Semiconductor package structure with reduced parasite capacitance and method of fabricating the same

Under bump metallization layer to enable use of high tin content solder bumps

Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment

Copper interconnect

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Semiconductor device and method of manufacturing the same

Integrated heat spreader with downset edge, and method of making same

Semiconductor device

Semiconductor device with plate-shaped component

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit device

Vertically stacked semiconductor device

Semiconductor chip package

Circuit device and manufacturing method thereof

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device for optical communication and manufacturing method therefor

Lead on chip semiconductor package

Surface-mountable semiconductor component and method for producing it

Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating

Optical device and apparatus comprising the optical device

Semiconductor device in which the emitter resistance is reduced

Integrated circuit module package and assembly method thereof

Microfabricated hot wire vacuum sensor

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Solid-state element and solid-state element device

Opposed terminal structure having a nitride semiconductor element

Light emitting diode

Semiconductor light emitting device capable of suppressing silver migration of reflection film made of silver

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Bumpless die and heat spreader lid module bonded to bumped die carrier

Method of microelectrode connection and connected structure of use threof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Top layers of metal for high performance IC's

Solder bump structure and method for forming a solder bump

Method of making cascaded die mountings with springs-loaded contact-bond options

Methods for forming electrical connections and resulting devices

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of routing an electrical connection on a semiconductor device and structure therefor

Methods and apparatus for attaching getters to MEMS device housings

Semiconductor device and manufacturing method of the same

Thin flip-chip method

Method for fabricating window ball grid array semiconductor package

Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

Semiconductor chip packaging method with individually placed film adhesive pieces

Die to substrate attach using printed adhesive

Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

Manufacturing method of semiconductor device

Microelectronic device interconnects

Method of manufacturing an opto-coupler

Microphone and method of producing a microphone

Photoelectric conversion module with cooling function

LED illumination apparatus and card-type LED illumination source

Electronic component housing package and electronic apparatus

Intermediate substrate

Structure of semiconductor chip and display device using the same

High frequency power amplifier module and wireless communication apparatus

Device and method for emitting composite output light using multiple wavelength-conversion mechanisms

System and method for attenuating electromagnetic interference

Semiconductor device and method of manufacturing the same

Chip module

Stress and force management techniques for a semiconductor die

Multi-flip chip on lead frame on over molded IC package and method of assembly

Method for manufacturing wiring board and semiconductor device

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Device with through-hole interconnection and method for manufacturing the same

Semiconductor apparatus

Wire bonding method and semiconductor device

Semiconductor device with recessed post electrode

Method of manufacturing substrate joint body, substrate joint body and electrooptical device

Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier

Die package with higher useable die contact pad area

Package design and method of manufacture for chip grid array

Module with integrated active substrate and passive substrate

Microelectronic assembly formation with releasable leads

Package structure with a retarding structure and method of making same

Semiconductor memory device and multi-chip module comprising the semiconductor memory device

Semiconductor device

Stacked electronic part

Method of sensor packaging

Thin semiconductor package including stacked dies

Stacked semiconductor packages

Circuit device and manufacturing method thereof

Semiconductor package having step type die and method for manufacturing the same

Optoelectronic semiconductor component

Board-on-chip packages

Package with stacked substrates

Flip chip bonded micro-electromechanical system (MEMS) device

Light emitting diode package with high power

Flip chip light-emitting diode package

Semiconductor device and manufacturing method thereof

Luminescent material, especially for LED application

Ultrasonic tool and ultrasonic bonder

Wiring board and process for producing the same

Optical subassembly

Connector

Method of fabricating a wire bond with multiple stitch bonds

Process for producing optical semiconductor device

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Thin-film semiconductor device and method of manufacturing the same

Manufacturing and testing of electrostatic discharge protection circuits

Semiconductor chip capable of implementing wire bonding over active circuits

Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment

High-speed TO-can optoelectronic packages

Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement

Lighting apparatus

Lens having Fresnel lens surface(s) and lighting apparatus using it

Apparatus and method for attaching a heat sink to an integrated circuit module

Heat sink with built-in heat pipes for semiconductor packages

LED lighting apparatus

Electronic component having a connection member connecting a resonator terminal and a mounting substrate electrode

Flexible substrate and electronic equipment

High frequency power amplifier and wireless communication module

LED display with overlay

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Top layers of metal for high performance IC's

Semiconductor device and manufacturing method thereof

Integrated circuit bond pad structures and methods of making

Semiconductor device and method for manufacturing the same

Bump and fabricating process thereof

Chip size image sensor camera module

Solderable top metalization and passivation for source mounted package

Method and apparatus for bonding a wire

Semiconductor component assemblies having interconnects

Semiconductor package

Semiconductor package without bonding wires and fabrication method thereof

Semiconductor device, semiconductor package, and method for testing semiconductor device

Multi-chip package

Semiconductor device

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Semiconductor element and wafer level chip size package therefor

Multichip semiconductor package

Semiconductor package having heat spreader and package stack using the same

Semiconductor stack package and memory module with improved heat dissipation

Multi-chip package structure

Protection of plastic detector's packages against shortwave light destruction

Semiconductor device and manufacturing method thereof

Sensor device

Semiconductor device and electronic device

Leadframe with die pad

Semiconductor device with interlocking clip

Method for fabricating a chip-scale-packaging (CSP) having an inductor

Circuit device

Support frame for semiconductor packages

Integrated sensor and electronics package

Electronic component having an integrated passive electronic component and associated production method

Light-emitting device with high heat-dissipating efficiency

Package array and package unit of flip chip LED

Phosphor and blends thereof for use in LEDs

Light emitting device

High power LED package

Method of semiconductor device assembly including fatigue-resistant ternary solder alloy

Wire bonding apparatus having actuated flame-off wand

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Universal non-volatile memory card used with various different standard cards containing a memory controller

Underfill system for die-over-die arrangements

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Semiconductor device and method of manufacturing the same

Method and apparatus for joining semiconductor

Process for the production of light-emitting diode light sources with a luminescence conversion element

Resin coating method and apparatus

Resin coating method and apparatus

Resin coating method and apparatus

Transmitting optical subassembly capable of monitoring the front beam of the semiconductor laser diode

High frequency module board device

Semiconductor laser and apparatus

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Package of solid-state imaging device

Wire bonding method and liquid-jet head

Driver chip and display apparatus having the same

Temperature controlled MEMS resonator and method for controlling resonator frequency

Absolute power detector

High frequency ultrasound transducers based on ceramic films

Integrated circuit package with keep-out zone overlapping undercut zone

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Circuit component with bump formed over chip

Semiconductor device having a multi-chip stacked structure and reduced thickness

Submount and semiconductor device

Semiconductor device and manufacturing method for the same

Method for mounting semiconductor chips and corresponding semiconductor chip system

Packaged semiconductor device

Bonding structure and fabrication thereof

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Electrical connection materials and electrical connection methods

Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Capacitor-related systems for addressing package/motherboard resonance

Multi-chip package including at least one semiconductor device enclosed therein

Stacked packages and systems incorporating the same

High frequency semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Bonding pad arrangement method for semiconductor devices

Optical semiconductor device

Testable electrostatic discharge protection circuits

Semiconductor device

Semiconductor light emitting device and method for manufacturing same

High power light emitting diode

Flip-chip light emitting diode device without sub-mount

Light emitting device and a lighting apparatus

Light emitting device

Light-emitting diode

Semiconductor light emitting element and method of making the same

Semiconductor devices and manufacturing method therefor

LED fabrication via ion implant isolation

Solid state relay

Infrared receiver chip

Ultrasonic bonding apparatus and method

Bump bonding apparatus and bump bonding method

Compliant contact pin assembly, card system and methods thereof

Electrical contact

Multiple-ball wire bonds

Apparatus and method for forming bump

Method to prevent passivation layer peeling in a solder bump formation process

Semiconductor packaging techniques for use with non-ceramic packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods of fabrication of package assemblies for optically interactive electronic devices

Via structure of packages for high frequency semiconductor devices

Manufacturing method of semiconductor device

Semiconductor device

Electronic component, method of manufacturing the electronic component, and electronic apparatus

Camera module

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device assembly process

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Packaged die on PCB with heat sink encapsulant and methods

Low coefficient of thermal expansion build-up layer packaging and method thereof

Semiconductor package with crossing conductor assembly and method of manufacture

Apparatus for encapsulating a multi-chip substrate array

Semiconductor package

Interconnect system without through-holes

Semiconductor device

Semiconductor device and manufacturing method thereof

Packaging substrates for integrated circuits and soldering methods

Packaged acoustic and electromagnetic transducer chips

Chip package structure

Method of manufacturing a semiconductor device

Method of surface mounting a semiconductor device

Semiconductor device support structures

Lead-frame for electonic devices with extruded pads

Chip on photosensitive device package structure and electrical connection thereof

Multiple die package

Packaged acoustic and electromagnetic transducer chips

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb

High power and high brightness white LED assemblies and method for mass production of the same

High speed optical subassembly with ceramic carrier

Optical transmission module for use in high-speed optical fiber communication

Semiconductor light emitting device and method for manufacturing same

Semiconductor relay apparatus and wiring board fabrication method

Optoelectronic arrangement

Chip package structure

Electronic assembly and method of manufacture thereof

Method of manufacturing multi-layer printed circuit board

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

Manufacturing method for semiconductor device and semiconductor device

Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components

Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities

Method of manufacturing semiconductor device

Chip scale surface mounted device and process of manufacture

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Intrinsic thermal enhancement for FBGA package

Method for packaging semiconductor chips and corresponding semiconductor chip system

Compact optical sub-assembly with ceramic package

Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication

Optoelectronic device having a Discrete Bragg Reflector and an electro-absorption modulator

High-density illumination system

Substrate for carrying a semiconductor chip and a manufacturing method thereof

Stress relieved flat frame for DMD window

RF package

Light emitting device fabrication method

Actuator and bonding apparatus

Semiconductor package for lowering electromagnetic interference and method for fabricating the same

Photosensitive semiconductor package with support member and method for fabricating the same

Semiconductor integrated circuit device

Packaged systems with MRAM

Daisy chaining of serial I/O interface on stacking devices

Electrode package for semiconductor device

Optimized power delivery to high speed, high pin-count devices

Thin film transistor substrate and manufacturing method thereof

Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device package of stacked semiconductor chips with spacers provided therein

System in package

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

Optical semiconductor device having a lead frame and electronic equipment using same

Semiconductor device and fabrication method for the same

Circuit carrier

Semiconductor package free of substrate and fabrication method thereof

Two die semiconductor assembly and system including same