Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device

Castellation wafer level packaging of integrated circuit chips

Integrated circuit stacking system and method

Mounting semiconductor chips

Image sensor package

Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device

Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device

Optical module

LED assemblies and light strings containing same

Optical module

Manufacturing method for magnetic sensor and lead frame therefor

Deep ultraviolet used to produce white light

Light emitting diode display that does not require epoxy encapsulation of the light emitting diode

Method for manufacturing surface acoustic wave device

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

Stacked structure of integrated circuits

BGA package with concave shaped bonding pads

Microelectronic devices

Flip-chip without bumps and polymer for board assembly

Bonding pad and chip structure

Semiconductor chip having pollished and ground bottom surface portions

Thermal interposer for cooled electrical packages

Molded package for micromechanical devices and method of fabrication

Semiconductor component and assembly having female conductive members

Castellation wafer level packaging of integrated circuit chips

Semiconductor component having stacked, encapsulated dice and method of fabrication

Multi-chip package having heat dissipating path

Stacked semiconductor device and semiconductor memory module

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

Ultrathin module for semiconductor device and method of fabricating the same

Plastic encapsulated semiconductor device with reliable down bonds

Semiconductor device

Semiconductor device in which semiconductor chip is mounted on lead frame

Silicon building block architecture with flex tape

Semiconductor device and method of manufacturing same

Lead frame for improving molding reliability and semiconductor package with the lead frame

Semiconductor device having a through electrode

Chip package substrate having soft circuit board and method for fabricating the same

Image sensor package and method of manufacturing the same

Semiconductor integrated circuit device

Semiconductor system functioning as thyristor in on-state, and as bipolar transistor in transient state or with overcurrent

Switch elements and a DC/DC converter using the same

Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

Light emitting element and method of making same

Surface mountable light emitting diode assemblies packaged for high temperature operation

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Optical module

Gallium nitride based III-V group compound semiconductor device and method of producing the same

Nitride-based compound semiconductor light emitting device

Device and method for emitting output light using group IIA/IIB selenide sulfur-based phosphor material

Phosphor mixture of organge/red ZnSe0.5S0.5:Cu,Cl and green BaSrGa4S7:Eu for white phosphor-converted led

Image sensor package structure

Method of reforming reformable members of an electronic package and the resultant electronic package

Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management

Acceleration sensor and method of manufacturing acceleration sensor

Angular velocity detector

Under bump metallurgy process on passivation opening

Interconnects with direct metalization and conductive polymer

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Method for ultra thinning bumped wafers for flip chip

Wafer bonding with highly compliant plate having filler material enclosed hollow core

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Stacked package electronic device

Substrate based unmolded package

Optoelectronic packaging with embedded window

Method for fabricating semiconductor components using conductive layer and grooves

Photopolymerizable composition and use thereof

Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other

Light emitting diode module for automobile headlights and automobile headlight having the same

Electromagnetic shield assembly

Hermetically sealed image sensor module and method of fabricating same

Semiconductor test interconnect with variable flexure contacts having polymer material

Light-emitting diode with a base

Light emitting device, phosphor, and method for preparing phosphor

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

In-line wire bonding on a package, and method of assembling same

Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions

Interconnect shunt used for current distribution and reliability redundancy

Semiconductor chip stack

Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same

Through electrode and method for forming the same

Electrode contact structure

Method for manufacturing a semiconductor device

Semiconductor device

Circuit device and manufacturing method thereof

Electronic assembly having multi-material interconnects

Package stress management

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Semiconductor device

Chip-to-chip trench circuit structure

Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism

Direct connection multi-chip semiconductor element structure

Packaging stacked chips with finger structure

Low inductance semiconductor device having half-bridge configuration

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multi-component integrated circuit contacts

Semiconductor chip package with thermoelectric cooler

Integrated circuit package including embedded thin-film battery

Quad flat non-leaded package

Electronic package and semiconductor device using the same

Package Structure

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Taped lead frames and methods of making and using the same in semiconductor packaging

Component interconnect with substrate shielding

Apparatus and method of wafer level package

LED with substrate modifications for enhanced light extraction and method of making same

Led and fabrication method of same

LED with substrate modifications for enhanced light extraction and method of making same

Light-emitting diode

Method of manufacturing active matrix substrate with height control member

Circular wire-bond pad, package made therewith, and method of assembling same

Laser metallization for ceramic device

Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Angular rate sensor having circuit board and package

Slave device, master device and stacked device

Co-curable compositions

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Patch substrate for external connection

Method of stacking wafers with anisotropic conductive adhesive

Microelectronic devices and methods for forming interconnects in microelectronic devices

Method for encapsulating lead frame packages

Leadless semiconductor package and method for manufacturing the same

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Method for fabricating semiconductor packages

Electronic device package

Carrier for substrate film

Methods for designing carrier substrates with raised terminals

Leadframe for a multi-chip package and method for manufacturing the same

Leadframe with a chip pad for two-sided stacking and method for manufacturing the same

Double mold optocouplers

Polymeric optical waveguide film, polymeric optical waveguide module and method of manufacturing polymeric optical waveguide film

Universal energy conditioning interposer with circuit architecture

Method and apparatus for mapping a position of a capillary tool tip using a prism

Apparatus of antenna with heat slug and its fabricating process

Integrated circuit apparatus controlling source voltage of MOSFET based on temperature

Oxynitride phosphor and a light emitting device

Lamp and method of producing a lamp

Color-converting light emitting device including fluorescent powder having large grain diameter, method of producing the same, and resin composition used therein

Mold cleaning sheet and manufacturing method of a semiconductor device using the same

Electrostatic discharge (ESD) protection for integrated circuit packages

Method and structure for manufacturing improved yield semiconductor packaged devices

Circuit film with bump, film package using the same, and related fabrication methods

Arrangement for increasing the reliability of substrate-based BGA packages

Semiconductor device

Semiconductor device with wire bond inductor and method

Bottom heat spreader

Semiconductor package with exposed heat sink and the heat sink thereof

Method of forming semiconductor constructions

Forming buried via hole substrates

Stacked multi-chip semiconductor package improving connection reliability of stacked chips

Multi-chip semiconductor connector assemblies

Method and system for expanding flash storage device capacity

Substrate-based die package with BGA or BGA-like components

Microelectronic packages and methods therefor

Substrate strip for a transparent package

Method of embedding semiconductor element in carrier and embedded structure thereof

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Semiconductor device and method of manufacturing the same

Ultra thin dual chip image sensor package structure and method for fabrication

High-frequency circuit

Semiconductor constructions

Semiconductor package including a semiconductor device, and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method for producing a semiconductor circuit, and corresponding semiconductor circuit

Semiconductor device-based sensors

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Circuit apparatus provided with asperities on substrate surface

Electronic assembly with carbon nanotube contact formations or interconnections

Method of soldering electronic component having solder bumps to substrate

Solder bumps formation using solder paste with shape retaining attribute

In-situ alloyed solders, articles made thereby, and processes of making same

Die attach area cut-on-fly method and apparatus

Apparatus and method for indexing of substrates and lead frames

Capillary for wire bonding

Flange-mounted transducer

Components with posts and pads

Systems and methods for building tamper resistant coatings

Sensor equipment having sensing portion and method for manufacturing the same

Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Stud bump socket

Method of forming a thin wafer stack for a wafer level package

High-reliability solder joint for printed circuit board and semiconductor package module using the same

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Semiconductor device and manufacturing method thereof

Method for encapsulating multiple integrated circuits

Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device

Heat spreader in integrated circuit package

Half-bridge power module with insert molded heatsinks

Semiconductor and electronic device with spring terminal

Light emitting device with blue light led and phosphor components

Light emitting diode

Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip

Prefabricated semiconductor chip carrier

Semiconductor device

Device mounting board and semiconductor apparatus using the same

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Ground plane for integrated circuit package

Stacking system and method

Multiple device package

Semiconductor package with heat sink

Memory card with a cap having indented portions

Printed wiring board

Semiconductor device and manufacturing method therefor

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Co-packaged control circuit, transistor and inverted diode

Semiconductor package having integrated metal parts for thermal enhancement

Semiconductor, electrooptic apparatus and electronic apparatus

Semiconductor device

Package for semiconductor light emitting element and semiconductor light emitting device

Light-emitting diode

Semiconductor light emitting device and semiconductor light emitting unit

PCB-based surface mount LED device with silicone-based encapsulation structure

Light emitting diode package

Semiconductor laser device and method for fabricating the same

High brightness light-emitting device and manufacturing process of the light-emitting device

Sensor device having molded signal-outputting portion

Wire bonding wedge

Bondhead for wire bonding apparatus

Method of forming a lead-free bump and a plating apparatus therefor

Compliant spring contact structures

Field weldable connections

Semiconductor acceleration sensor device and method for manufacturing the same

Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.

Flexible scrub ring contact

Method and apparatus for solder-less attachment of an electronic device to a textile circuit

Fabrication method of wafer level chip scale packages

Method for fabricating chip structure

Compliant interconnect and method of formation

Microfeature devices and methods for manufacturing microfeature devices

Compound semiconductor device and manufacturing method thereof

Method for fastening microtool components to objects

Underfill and encapsulation of semiconductor assemblies with materials having differing properties

Chip scale package with open substrate

High density flip chip interconnections

Encapsulation for particle entrapment

Method for making a semiconductor device

Light emitting diode with fluorescent material

Heat-decaying materials, transfer sheet using the same, and patterning method

Solid-state light source

Manufacturing method of semiconductor device

Thermal management methods and apparatus for lighting devices

Wafer-level packaged microelectronic imagers and processes for wafer-level packaging

Solid-state imaging device and manufacturing method thereof, and camera module

Image pickup device and production method thereof

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Semiconductor device and semiconductor apparatus

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Lead-free conductive jointing bump

Method of forming a solder bump and the structure thereof

Stress mitigation layer to reduce under bump stress concentration

Encapsulation of pin solder for maintaining accuracy in pin position

Semiconductor device mounted on and electrically connected to circuit board

Transfer molding of integrated circuit packages

Package and method for packaging an integrated circuit die

High density multilayer circuit module

Internal package heat dissipator

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Contact pin assembly and contactor card

Compliant contact pin assembly and card system

Vertical conduction power electronic device package and corresponding assembling method

Embedded chip semiconductor having dual electronic connection faces

Multi-chip module package structure

High density chip scale leadframe package and method of manufacturing the package

Micro-electro-mechanical system (MEMS) package with spacer for sealing and method of manufacturing the same

Semiconductor package

Method and system for improved wire bonding

Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus

Semiconductor device having inductor

Prefabricated housings for microelectronic imagers

Ultra thin image sensor package structure and method for fabrication

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Compound semiconductor device and manufacturing method thereof

Nitride semiconductor device

Led lamp including a plurality of led chips

Light emitting device

Light emitting device with transparent substrate having backside vias

High power LED package

LED packaging structure

LED chip with integrated fast switching diode for ESD protection

Optical device and method for fabricating the same

Optical module having a reflector element and method of manufacturing the same

Bonding apparatus

Method and stencil for extruding material on a substrate

Spread spectrum isolator

Circuit device

Method of manufacturing semiconductor device

Formation method for conductive bump

Method for forming interconnects on thin wafers

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Methods of making microelectronic packages

Method of temporarily securing a die to a burn-in carrier