Automotive plastic lead frame sensor

System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference

Capacitor, semiconductor device including the capacitor and methods of fabricating the same

Process for resurf diffusion for high voltage MOSFET

Trench IGBT for highly capacitive loads

Semiconductor integrated circuit

ESD protection system for multiple-domain integrated circuits

Tunable protection system for integrated circuits

Ferrite material and ceramic substrate

Dielectric materials for electronic devices

Termination structure for a power semiconductor device

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

Light emitting diode and side emitting lens

Light-emitting device, planar light source and direct type backlight module

Semiconductor memory element and lifetime operation starting appartus therefor

Laser mark on an IC component

Back-biased face target sputtering based high density non-volatile caching data storage

Back-biased face target sputtering based high density non-volatile data storage

Heat dissipation device

Rotatable liquid reservoir for computer cooling

Hybrid wicking materials for use in high performance heat pipes

Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device

Structure for connecting radiating fins

Method for producing high-active titanium dioxide hydrosol by using metatitanate as precursor

Methods for discretized processing and process sequence integration of regions of a substrate

Chemical mechanical polishing techniques for integrated circuit fabrication

Gate technology for strained surface channel and strained buried channel MOSFET devices

Wafer having indicator for first die and method of attaching die of the wafer

Programmable fuse with silicon germanium

Semiconductor substrate for build-up packages

Method of fabricating a miniature silicon condenser microphone

Method of manufacturing semiconductor device from semiconductor wafer

Radiation emitting semiconductor chip

Overlay metrology method and apparatus using more than one grating per measurement direction

Trimming circuit, electronic circuit, and trimming control system

Selective on-die termination for improved power management and thermal distribution

Semi-conductor chip package capable of detecting open and short

Double-Sided Organic Light-Emitting Diode Display

Leaded package integrated circuit stacking

Electrode and method for forming the same

Semiconductor device including metal interconnection and method for forming metal interconnection

Wafer level laser marking system for ultra-thin wafers using support tape

Semiconductor device having improved metal wiring

System and Method for Noise Reduction in Multi-Layer Ceramic Packages

Semiconductor device

Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement

Semiconductor device

Single lithography-step planar metal-insulator-metal capacitor and resistor

Semiconductor component with PN junction

Submount substrate for mounting light emitting device and method of fabricating the same

Wafer-level chip-scale package of image sensor and method of manufacturing the same

Semiconductor device

Nitride semiconductor substrate, and method for working nitride semiconductor substrate

Gallium nitride-based compound semiconductor light-emitting device, positive electrode for the device, light-emitting diode and lamp using the device

White light emitting device capable of adjusting color temperature

LED with light transmissive heat sink

Alternating current light-emitting device

Test pattern of CMOS image sensor and method of measuring process management using the same

Electrically conductive paste and multilayer ceramic substrate

Heat-dissipating model

Apparatus for making thermal interface material with a cylindrical rotor

Method of manufacturing a heat pipe

On-chip bypass capacitor and method of manufacturing the same

Clip for heat sink

Integrated circuit device and method for forming the same

Integrated circuit arrangement and method

Fully integrated tuner architecture

Flat-type capacitor for integrated circuit and method of manufacturing the same

Capacitance process using passivation film scheme

Method for manufacturing vertically structured light emitting diode

Efficient provision of alignment marks on semiconductor wafer

Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key

Metal plating using seed film

Heat spreader for emissive display device

Thin film device and thin film inductor

Multilevel interconnection board and method of fabricating the same

Patterns of electrically conducting polymers and their application as electrodes or electrical contacts

Filtering apparatus, method, and medium for multi-format codec

Thermal contact arrangement

Bi-Polar Thermal Managment

Method, apparatus and computer system for providing for the transfer of thermal energy

Synthetic jet-based heat dissipation device

IC coolant microchannel assembly with integrated attachment hardware

Apparatus and method to efficiently cool a computing device

Structure and method for simultaneously determining an overlay accuracy and pattern placement error

Resistance circuit, and voltage detection and constant voltage generating circuits incorporating such resistance circuit

Semiconductor integrated circuit having current leakage reduction scheme

Layout for DUT arrays used in semiconductor wafer testing

Arrangement with an electronically commutated external rotor motor

Semiconductor integrated circuit

Printed circuit board with differential pair arrangement

Metal interconnection lines of semiconductor devices and methods of forming the same

Encapsulated damascene with improved overlayer adhesion

Amine-free deposition of metal-nitride films

EMI SHIELDING DEVICE FOR PCB

On-chip capacitor structure

Method for forming microelectronic assembly

Semiconductor device

Radiation tolerant electrostatic discharge protection networks

Semiconductor device and manufacturing process therefor

Integrated circuit with self-aligned line and via

SOI semiconductor component with increased dielectric strength

Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same

On-chip capacitor structure with adjustable capacitance

High density, high Q capacitor on top of a protective layer

Semiconductor decoupling capacitor

Semiconductor memory device and method of production

Method and apparatus for manufacturing a semiconductor device

Packaging method of a light-sensing semiconductor device and packaging structure thereof

High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Heat sink with heat pipes

Multi-layered micro-channel heat sink

Liquid cooling device

Heat sink

Heat sink

Heat sink

Heat sink with multiple coolant inlets

Shape memory alloy motor as incorporated into solar tracking mechanism

Wireless pressure sensor and method of forming same

Method for manufacturing a heat pipe

Method for sealing a heat pipe

Method and system for manufacturing a wireless communication device

Adaptive user profiling on mobile devices

Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device

Method of forming an alignment key having a capping layer and method of fabricating a semiconductor device using the same

Plastically deformable irreversible storage medium and method of producing one such medium

Method of reducing current leakage in a metal insulator metal semiconductor capacitor and semiconductor capacitor thereof

Method of resin-seal-molding electronic component and apparatus therefor

Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener

Electronic Device with Inductor and Integrated Componentry

Device package and methods for the fabrication and testing thereof

INTEGRATED CIRCUIT CAPACITOR STRUCTURE

Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability

Method for manufacturing a printed circuit board having conformal EMI shield

Integrated circuit with improved component interconnections

Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement

Semiconductor device

Power delivery and power management of many-core processors

Adjustable height liquid cooler in liquid flow through plate

Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer

Solid state LED bridge rectifier light engine

Sphere-supported thin film phosphor electroluminescent devices

Method of resin-seal-molding electronic component and apparatus therefor

Method of resin-seal-molding electronic component and apparatus therefor

Method and apparatus to generate a seal between metallic and plastic materials

In mold manufacturing of an object comprising a functional element

ALIGNMENT MARK, ALIGNMENT APPARATUS AND METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD

Overlay mark

Overlay metrology mark

Image sensor module, camera module using the same, and method of manufacturing the camera module

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

MIM capacitor integrated into the damascene structure and method of making thereof

Semiconductor device

Interconnect structure with polygon cell structures

Ohmic contact on p-type GaN

Lead-free solder ball

Device with surface cooling and method of making

Reduced stress on SAW die with surrounding support structures

Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same

Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same

Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

Integrated circuit solder bumping system

MEMS element having a dummy pattern

Semiconductor structure and fabricating method thereof

Seal ring corner design

Thin film resistors integrated at two different metal interconnect levels of single die

Methods of forming electromigration and thermal gradient based fuse structures

Fuse structure for a semiconductor device

Method for manufacturing an integrated semiconductor device

Semiconductor device production method and semiconductor device

Semiconductor device

Semiconductor device and method for fabricating the same

Thin film resistors integrated at a single metal interconnect level of die

Mobility enhancement by strained channel CMOSFET with single workfunction metal-gate and fabrication method thereof

Top electrode in a strongly oxidizing environment

Memory with high dielectric constant antifuses and method for using at low voltage

Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component

P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse

Superlattice for fabricating nanowires

Composite and susceptor for semiconductor manufacturing device and power module with the same

Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit

Optimally shaped spreader plate for electronics cooling assembly

THERMAL MODULE

Heat pipe type cooler

Flat plate heat transfer device

Heat dissipation system

Heatsink

Method for manufacturing heat pipes

Method of manufacturing a PCB having improved cooling

Configurable voltage regulator

Measurement alignment system to determine alignment between chips

Electric element and electric circuit

Surface level control systems and material recycling systems for use with programmable material consolidation apparatus

Resin resolution composition, polyimide resin, and semiconductor device

Method and arrangement for repairing memory chips using microlithography methods

Assembly of a mobile objective above an optical sensor

Like integrated circuit devices with different depth

Defectivity and process control of electroless deposition in microelectronics applications

Defectivity and process control of electroless deposition in microelectronics applications

Defectivity and process control of electroless deposition in microelectronics applications

METHOD OF FORMING OPENING AND CONTACT

Semiconductor substrate with islands of diamond and resulting devices

METHOD OF MANUFACTURING SEMICONDUCTOR STUCTURE

Semiconductor device and method of manufacturing the same

Method for producing a light emitting device

Reconfigurable input/output in hierarchical memory link

LED device with enhanced light output

Heat dissipation in integrated circuits

Peripheral device and electronic device

Electronics assembly and heat pipe device

Heat dissipating system

Heat dissipating system

Air diverter for directing air upwardly in an equipment enclosure

Film resistor and a method for forming and trimming a film resistor

Logic cell with two isolated redundant outputs, and corresponding integrated circuit

Light emitting diode for emitting white light

Electro-optical device and electronic device

PARTIALLY BONDING STRUCTURE FOR A POLYMER AND A CHIP

Routing under bond pad for the replacement of an interconnect layer

Semiconductor device and method for designing same

Method of forming an interconnect including a dielectric cap having a tensile stress

Heat dissipating assembly for heat dissipating substrate and application

Chip cooling system

Structure Of Memory Card Packaging And Method Of Forming The Same

Overlay key, method of forming the overlay key, semiconductor device including the overlay key and method of manufacturing the semiconductor device

Semiconductor integrated circuit device and process for manufacturing the same

Electronic circuit arrangement with an electrical fuse

Semiconductor device having fuse element

Rewiring substrate strip having a plurality of semiconductor component positions

A metal fuse for semiconductor devices and methods of manufacturing thereof

Integrated circuitry and method for manufacturing the same

Semiconductor device including power MOS field-effect transistor and driver circuit driving thereof

Semiconductor device with dummy electrode

Power supply apparatus

Metal plating using seed film

Power semiconductor device with integrated passive component

Semiconductor device, and method for manufacturing semiconductor device

Semiconductor integrated circuit device with protection capability for protection circuits from static electrical charge

Method for producing electronic components

Packaging structure of a light-sensing device with a spacer wall

Heat sink module

Heat dissipating system

Cooling structure, heatsink and cooling method of heat generator

Flow distributing unit and cooling unit

Copper alloy and process for producing the same

Defectivity and process control of electroless deposition in microelectronics applications

Apparatus and method for manufacturing heat pipe

Method for making heat-dissipation device having vacuum chamber and working fluid therein

METHOD OF FILLING AND SEALING WORKING FLUID WITHIN HEAT-DISSIPATING DEVICE

Miniaturized co-fired electrical interconnects for implantable medical devices

Manufacturing method for a wireless communication device and manufacturing apparatus

Modular sockets using flexible interconnects

Method of forming metal wiring layer of semiconductor device

Transistor design self-aligned to contact

Method for manufacturing semiconductor device

Nitrous oxide anneal of TEOS/ozone CVD for improved gapfill

Semiconductor device and method of manufacturing same

Methods of forming zirconium aluminum oxide

Method for manufacturing thermal interface material with carbon nanotubes

Method for forming a capacitor

Capacitor for a semiconductor device

Method of making and designing dummy patterns for semiconductor devices and semiconductor devices having dummy patterns

Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer

Temperature control unit for electronic component and handler apparatus

Electronic apparatus and thermal dissipating module thereof

Heat dissipation device having power wires fixture

HEAT PIPE TYPE HEAT DISSIPATION DEVICE

Heat dissipation device

Fan duct

Heat sink having ferrofluid-based pump for nanoliquid cooling

Capacitor structure

Double sided AMOLED display and fabricating method thereof

Patterns of electrically conducting polymers and their application as electrodes or electrical contacts

Method for producing carbon nanotube-dispersed composite material

Electronic package with compliant electrically-conductive ball interconnect

Semiconductor device and method for fabricating the same

Multilayered wiring substrate and manufacturing method thereof

Wiring board and method for manufacturing the same, and semiconductor device

Device for preventing low-melting-point heat-transfer medium from oxidization

Area array routing masks for improved escape of devices on PCB

Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same

Embedded capacitor with interdigitated structure

Semiconductor fuse box and method for fabricating the same

LCD source driver for improving electrostatic discharge

MIM capacitor integrated into the damascene structure and method of making thereof

Power semiconductor device and method therefor

Semiconductor device

LED array cooling system

Versatile system for charge dissipation in the formation of semiconductor device structures

Process and system for etching doped silicon using SF-based chemistry

Flat-plate heat pipe containing channels

Integrated cooling design with heat pipes

Heat dissipation module and heat pipe thereof

Heat pipe and method for manufacturing same

Thermionic vacuum diode device with adjustable electrodes

Computer with thermoelectric conversion

Passive heat-dissipating fan system and electronic system containing the same

Self-reparable semiconductor and method thereof

Self-reparable semiconductor and method thereof

Self-reparable semiconductor and method thereof