212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
#29102Wiring board and production method thereof, and semiconductor apparatus
#29103Three-dimensional mounted assembly and optical transmission device
#29104RF isolator for isolating voltage sensing and gate drivers
#29105RF isolator with differential input/output
#29106Transformer isolator for digital power supply
#29107Semiconductor laser apparatus and manufacturing method thereof
#29108High intensity utility light
#29109Snubber module and power conversion device
#29110Composite optical lens with an integrated reflector
#29111Light source device and projector
#29112Image pickup device and camera module
#29113Semiconductor device and electronic apparatus
#29114Solid-state image pickup apparatus, solid-state image sensor chip and package
#29115Combination radio frequency identification transponder (RFID Tag) and magnetic electronic article surveillance (EAS) tag
#29116Method of making photolithographically-patterned out-of-plane coil structures
#29117Electrical contact
#29118Apparatus, device and method for emitting output light using group IIB element selenide-based phosphor material and/or thiogallate-based phosphor material
#29119Crack protection for silicon die
#29120Integrated circuit device
#29121Optimized driver layout for integrated circuits with staggered bond pads
#29122Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
#29123Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#29124Apparatus and method for wire bonding and die attaching
#29125Semiconductor device with a barrier layer and a metal layer
#29126Semiconductor device and method capable of scribing chips with high yield
#29127Semiconductor device
#29128Semiconductor component and system having thinned, encapsulated dice
#29129Ball grid array solder joint reliability
#29130Semiconductor device with slanting side surface for external connection
#29131Ribbon bonding in an electronic package
#29132Stacked semiconductor package having adhesive/spacer structure and insulation
#29133Ball grid array housing having a cooling foil
#29134Conductor device and method of manufacturing thereof
#29135Semiconductor package including redistribution pattern and method of manufacturing the same
#29136High-voltage module and method for producing same
#29137System-in-package (SIP) structure and fabrication thereof
#29138Supporting frame for surface-mount diode package
#29139Package for sealing an integrated circuit die
#29140Preparation of front contact for surface mounting
#29141Adhesive/spacer island structure for stacking over wire bonded die
#29142Internal package heat dissipator
#29143Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#29144On chip transformer isolator
#29145Tb,B-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
#29146Low thermal resistance light emitting diode
#29147Semiconductor device
#29148LED package including a frame
#29149Power light emitting die package with reflecting lens and the method of making the same
#29150LED package and method for producing the same
#29151Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#29152Corrosion resistance enhancement of tin surfaces
#29153Method and stencil for extruding material on a substrate
#29154Sensor and guide wire assembly
#29155Plant cultivating method, cultivating device, and its lighting device
#29156Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
#29157Wire-bonding method for chips with copper interconnects by introducing a thin layer
#29158Manufacturing method of semiconductor device
#29159Process of bonding circuitry components
#29160Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#29161Semiconductor device and method of manufacturing the same
#29162Module with multiple power amplifiers and power sensors
#29163Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
#29164Integrated circuit packages with reduced stress on die and associated methods
#29165Top layers of metal for high performance IC's
#29166Manufacturing methods for semiconductor structures having stacked semiconductor devices
#29167Encapsulated chip and method of fabrication thereof
#29168Method of fabricating an encapsulated chip and chip produced thereby
#29169Wiring substrate and method of fabricating the same
#29170Semiconductor integrated circuit device and method for fabricating the same
#29171Optical modulator module
#29172Solid-state imaging device, semiconductor wafer and camera module
#29173Imaging device having transparent unit and electronic apparatus
#29174Mold compound with fluorescent material and a light-emitting device made therefrom
#29175Circuit device and manufacturing method thereof
#29176Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#29177Method of manufacturing semiconductor device and support structure for semiconductor substrate
#29178Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier
#29179Method for manufacturing circuit device
#29180Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#29181Circuit device and manufacturing method thereof
#29182Integrated circuit package with optimized mold shape
#29183Semiconductor device
#29184Asymmetric bump structure
#29185Semiconductor device and method of manufacturing the same
#29186Semiconductor device including amplifier and frequency converter
#29187Circuit device and manufacturing method thereof
#29188Cold weld hermetic MEMS package and method of manufacture
#29189Laminated radiation member, power semiconductor apparatus, and method for producing the same
#29190Semiconductor package, method of production of same, and semiconductor device
#29191Interposer substrate, semiconductor package and semiconductor device, and their producing methods
#29192Flex-based circuit module
#29193Method of fabricating a semiconductor device used in a stacked-type semiconductor device
#29194Semiconductor device and manufacturing process therefor
#29195Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
#29196Intermediate substrate
#29197IC chip package
#29198Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#29199Semiconductor device and a method of manufacturing the same
#29200System and method for forming one or more integrated circuit packages using a flexible leadframe structure
#29201Integrated circuit leadframe and fabrication method therefor
#29202Semiconductor device and method for manufacturing the same
#29203Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#29204Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
#29205Circuit device with dummy elements
#29206Fingerprint sensor package
#29207Semiconductor device
#29208Wire bonding method and apparatus for integrated circuit
#29209Light emitting diode with reflection cup
#29210Collimating light from an LED device
#29211LED lamp
#29212Semiconductor device with a floating gate electrode that includes a plurality of particles
#29213Selective packaging of tested semiconductor devices
#29214Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
#29215Substrate holding apparatus
#29216Method of manufacturing circuit device
#29217Circuit device and manufacturing method thereof
#29218Moisture-resistant electronic device package and methods of assembly
#29219Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
#29220Multi-band tunable resonant circuit
#29221Top layers of metal for high performance IC's
#29222Package with barrier wall and method for manufacturing the same
#29223Circuit device, manufacturing method thereof, and sheet-like board member
#29224Method for fabricating leadless packages with mold locking characteristics
#29225Method for fabrication of wafer level package incorporating dual compliant layers
#29226Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#29227Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#29228Integrated ball and via package and formation process
#29229Method and system for applying an adhesive substance on an electronic device
#29230Dual row leadframe and fabrication method
#29231Optical device
#29232Optical module and optical transmission apparatus
#29233Light-emitting electronic component
#29234Semiconductor device and interposer
#29235Devices and methods for protection of rechargeable elements
#29236Semiconductor molding method and structure
#29237Fine-pitch packaging substrate and a method of forming the same
#29238Circuit board and semiconductor device using the same
#29239Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#29240Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
#29241Multiple die package with adhesive/spacer structure and insulated die surface
#29242Semiconductor device
#29243Bump structure
#29244Double density method for wirebond interconnect
#29245Chip heat sink device and method
#29246Semiconductor device mounting structure
#29247Semiconductor device and manufacturing process thereof
#29248Method and system for stacking integrated circuits
#29249Adhesive/spacer island structure for multiple die package
#29250Semiconductor device, method for mounting the same, and method for repairing the same
#29251Semiconductor device and method of manufacturing the same
#29252Leadless leadframe with an improved die pad for mold locking
#29253Packaged integrated circuit with MLP leadframe and method of making same
#29254Image sensor package module with a leadless leadframe between chips
#29255Chip package, image sensor module including chip package, and manufacturing method thereof
#29256Power composite integrated semiconductor device and manufacturing method thereof
#29257Semiconductor device and manufacturing method therefor
#29258Method of manufacturing electronic part packaging structure
#29259Submount for diode with single bottom electrode
#29260Light emitting diode apparatuses with heat pipes for thermal management
#29261Optoelectronic semiconductor device and method of manufacturing such a device
#29262Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#29263Semiconductor die attachment for high vacuum tubes
#29264Package modification for channel-routed circuit boards
#29265Packaging of a microchip device
#29266Structure for mounting electronic component on wiring board
#29267Thermal interface adhesive and rework
#29268Method and system for deflashing mold compound
#29269Method of manufacturing semiconductor device
#29270Method of making a heatsink device
#29271Chemical-enhanced package singulation process
#29272Methods for producing an electronic device having microscopically small contact areas
#29273Method of fabricating stacked semiconductor device
#29274Microelectronic devices and methods for packaging microelectronic devices
#29275Semiconductor light emitting element and method for manufacturing the same
#29276Method of attaching a leadframe to singulated semiconductor dice
#29277Adhesive film, lead frame with adhesive film, and semiconductor device using same
#29278Optoelectronic module and optoelectronic system
#29279Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
#29280Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
#29281Semiconductor package and method for fabricating the same
#29282Vibration-assisted method for underfilling flip-chip electronic devices
#29283High heat release semiconductor and method for manufacturing the same
#29284Universal interconnect die
#29285Flip chip package and process of forming the same
#29286Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#29287Semiconductor device
#29288Semiconductor device and method of manufacturing the semiconductor device
#29289Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#29290Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#29291Integrated circuit packaging method and structure for redistributing configuration thereof
#29292Solder flow stops for semiconductor die substrates
#29293Integrated passive devices
#29294Windowed package for electronic circuitry
#29295High electrical performance semiconductor package
#29296Mold gates and tape substrates including the mold gates
#29297Semiconductor device and manufacturing method therefor
#29298Package design and method for electrically connecting die to package
#29299Semiconductor device structure with adhesion-enhanced semiconductor die
#29300Semiconductor die attachment for high vacuum tubes
#29301Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
#29302Micromechanical component and corresponsing production method
#29303Systems for degating packaged semiconductor devices with tape substrates
#29304Method of forming an array of semiconductor packages
#29305Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#29306Power module and electric transportation apparatus incorporating the same
#29307Semiconductor device
#29308Large die package structures and fabrication method therefor
#29309Semiconductor device and manufacturing method of same
#29310Resin-molded package with cavity structure
#29311Die package
#29312Wireless coupling of semiconductor dies
#29313Stacked multi-chip package
#29314Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
#29315Optical device and method for fabricating the same
#29316Semiconductor micro device
#29317Microelectronic assembly having a perimeter around a MEMS device
#29318Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereof
#29319Semiconductor device having insulated gate bipolar transistor
#29320Semiconductor (LED) chip attachment
#29321White light emitting device
#29322LED bonding structures and methods of fabricating LED bonding structures
#29323Semiconductor light emitting device and method of manufacturing the same
#29324Method of bumping die pads for wafer testing
#29325IC card module
#29326Low-profile capillary for wire bonding
#29327Lead wire bonding method
#29328Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
#29329Wiring board and semiconductor package using the same
#29330Method and apparatus for forming structures proximate to workpieces
#29331Sealing structure for connector
#29332Under bump metallization layer to enable use of high tin content solder bumps
#29333Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#29334Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
#29335Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#29336Method and apparatus for decoupling conductive portions of a microelectronic device package
#29337Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#29338Method for internal electrical insulation of a substrate for a power semiconductor module
#29339Semiconductor chip arrangement and method
#29340Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
#29341Whisker inhibition in tin surfaces of electronic components
#29342Optoelectronic module and method for producing an optoelectronic module
#29343LED illumination engine using a reflector
#29344Electronic device including chip parts and a method for manufacturing the same
#29345Current sensor
#29346Bent lead light emitting diode device having a heat dispersing capability
#29347Electronic device with high lead density
#29348Semiconductor device
#29349Chip scale package with heat spreader
#29350Multi-chip package with high-speed serial communications between semiconductor die
#29351Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof
#29352Embedded chip semiconductor without wire bondings
#29353CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE
#29354Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#29355High data rate chip mounting
#29356Overhang support for a stacked semiconductor device, and method of forming thereof
#29357Electronic circuit package
#29358Chip-packaging with bonding options having a plurality of package substrates
#29359Array capacitors in interposers, and methods of using same
#29360Resin-encapsulated semiconductor apparatus and process for its fabrication
#29361Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
#29362Flip chip semiconductor package for testing bump and method of fabricating the same
#29363Circuit device
#29364Optical surface mount technology package
#29365Surface mount multichip devices
#29366Leads under chip IC package
#29367Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
#29368Fill for large volume vias
#29369Semiconductor device, manufacturing method of semiconductor device and module for optical device
#29370Image sensor packages and method of assembling the same
#29371Semiconductor device
#29372Semiconductor light emitting device with flexible substrate
#29373Methods of forming conductive through-wafer vias
#29374Selectable decoupling capacitors for integrated circuits and associated methods
#29375Compositions for use in electronics devices
#29376Method for securing electronic components to a substrate
#29377Linear split axis wire bonder
#29378Integrated process condition sensing wafer and data analysis system
#29379Optoelectronic module with components mounted on a flexible circuit
#29380Method of using capacitive bonding in a high frequency integrated circuit
#29381Sealing and protecting integrated circuit bonding pads
#29382Barrier for interconnect and method
#29383Top layers of metal for high performance IC's
#29384Single row bond pad arrangement
#29385Semiconductor device and manufacturing method thereof
#29386Method for making an interconnect pad
#29387Semiconductor device having a gettering layer
#29388Implementation of protection layer for bond pad protection
#29389Optoelectronic component
#29390Method of fabricating a semiconductor device
#29391Method of manufacturing a semiconductor device
#29392Epoxy-silicone mixed resin composition and light-emitting semiconductor device
#29393Integrated optical sub-assembly having epoxy chip package
#29394Recessed LED lamp unit
#29395Microelectronic connection components having bondable wires
#29396Active matrix substrate with height control member
#29397Method and apparatus for synthesizing high-frequency signals for wireless communications
#29398LED device with a vertical leadframe that is configured for surface mounting
#29399INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
#29400Semiconductor device and fabrication process therefor