ClassID:

212006

H01L2924/0002 - page 99 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#29401
20070108554
2007-05-17

De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits

#29402
20070108551
2007-05-17

High performance system-on-chip inductor using post passivation process

#29403
20070108550
2007-05-17

Semiconductor device and method of fabricating the same

#29404
20070108535
2007-05-17

Field effect transistor having contact plugs in the source region greater than in the drain region

#29405
20070108528
2007-05-17

SRAM cell

#29406
20070108525
2007-05-17

Method to increase strain enhancement with spacerless FET and dual liner process

#29407
20070108521
2007-05-17

Flexible semiconductor device and identification label

#29408
20070108512
2007-05-17

Power semiconductor component with charge compensation structure and method for the fabrication thereof

#29409
20070108388
2007-05-17

Die temperature sensors

#29410
20070108372
2007-05-17

Photoelectric conversion device for reducing radiation noise on large screen sensors

#29411
20070108326
2007-05-17

Mixing system for manufacturing thermal interface material

#29412
20070108298
2007-05-17

Smart Card Body, Smart Card and Manufacturing Process for the Same

#29413
20070108254
2007-05-17

Circuit board

#29414
20070107883
2007-05-17

Colored and textured heat dissipating device

#29415
20070107880
2007-05-17

Heat sink structure

#29416
20070107876
2007-05-17

Heat sink with heat pipes

#29417
20070107875
2007-05-17

Flat plate heat transfer device

#29418
20070107874
2007-05-17

Water Cooling Type Heat Dissipation Apparatus with Parallel Runners

#29419
20070107873
2007-05-17

Water-Cooling Head and Method for making the same

#29420
20070107872
2007-05-17

Heat sink with increased cooling capacity and semiconductor device comprising the heat sink

#29421
20070107871
2007-05-17

Heat sink

#29422
20070107441
2007-05-17

Heat-dissipating unit and related liquid cooling module

#29423
20070107214
2007-05-17

Soldering method

#29424
20070107206
2007-05-17

Method of forming a spiral inductor in a semiconductor substrate

#29425
20070106964
2007-05-10

Optimized microchip and related methods

#29426
20070106837
2007-05-10

Information transfer in electronic modules

#29427
20070106416
2007-05-10

Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same

#29428
20070106056
2007-05-10

Crosslinked polyimide, composition comprising the same and method for producing the same

#29429
20070106036
2007-05-10

Semiconductor encapsulating epoxy resin composition and semiconductor device

#29430
20070105398
2007-05-10

Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device

#29431
20070105394
2007-05-10

Method for coating a structure comprising semiconductor chips

#29432
20070105377
2007-05-10

Fabrication of semiconductor interconnect structure

#29433
20070105369
2007-05-10

Semiconductor device and manufacturing method thereof

#29434
20070105366
2007-05-10

Long-term heat-treated integrated circuit arrangements and methods for producing the same

#29435
20070105364
2007-05-10

Method of forming interconnect having stacked alignment mark

#29436
20070105359
2007-05-10

Electrical interconnection structure formation

#29437
20070105357
2007-05-10

Silicided recessed silicon

#29438
20070105356
2007-05-10

Method of controlling nanowire growth and device with controlled-growth nanowire

#29439
20070105344
2007-05-10

Method for pre-treating epitaxial layer, method for evaluating epitaxial layer, and apparatus for evaluating epitaxial layer

#29440
20070105335
2007-05-10

Monolithically integrated silicon and III-V electronics

#29441
20070105297
2007-05-10

Methods of manufacturing semiconductor devices

#29442
20070105296
2007-05-10

Method for production of semiconductor device

#29443
20070105284
2007-05-10

Method for forming a memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide

#29444
20070105275
2007-05-10

Apparatus for positioning power semiconductor modules and method for surface treatment thereof

#29445
20070105274
2007-05-10

Monolithically integrated semiconductor materials and devices

#29446
20070105272
2007-05-10

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

#29447
20070105256
2007-05-10

Monolithically integrated light emitting devices

#29448
20070105247
2007-05-10

Method And Apparatus For Detecting The Endpoint Of A Chemical-Mechanical Polishing Operation

#29449
20070105243
2007-05-10

Method and apparatus for semiconductor device production process monitoring and method and apparatus for estimating cross sectional shape of a pattern

#29450
20070104929
2007-05-10

Method for plating printed circuit board and printed circuit board manufactured therefrom

#29451
20070104872
2007-05-10

Method of sealing semiconductor element mounted on gold-plated printed circuit board

#29452
20070104605
2007-05-10

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

#29453
20070104233
2007-05-10

Thermal management system for high energy laser

#29454
20070103875
2007-05-10

Cycling LED heat spreader

#29455
20070103874
2007-05-10

Heat dissipating device for a memory chip

#29456
20070103873
2007-05-10

Heat sink module

#29457
20070103872
2007-05-10

Heat sink assembly having a fan mounting device

#29458
20070103871
2007-05-10

HEAT DISSIPATION MODULE

#29459
20070103870
2007-05-10

Locking device for heat sink

#29460
20070103869
2007-05-10

Integrated liquid cooling system

#29461
20070103250
2007-05-10

Growth of high quality low-loss ferrite materials on wide bandgap semiconductor substrates

#29462
20070103228
2007-05-10

Stackable programmable passive device and a testing method

#29463
20070103191
2007-05-10

Semiconductor-integrated circuit utilizing magnetoresistive effect elements

#29464
20070103173
2007-05-10

Systems and methods for controlling of electro-migration

#29465
20070103144
2007-05-10

CALIBRATION PATTERN AND CALIBRATION JIG

#29466
20070103066
2007-05-10

Stacked OLEDs with a reflective conductive layer

#29467
20070102825
2007-05-10

Semiconductor package

#29468
20070102824
2007-05-10

Tungsten plug structure of semiconductor device and method for forming the same

#29469
20070102823
2007-05-10

Semiconductor device, electronic device and electronic apparatus

#29470
20070102821
2007-05-10

Use of supercritical fluid for low effective dielectric constant metallization

#29471
20070102820
2007-05-10

Semiconductor integrated circuit

#29472
20070102819
2007-05-10

Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement

#29473
20070102818
2007-05-10

TFT wiring comprising copper layer coated by metal and metal oxide

#29474
20070102817
2007-05-10

Method and apparatus for reducing electrical interconnection fatigue

#29475
20070102808
2007-05-10

Semiconductor module and radiator plate

#29476
20070102805
2007-05-10

CHIP TYPE ELECTRIC DEVICE AND METHOD, AND DISPLAY DEVICE INCLUDING THE SAME

#29477
20070102795
2007-05-10

RADIATOR PLATE AND SEMICONDUCTOR DEVICE

#29478
20070102793
2007-05-10

Semiconductor chip and method of fabricating the same

#29479
20070102792
2007-05-10

MULTI-LAYER CRACK STOP STRUCTURE

#29480
20070102791
2007-05-10

STRUCTURE OF MULTI-LAYER CRACK STOP RING AND WAFER HAVING THE SAME

#29481
20070102788
2007-05-10

Multi-terminal capacitor

#29482
20070102787
2007-05-10

Capacitor integrated in a structure surrounding a die

#29483
20070102786
2007-05-10

Semiconductor device

#29484
20070102785
2007-05-10

SEMICONDUCTOR DEVICE WITH FUSE AND METHOD OF FABRICATING THE SAME

#29485
20070102768
2007-05-10

CMOS transistors using gate electrodes to increase channel mobilities by inducing localized channel stress

#29486
20070102765
2007-05-10

Layout structure of electrostatic discharge protection circuit

#29487
20070102745
2007-05-10

CAPACITOR STRUCTURE

#29488
20070102727
2007-05-10

Field-effect transistor

#29489
20070102720
2007-05-10

Light-emitting module and backlight unit having the same

#29490
20070102693
2007-05-10

Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device

#29491
20070102622
2007-05-10

Apparatus for multiple camera devices and method of operating same

#29492
20070102548
2007-05-10

Grinding machine with spherical grinding surface

#29493
20070102396
2007-05-10

Method of making a circuitized substrate

#29494
20070102191
2007-05-10

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

#29495
20070102147
2007-05-10

HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME

#29496
20070102146
2007-05-10

COOLING DEVICE FOR ELECTRONIC COMPONENTS

#29497
20070102144
2007-05-10

Radiating module and the manufacturing method thereof

#29498
20070102143
2007-05-10

Heat dissipation module and heat pipe thereof

#29499
20070102142
2007-05-10

Heat spreaders with vias

#29500
20070102141
2007-05-10

Diversion component

#29501
20070102140
2007-05-10

Structured thermal transfer article

#29502
20070102116
2007-05-10

Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles

#29503
20070102070
2007-05-10

Thermal transfer coating

#29504
20070101932
2007-05-10

Method and apparatus for producing large, single-crystals of aluminum nitride

#29505
20070101305
2007-05-03

Methods and systems for implementing dummy fill for integrated circuits

#29506
20070099414
2007-05-03

Semiconductor device comprising a contact structure based on copper and tungsten

#29507
20070099402
2007-05-03

METHOD FOR FABRICATING RELIABLE SEMICONDUCTOR STRUCTURE

#29508
20070099394
2007-05-03

Semiconductor device having first and second dummy wirings varying in sizes/coverage ratios around a plug connecting part

#29509
20070099378
2007-05-03

Semiconductor device having align key and method of fabricating the same

#29510
20070099377
2007-05-03

Integrated circuit having resistive memory cells

#29511
20070099342
2007-05-03

Method of fabricating a BGA package having decreased adhesion

#29512
20070099326
2007-05-03

eFuse and methods of manufacturing the same

#29513
20070099325
2007-05-03

Light emitting diode device, manufacturing method of the light emitting diode device and mounting structure of the light emitting diode device

#29514
20070099317
2007-05-03

Method for manufacturing vertical structure light emitting diode

#29515
20070099097
2007-05-03

Multi-purpose measurement marks for semiconductor devices, and methods, systems and computer program products for using same

#29516
20070099010
2007-05-03

Etch stop layer for a metallization layer with enhanced adhesion, etch selectivity and hermeticity

#29517
20070099009
2007-05-03

Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element

#29518
20070098344
2007-05-03

Forming of a cavity in an insulating layer

#29519
20070097770
2007-05-03

Method and arrangement in inverter

#29520
20070097763
2007-05-03

Manufacturing method of semiconductor integrated circuit device

#29521
20070097656
2007-05-03

Semiconductor device having a mount board

#29522
20070097654
2007-05-03

Heat dissipation device

#29523
20070097653
2007-05-03

Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

#29524
20070097649
2007-05-03

Universal locking device for heat sink

#29525
20070097648
2007-05-03

Method and apparatus for establishing optimal thermal contact between opposing surfaces

#29526
20070097647
2007-05-03

Secure device for a heat dissipating component

#29527
20070097646
2007-05-03

HEAT DISSIPATING APPARATUS FOR COMPUTER ADD-ON CARDS

#29528
20070097645
2007-05-03

Heat pipe with expanded heat receiving section and heat dissipation module

#29529
20070097644
2007-05-03

Heat dissipation assembly

#29530
20070097643
2007-05-03

Thermal structure for electric devices

#29531
20070097642
2007-05-03

Method and apparatus for thermal dissipation

#29532
20070097640
2007-05-03

Liquid cooling device

#29533
20070097638
2007-05-03

CPU heat dissipating device structure

#29534
20070097637
2007-05-03

Heat dissipation device

#29535
20070097633
2007-05-03

Heat dissipating device having a fan duct

#29536
20070097632
2007-05-03

Heat dissipating assembly with fan fastening device

#29537
20070097631
2007-05-03

Heat sink assembly

#29538
20070097630
2007-05-03

Electronic system having a fan duct

#29539
20070097629
2007-05-03

Axial duct cooling fan

#29540
20070097626
2007-05-03

Structure for heat dissipation in a portable computer

#29541
20070097581
2007-05-03

Electrostatic discharge (ESD) protection circuit for multiple power domain integrated circuit

#29542
20070097573
2007-05-03

System LSI

#29543
20070096849
2007-05-03

EMI filter

#29544
20070096616
2007-05-03

Vertical interconnection structure including carbon nanotubes and method of fabricating the same

#29545
20070096339
2007-05-03

Junction structure for a terminal pad and solder, and semiconductor device having the same

#29546
20070096328
2007-05-03

Multilayer printed wiring board

#29547
20070096326
2007-05-03

Semiconductor device and fabrication method thereof

#29548
20070096325
2007-05-03

Semiconductor apparatus

#29549
20070096324
2007-05-03

Metal during pattern for memory devices

#29550
20070096323
2007-05-03

Metal during pattern for memory devices

#29551
20070096322
2007-05-03

Interconnection structure of semiconductor device

#29552
20070096321
2007-05-03

Conformal lining layers for damascene metallization

#29553
20070096319
2007-05-03

Method for fabricating and BEOL interconnect structures with simultaneous formation of high-k and low-k dielectric regions

#29554
20070096310
2007-05-03

Semiconductor device

#29555
20070096309
2007-05-03

Semiconductor device, method of forming wiring pattern, and method of generating mask wiring data

#29556
20070096308
2007-05-03

Semiconductor device

#29557
20070096302
2007-05-03

Semiconductor memory module

#29558
20070096301
2007-05-03

Semiconductor device and method of manufacturing thereof

#29559
20070096298
2007-05-03

Thermal management device attachment

#29560
20070096297
2007-05-03

RF power transistor package

#29561
20070096273
2007-05-03

Reduction of Electromagnetic Interference in Integrated Circuit Device Packages

#29562
20070096266
2007-05-03

High density three dimensional semiconductor die package

#29563
20070096263
2007-05-03

Accessible chip stack and process of manufacturing thereof

#29564
20070096260
2007-05-03

REDUCED PARASITIC AND HIGH VALUE RESISTOR AND METHOD OF MANUFACTURE

#29565
20070096252
2007-05-03

Multi-surfaced plate-to-plate capacitor and method of forming same

#29566
20070096251
2007-05-03

Semiconductor device comprising fuse sections

#29567
20070096250
2007-05-03

Semiconductor device and method of manufacturing the same

#29568
20070096235
2007-05-03

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

#29569
20070096234
2007-05-03

Image pickup device mounting structure for saving space in an optical device

#29570
20070096221
2007-05-03

SEMICONDUCTOR DEVICE COMPRISING COPPER-BASED CONTACT PLUG AND A METHOD OF FORMING THE SAME

#29571
20070096216
2007-05-03

Manufacturing semiconductor circuit, corresponding semiconductor circuit, and associated design process

#29572
20070096213
2007-05-03

Electrostatic discharge protection circuit

#29573
20070096193
2007-05-03

Non-volatile memory device with tensile strained silicon layer

#29574
20070096190
2007-05-03

Interconnect line selectively isolated from an underlying contact plug

#29575
20070096165
2007-05-03

In-situ wet chemical process monitor

#29576
20070096131
2007-05-03

Laminating encapsulant film containing phosphor over LEDs

#29577
20070096108
2007-05-03

Etch stop layer for a metallization layer with enhanced etch selectivity and hermeticity

#29578
20070096094
2007-05-03

Methods and apparatus for designing and using micro-targets in overlay metrology

#29579
20070096093
2007-05-03

Calibration technique for measuring gate resistance of power MOS gate device at water level

#29580
20070096092
2007-05-03

Semiconductor device fault detection system and method

#29581
20070095652
2007-05-03

Dendritic fiber material

#29582
20070095565
2007-05-03

Wiring board

#29583
20070095510
2007-05-03

HEAT-PIPE TYPE HEAT SINK

#29584
20070095509
2007-05-03

Heat dissipation having a heat pipe

#29585
20070095508
2007-05-03

Heat dissipation device having louvered heat-dissipating fins

#29586
20070095507
2007-05-03

Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes

#29587
20070095383
2007-05-03

Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same

#29588
20070094874
2007-05-03

Methods for forming connection structures for microelectronic devices

#29589
20070094632
2007-04-26

Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture

#29590
20070093246
2007-04-26

Method and system for providing information to a home system regarding a wireless unit roaming in a visited system

#29591
20070093078
2007-04-26

Porous insulating film, method for producing the same, and semiconductor device using the same

#29592
20070093066
2007-04-26

Stacked wafer or die packaging with enhanced thermal and device performance

#29593
20070093060
2007-04-26

SEMICONDUCTOR DEVICE HAVING A CU INTERCONNECTION

#29594
20070093053
2007-04-26

Method of fabricating interconnect structure

#29595
20070093052
2007-04-26

Semiconductor device having multiple wiring layers and method of producing the same

#29596
20070093047
2007-04-26

Semiconductor device and method for fabricating the same

#29597
20070093025
2007-04-26

Etch stop layer in poly-metal structures

#29598
20070093009
2007-04-26

Semiconductor device with vertical electron injection and its manufacturing method

#29599
20070092990
2007-04-26

Field effect transistors (FETS) with inverted source/drain metallic contacts, and method of fabricating same

#29600
20070092011
2007-04-26

Chip-to-chip communication system and method

#29601
20070091602
2007-04-26

Multiple light emitting diodes with different secondary optics

#29602
20070091578
2007-04-26

Circuit board having heat dissipation through holes

#29603
20070091576
2007-04-26

Heat dissipating assembly

#29604
20070091574
2007-04-26

Technique for forming a thermally conductive interface with patterned metal foil

#29605
20070091573
2007-04-26

Heat sink clip and assembly

#29606
20070091569
2007-04-26

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

#29607
20070091568
2007-04-26

Heat sink

#29608
20070091565
2007-04-26

Impingement cooling of components in an electronic system

#29609
20070091563
2007-04-26

Active heat sink with multiple fans

#29610
20070091546
2007-04-26

Universal pad arrangement for surface mounted semiconductor devices

#29611
20070091327
2007-04-26

Spectroscopic scatterometer system

#29612
20070091293
2007-04-26

Photoelectric sensor, optical module and method of producing same

#29613
20070090914
2007-04-26

Design and fabrication of inductors on a semiconductor substrate

#29614
20070090913
2007-04-26

Multi-loop type transformer

#29615
20070090869
2007-04-26

Combined power source and printed transistor circuit apparatus and method

#29616
20070090865
2007-04-26

Method and apparatus for providing a voltage to a circuit

#29617
20070090727
2007-04-26

Method of fabricating airtight terminals

#29618
20070090549
2007-04-26

Semiconductor device and method of fabricating the same

#29619
20070090548
2007-04-26

Stacked alignment mark and method for manufacturing thereof

#29620
20070090531
2007-04-26

Method of forming an electrical isolation associated with a wiring level on a semiconductor wafer

#29621
20070090520
2007-04-26

Cooling plate, bake unit, and substrate treating apparatus

#29622
20070090513
2007-04-26

Power module fabrication method and structure thereof

#29623
20070090504
2007-04-26

Optical sensor chip package

#29624
20070090492
2007-04-26

Semiconductor device with capacitively coupled field plate

#29625
20070090488
2007-04-26

High-efficiency matrix-type LED device

#29626
20070090486
2007-04-26

Fuse and method for disconnecting the fuse

#29627
20070090482
2007-04-26

High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same

#29628
20070090478
2007-04-26

Image sensor package structure

#29629
20070090472
2007-04-26

Semiconductor device and method for production thereof

#29630
20070090447
2007-04-26

Semiconductor device and method of manufacture thereof

#29631
20070090434
2007-04-26

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

#29632
20070090429
2007-04-26

Capacitor structure

#29633
20070090405
2007-04-26

Charge compensated dielectric layer structure and method of making the same

#29634
20070090388
2007-04-26

Light emitting diode chip with reflective layer thereon

#29635
20070090157
2007-04-26

Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor

#29636
20070089869
2007-04-26

HEAT SINK

#29637
20070089867
2007-04-26

Magneto-hydrodynamic hot spot cooling heat sink

#29638
20070089866
2007-04-26

Ferrofluid-cooled heat sink

#29639
20070089865
2007-04-26

BRAZED WICK FOR A HEAT TRANSFER DEVICE AND METHOD OF MAKING SAME

#29640
20070089863
2007-04-26

Cooling device having a slanted heat pipe

#29641
20070089859
2007-04-26

Electronic apparatus and cooling module

#29642
20070089667
2007-04-26

Method for manufacturing a thermal interface material

#29643
20070089504
2007-04-26

Gas flow measuring apparatus

#29644
20070089446
2007-04-26

Thermal management using stored field replaceable unit thermal information

#29645
20070089113
2007-04-19

CIRCUIT SUBSTRATE PRODUCTION METHOD AND SYSTEM, SUBSTRATE USED THEREIN, AND CIRCUIT SUBSTRATE USING THE SAME

#29646
20070089072
2007-04-19

SIGNAL TRANSMISSION STRUCTURE

#29647
20070088144
2007-04-19

Organic silicate polymer and insulation film comprising the same

#29648
20070087929
2007-04-19

Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same

#29649
20070087747
2007-04-19

Method and System for Providing Information to a Home System Regarding a Wireless Unit Roaming in a Visited System

#29650
20070087746
2007-04-19

Method and System for Providing Information to a Home System Regarding a Wireless Unit Roaming in a Visited System

#29651
20070087718
2007-04-19

Cordless communication apparatus

#29652
20070087616
2007-04-19

Semiconductor device and manufacturing method thereof

#29653
20070087588
2007-04-19

Interposer with electrical contact button and method

#29654
20070087587
2007-04-19

Method for manufacturing circuit board for semiconductor package

#29655
20070087559
2007-04-19

Semiconductor device manufacturing method

#29656
20070087555
2007-04-19

Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via

#29657
20070087551
2007-04-19

Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner

#29658
20070087544
2007-04-19

Method for forming improved bump structure

#29659
20070087543
2007-04-19

Fuse structure having reduced heat dissipation towards the substrate

#29660
20070087528
2007-04-19

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

#29661
20070087508
2007-04-19

Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse

#29662
20070087496
2007-04-19

Non-volatile memory devices including fuse covered field regions

#29663
20070087483
2007-04-19

Heat sink and method for its production

#29664
20070087474
2007-04-19

Assembly process for out-of-plane MEMS and three-axis sensors

#29665
20070087473
2007-04-19

Method for manufacturing semiconductor package substrate

#29666
20070087274
2007-04-19

Wiring correction method

#29667
20070087128
2007-04-19

Shielded System with a Housing Having a High Atomic Number Metal Coating Applied By Thermal Spray Technique

#29668
20070087079
2007-04-19

Method and System for Integrated Circuit Packaging

#29669
20070087067
2007-04-19

Semiconductor die having a protective periphery region and method for forming

#29670
20070086644
2007-04-19

Non-lot based method for assembling integrated circuit devices

#29671
20070086211
2007-04-19

Side emitting illumination systems incorporating light emitting diodes

#29672
20070086170
2007-04-19

HEAT SINK DEVICE WITH SHIELDING MEMBER

#29673
20070086169
2007-04-19

Fastening structure

#29674
20070086168
2007-04-19

Method and apparatus for optimizing heat transfer with electronic components

#29675
20070086167
2007-04-19

Heat sink having speed-up heat-dissipating structure

#29676
20070086165
2007-04-19

Heat-generating electronic part cover and cover mounting method

#29677
20070086163
2007-04-19

Electronics assembly and electronics package carrier therefor

#29678
20070086145
2007-04-19

Capacitor-built-in substrate and method of manufacturing the same

#29679
20070086129
2007-04-19

Integrated circuit providing overvoltage protection for low voltage lines

#29680
20070085963
2007-04-19

Electrical connectors between electronic devices

#29681
20070085809
2007-04-19

Backup shift register module for a gateline driving circuit

#29682
20070085649
2007-04-19

Spiral inductor having variable inductance

#29683
20070085625
2007-04-19

Flexible capacitive coupler assembly and method of manufacture

#29684
20070085567
2007-04-19

CMOS circuit arrangement

#29685
20070085215
2007-04-19

Silicon based optical vias

#29686
20070085214
2007-04-19

Semiconductor device

#29687
20070085213
2007-04-19

Selective electroless-plated copper metallization

#29688
20070085212
2007-04-19

DIELECTRIC COMPOSITE MATERIAL

#29689
20070085211
2007-04-19

Semiconductor device and method for manufacturing the same

#29690
20070085210
2007-04-19

Interconnect structure and fabricating method thereof

#29691
20070085209
2007-04-19

Anchored damascene structures

#29692
20070085208
2007-04-19

INTERCONNECT STRUCTURE

#29693
20070085207
2007-04-19

Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device

#29694
20070085202
2007-04-19

Semiconductor device and communication system using the semiconductor device

#29695
20070085198
2007-04-19

Integrated micro-channels for 3D through silicon architectures

#29696
20070085194
2007-04-19

DIELECTRIC COMPOSITE MATERIAL

#29697
20070085193
2007-04-19

Printed wiring board and method of suppressing power supply noise thereof

#29698
20070085189
2007-04-19

Semiconductor chip and method of manufacturing semiconductor chip

#29699
20070085185
2007-04-19

Stacked integrated circuit chip assembly

#29700
20070085182
2007-04-19

Semiconductor device and fabrication method thereof