212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Display device and manufacturing method of the same
#29402Electrode pad arrangement with open side for waste removal
#29403Semiconductor chip having pads with plural junctions for different assembly methods
#29404FCBGA package structure
#29405Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#29406Semiconductor device using semiconductor chip
#29407Semiconductor component having multiple stacked dice
#29408Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#29409Downsized package for electric wave device
#29410Structure of package
#29411Semiconductor chip package and method for manufacturing the same
#29412LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
#29413Semiconductor device
#29414Semiconductor structure integrated under a pad
#29415Card-type LED illumination source
#29416Light emitting device
#29417Test circuit under pad
#29418LED arrangement
#29419Phosphor and light source comprising such a phosphor
#29420Method for low loop wire bonding
#29421Flip chip bonding tool and ball placement capillary
#29422Method of fabricating a rat's nest RFID antenna
#29423Method for manufacturing an interconnect
#29424Method of making a semiconductor device using bump material including a liquid
#29425Compliant multi-composition interconnects
#29426Method for producing a semiconductor element
#29427High voltage power device with low diffusion pipe resistance
#29428Method for producing a BGA chip module and BGA chip module
#29429Printed circuit board and fabrication method thereof
#29430Method for manufacturing an adhesive substrate with a die-cavity sidewall
#29431Method of making assemblies having stacked semiconductor chips
#29432Device mounting board
#29433Card-type LED illumination source
#29434Method, system and device for delivering phototherapy to a patient
#29435Power module comprising at least two substrates and method for producing the same
#29436Image sensor module
#29437Vehicle rotating electric machine
#29438Semiconductor chip having pads with plural junctions for different assembly methods
#29439System in-package test inspection apparatus and test inspection method
#29440Multiple chip semiconductor package
#29441Methods of packaging microelectronic imaging devices
#29442Semiconductor device and hybrid integrated circuit device
#29443Wire bonding system and method of use
#29444Process for fabricating chip package structure
#29445Semiconductor package for a large die
#29446Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
#29447Method of forming a support frame for semiconductor packages
#29448Semiconductor device in which semiconductor chip is mounted on lead frame
#29449High-frequency amplification device
#29450Optical device and method for fabricating the same
#29451Image sensor packaging structure and method
#29452Semiconductor device, semiconductor circuit and method for producing semiconductor device
#29453Sensor packages and methods of making the same
#29454Semiconductor light emitting device and fabrication method thereof
#29455Semiconductor light emitting device
#29456Side-emission type semiconductor light-emitting device and manufacturing method thereof
#29457Semiconductor device
#29458Laminate ceramic circuit board and process therefor
#29459Multilayer printed wiring board
#29460Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#29461Preventing cloning of high value software using embedded hardware and software functionality
#29462Compliant interconnect assembly
#29463Method for making an anisotropic conductive film pointed conductive inserts
#29464Method for manufacturing semiconductor device
#29465Bump structure for a semiconductor device and method of manufacture
#29466Method for manufacturing semiconductor device having solder layer
#29467Method of manufacturing multi-stack package
#29468Lead frame and method of manufacturing the same
#29469Semiconductor device and a method of manufacturing the same
#29470Semiconductor package having multiple row of leads
#29471Semiconductor device and manufacturing method of the same
#29472MEMS device wafer-level package
#29473Method of making assemblies having stacked semiconductor chips
#29474Light emitting diode package with self dosing feature and methods of forming same
#29475Method of making contact pin card system
#29476Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#29477Semiconductor light emitting device and semiconductor light emitting apparatus
#29478Semiconductor laser apparatus
#29479Semiconductor laser apparatus and optical apparatus
#29480Semiconductor device
#29481Light emitting apparatus
#29482Light-radiating semiconductor component with a luminescene conversion element
#29483Semiconductor device
#29484Chip card of reduced size with backward compatibility and adapter for a reduced size chip card
#29485Packaged microelectronic imagers and methods of packaging microelectronic imagers
#29486Fluid ejection device utilizing a one-part epoxy adhesive
#29487High power Doherty amplifier
#29488Light emitting diode and process for producing the same
#29489Led chip mounting structure and image reader having same
#29490Semiconductor chip package
#29491Microelectronic assembly having a redistribution conductor over a microelectronic die
#29492Component built-in module and method for producing the same
#29493Bonding pad structure and method of forming the same
#29494Flip-chip type semiconductor devices and conductive elements thereof
#29495Semiconductor device
#29496CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
#29497Semiconductor device, magnetic sensor, and magnetic sensor unit
#29498Semiconductor device and multilayer substrate therefor
#29499Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#29500Semiconductor device and printed circuit board
#29501NANO IC packaging
#29502Semiconductor packages, and methods of forming semiconductor packages
#29503Display device
#29504Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#29505Compliant contact pin assembly and card system
#29506Compliant contact pin assembly and card system
#29507Compliant contact pin assembly and card system
#29508In-process semiconductor packages with leadframe grid arrays
#29509Power semiconductor module
#29510Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#29511Semiconductor device, method for producing the same, circuit board, and electronic apparatus
#29512Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
#29513Leadframe packaging structure and the method of manufacturing the same
#29514Semiconductor device with stacked semiconductor chips of the same type
#29515Method and apparatus for manufacturing semiconductor apparatus
#29516CHIP PACKAGING STRUCTURE
#29517Semiconductor integrated circuit
#29518LSI package provided with interface module, and transmission line header employed in the package
#29519Semiconductor device with improved design freedom of external terminal
#29520Semiconductor device
#29521High performance system-on-chip discrete components using post passivation process
#29522Semiconductor device having a refractory metal containing film and method for manufacturing the same
#29523Electronic component, mounted structure, electro-optical device, and electronic device
#29524Power semiconductor switching devices and power semiconductor devices
#29525Single-chip LED with three luminescent spectrums of red, blue and green wavelengths
#29526Light emitting device and fabrication method thereof and light emitting system using the same
#29527Integrated getter for vacuum or inert gas packaged LEDs
#29528Thin film device, integrated circuit, electrooptic device, and electronic device
#29529Capacitive sensor
#29530Methods of forming a contact pin assembly
#29531Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package
#29532Thermally conductive compositions and methods of making thereof
#29533Programmable radio transceiver
#29534Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
#29535Method of connecting base materials
#29536Electronic device and method of manufacture the same
#29537Method for fabricating encapsulated semiconductor components
#29538Packaging method for integrated circuits
#29539Flexible multi-chip module and method of making the same
#29540Methods for fabricating electronic components to include supports for conductive structures
#29541Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
#29542Method for manufacturing semiconductor device
#29543Light source device and optical communication module employing the device
#29544Optical communications module and substrate for the same
#29545Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems
#29546Method and apparatus for automotive radar sensor
#29547Light emitting diode arrays with improved light extraction
#29548Adhesive of folded package
#29549Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#29550Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#29551Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes
#29552Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#29553Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#29554Heat curable adhesive composition, article, semiconductor apparatus and method
#29555Method of fabricating electrical connection terminal of embedded chip
#29556Electronic component mounting method and apparatus
#29557Chip package structure and process for fabricating the same
#29558Wafer level mounting frame for ball grid array packaging, and method of making and using the same
#29559Microelectronic assembly with underchip optical window, and method for forming same
#29560Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#29561Integrated circuit package and method having wire-bonded intra-die electrical connections
#29562Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#29563Surface mounted package with die bottom spaced from support board
#29564Die with discrete spacers and die spacing method
#29565Semiconductor package with heat dissipating structure and method of manufacturing the same
#29566Chip package structure and chip packaging process
#29567Thermal dissipation in integrated circuit systems
#29568Jet-dispensed stress relief layer in contact arrays, and processes of making same
#29569Semiconductor device and method of fabricating the same
#29570Semiconductor device package having buffered memory module and method thereof
#29571Three-dimensional multichip stack electronic package structure
#29572Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
#29573Power semiconductor device package
#29574Stacked semiconductor device
#29575Semiconducting device with stacked dice
#29576Dual-interface IC card by laminating a plurality of foils and method of same
#29577Method for maintaining solder thickness in flipchip attach packaging processes
#29578Semiconductor device and method for manufacturing same
#29579Exposed pad module integrating a passive device therein
#29580CHIP PACKAGE STRUCTURE
#29581Circuit device
#29582Thermally enhanced component interposer: finger and net structures
#29583System for reducing or eliminating semiconductor device wire sweep
#29584Multi-part lead frame
#29585Chip fixed structure
#29586Integrated circuit device having flexible leadframe
#29587Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
#29588Leadless semiconductor package and manufacturing method thereof
#29589Spacer die structure and method for attaching
#29590Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#29591Power semiconductor switching-device and semiconductor power module using the device
#29592Integrated circuit with intergrated capacitor and methods for making same
#29593Semiconductor device for power MOS transistor module
#29594Light emitting nitride semiconductor device and method of fabricating the same
#29595Using multiple types of phosphor in combination with a light emitting device
#29596Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#29597Optical semiconductor component to prevent electric leakage and provide different driving voltages
#29598Light-emitting device and manufacturing process of the light-emitting device
#29599Light-emitting device and manufacturing process of the light-emitting device
#29600Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#29601Mounting substrate and mounting method of electronic part
#29602Component mounting substrate and structure
#29603Current sensor
#29604Method for making a microcircuit card
#29605Encapsulating epoxy resin composition, and electronic parts device using the same
#29606Epoxy resin compositions, solid state devices encapsulated therewith and method
#29607Semiconductor device comprising through-electrode interconnect
#29608Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#29609Wafer stacking using interconnect structures of substantially uniform height
#29610Semiconductor device and manufacturing method thereof
#29611Resin encapsulated semiconductor device and the production method
#29612Self-coplanarity bumping shape for flip-chip
#29613Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
#29614Method of making chip package with grease heat sink
#29615Stress-compensation layers in contact arrays, and processes of making same
#29616Carrier substrates and conductive elements thereof
#29617Light-emitting diode
#29618Control apparatus having fluid passage for cooling purpose
#29619Wire bonding apparatus
#29620Semiconductor integrated circuit device
#29621Semiconductor device with electrode pads for test probe
#29622Replaceable light emitting diode package assembly
#29623Triple wavelengths light emitting diode
#29624Method for manufacturing a triple wavelengths white LED
#29625Optoelectronic component and method for producing it
#29626Circuit support for a semiconductor chip and component
#29627Capillary underfill channel
#29628Semiconductor device
#29629Semiconductor device assemblies and packages including multiple semiconductor device components
#29630Semiconductor flip-chip package and method for the fabrication thereof
#29631Self-coplanarity bumping shape for flip chip
#29632Die down semiconductor package
#29633Use of palladium in IC manufacturing with conductive polymer bump
#29634Split-gate power module for suppressing oscillation therein
#29635Method for manufacturing leadless semiconductor packages
#29636Semiconductor device
#29637Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#29638Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
#29639Microelectronic assembly having encapsulated wire bonding leads
#29640Semiconductor device, a method of manufacturing the same and an electronic device
#29641Interposer including adhesive tape
#29642Optical semiconductor device and a method for manufacturing the same
#29643Circuit component module and method of manufacturing the same
#29644Semiconductor device of a charge storage type
#29645Semiconductor device with non-overlapping chip mounting sections
#29646Semiconductor BGA package having a segmented voltage plane and method of making
#29647Method for manufacturing semiconductor device
#29648Method and semiconductor device having copper interconnect for bonding
#29649Top finger having a groove and semiconductor device having the same
#29650Device mounting board and semiconductor apparatus using device mounting board
#29651Spacer die structure and method for attaching
#29652Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#29653Micro-reflectors on a substrate for high-density LED array
#29654Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#29655Semiconductor apparatus having a large-size bus connection
#29656Power semiconductor module
#29657Light emitting element
#29658Surface mount multi-channel optocoupler
#29659Wire bonding apparatus
#29660Wire bond capillary tip
#29661Fabrication method and structure of PCB assembly, and tool for assembly thereof
#29662Circuit board for connecting an integrated circuit to a support and IC BGA package using same
#29663Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
#29664Power supply circuit for physical quantity sensor
#29665Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#29666Methods of forming bumps using barrier layers as etch masks
#29667METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME
#29668Low fabrication cost, high performance, high reliability chip scale package
#29669Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#29670Semiconductor device, method for manufacturing the same, liquid crystal television and EL television
#29671Circuit device and manufacturing method thereof
#29672Land grid array packaged device and method of forming same
#29673Lower profile flexible substrate package for electronic components
#29674Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#29675BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#29676Method for forming a chamber in an electronic device and device formed thereby
#29677Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#29678Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#29679Light active sheet and methods for making the same
#29680Semiconductor laser device, semiconductor laser device manufacturing method, optical disk apparatus and optical transmission system
#29681Submount assembly and method of preparing optical module
#29682Ceramic packaging for high brightness LED devices
#29683Full-color flexible light source device
#29684Hybrid integrated circuit device
#29685Trench capacitor power supply system and method
#29686Switched-capacitor power supply system and method
#29687Display device and manufacturing method thereof
#29688Sim, sim holder, ic module, ic card and ic card holder
#29689Microwave circuit
#29690Programmable radio transceiver
#29691Motor driving system having power semiconductor module life detection function
#29692Fluorescent material and light-emitting device
#29693Adhesion by plasma conditioning of semiconductor chip surfaces
#29694Semiconductor device
#29695Resin-sealed semiconductor device and method of manufacturing the same
#29696Semiconductor device package having a semiconductor element with resin
#29697Multichip semiconductor package
#29698Semiconductor device and manufacturing metthod thereof
#29699Semiconductor apparatus with improved yield
#29700Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip