precipitation during wafer processing
#28390Substrate grooves to reduce underfill fillet bridging
#28391Methods for packaging image sensitive electronic devices
#28392Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#28393Semiconductor chip packages and methods for fabricating the same
#28394Methods for packaging microfeature devices and microfeature devices formed by such methods
#28395Method of manufacturing semiconductor device
#28396High heat dissipation LED device and its manufacturing method
#28397Underfill injection mold
#28398Phosphor mixture and light emitting device using the same
#28399Compact optical transceiver module
#28400Laser package with digital electronic interface
#28401Optical semiconductor module and semiconductor device including the same
#28402Semiconductor laser apparatus and manufacturing method thereof
#28403Magnetic shielding for magnetic random access memory card
#28404LED light source
#28405Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them
#28406Methods and apparatuses for transferring heat from stacked microfeature devices
#28407Semiconductor module
#28408Electronic module with conductive polymer
#28409Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
#28410Microelectronic imagers having front side contacts
#28411Integrated package inductor for integrated circuit devices
#28412Methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
#28413Method of manufacturing a semiconductor device
#28414Semiconductor chip, electrically connections therefor
#28415Underfill and mold compounds including siloxane-based aromatic diamines
#28416Surface-mounting semiconductor device and method of making the same
#28417Wire sweep resistant semiconductor package and manufacturing method thereof
#28418Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#28419Integrated circuit with substantially perpendicular wire bonds
#28420Low stress conductive polymer bump
#28421Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
#28422Semiconductor device having laminated structure
#28423Semiconductor device
#28424High-reliable semiconductor device using hermetic sealing of electrodes
#28425Low temperature PB-free processing for semiconductor devices
#28426Flip chip ball grid array package with constraint plate
#28427Through-wafer interconnects for photoimager and memory wafers
#28428Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
#28429Top layers of metal for high performance IC's
#28430Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages
#28431Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#28432Semiconductor device having a heat-dissipation member
#28433Method for heat dissipation on semiconductor device
#28434IC package with power and signal lines on opposing sides
#28435Transistor performance enhancement using engineered strains
#28436Semiconductor device having heat sink
#28437Structure and process of semiconductor package with an exposed heatsink
#28438Structures and methods for heat dissipation of semiconductor integrated circuits
#28439Chip module
#28440Semiconductor and method for producing a semiconductor
#28441Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
#28442Substrate having a functionally gradient coefficient of thermal expansion
#28443Electronic component package
#28444Air pocket resistant semiconductor package
#28445Circuit device and manufacture method for circuit device
#28446Multichip module package and fabrication method
#28447Stacked die packaging and fabrication method
#28448Apparatus for improved power distribution in wirebond semiconductor packages
#28449Stacked packaging methods and structures
#28450Method of making a semiconductor device adapted to remove noise from a signal
#28451Chip package having a heat spreader and method for packaging the same
#28452Semiconductor device and process for manufacturing the same
#28453Semiconductor device having stiffener
#28454Optoelectronic component and housing
#28455SMT three phase inverter package and lead frame
#28456Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
#28457Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same
#28458Electronic component with multilayered rewiring plate and method for producing the same
#28459Bump structure of an opto-electronic chip
#28460Semiconductor device with simplified constitution
#28461Method of making camera module in wafer level
#28462Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
#28463Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
#28464Light-emitting diode
#28465Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance
#28466Semiconductor light emitting apparatus
#28467Light emitting device and light emitting element having predetermined optical form
#28468High power light emitting diode package
#28469Semiconductor light emitting device
#28470Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus
#28471Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#28472VCSEL pin sensor
#28473Integrated ball grid array optical mouse sensor packaging
#28474Optical device and assembly for use with imaging dies, and wafer-label imager assembly
#28475Image sensor having integrated infrared-filtering optical device and related method
#28476Chip card module
#28477Dense intermetallic compound layer
#28478Cooling of substrate using interposer channels
#28479Method of manufacturing printed wiring board
#28480Acceleration sensing device
#28481Package for MEMS devices
#28482Memory module, memory system, and information device
#28483Compressible films surrounding solder connectors
#28484Method of forming vias on a wafer stack using laser ablation
#28485Bump inspection apparatus and method for IC component, bump forming method for IC component, and mounting method for IC component
#28486Method of making circuitized substrate
#28487Attachment of integrated circuit structures and other substrates to substrates with vias
#28488Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
#28489Method to build a wirebond probe card in a many at a time fashion
#28490Method for manufacturing a light emitting device
#28491Light emitting diode lamp and light emitting diode display unit
#28492Method and apparatus for heat dissipation
#28493Solid state lighting device
#28494Microscopic batteries for MEMS systems
#28495Nitride phosphor and production process thereof, and light emitting device
#28496Conductive adhesive agent with ultrafine particles
#28497Etched interposer for integrated circuit devices
#28498Thermal fatigue resistant tin-lead-silver solder
#28499Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#28500Electrode structure of a semiconductor device and method of manufacturing the same