212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition
#30002Interconnect structures with encasing cap and methods of making thereof
#30003Low resistance and reliable copper interconnects by variable doping
#30004ALIGNMENT MARK AND METHOD OF FORMING THE SAME
#30005Lattice-mismatched semiconductor structures on insulators
#30006Semiconductor device manufacturing method and wafer
#30007Enhanced boron nitride composition and compositions made therewith
#30008Multi-layer ceramic substrate and manufacturing method thereof
#30009ADVANCED HEAT SINKS AND THERMAL SPREADERS
#30010Heat dissipation device and composite material with high thermal conductivity
#30011Integrated thermal and electrical connection system for power devices
#30012Thermal load balancing systems and methods
#30013Magneto-hydrodynamic heat sink
#30014Coated wafer level camera modules and associated methods
#30015Methods and systems for thermal-based laser processing a multi-material device
#30016Semiconductor device and method of manufacturing the same
#30017Cross-coupled inductor pair formed in an integrated circuit
#300183D MMIC balun and methods of making the same
#30019Linear charger where the material temperature directly affects the circuit thermal control
#30020Alignment checking structure and process using thereof
#30021Alignment marks for polarized light lithography and method for use thereof
#30022Chip structure and chip package structure
#30023Semiconductor package with getter formed over an irregular structure
#30024MULTI-LAYERED STRUCTURE AND FABRICATING METHOD THEREOF AND DUAL DAMASCENE STRUCTURE, INTERCONNECT STRUCTURE AND CAPACITOR
#30025Grafted seed layer for electrochemical plating
#30026TiN layer structures for semiconductor devices, methods of forming the same, semiconductor devices having TiN layer structures and methods of fabricating the same
#30027Semiconductor device having an interconnect structure and a reinforcing insulating film
#30028Spring clip for a portable electronic device
#30029Metal line for a semiconductor device and fabrication method thereof
#30030Semiconductor device and method for forming the same
#30031Integrated circuit device
#30032High density interconnect assembly comprising stacked electronic module
#30033Package-on-package semiconductor assembly
#30034Integrated conductor arrangement and corresponding production method
#30035Semiconductor device
#30036Vertical LC tank device
#30037High blocking semiconductor component comprising a drift section
#30038Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
#30039Semiconductor device and method for manufacturing the same
#30040Semiconductor device including an electrostatic discharge protection element
#30041Semiconductor device and manufacturing method thereof
#30042Rewiring substrate strip with several semiconductor component positions
#30043Dense non-volatile memory array and method of fabrication
#30044Semiconductor device
#30045High density led array
#30046Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver
#30047Method for testing metal-insulator-metal capacitor structures under high temperature at wafer level
#30048Method for generating test patterns utilized in manufacturing semiconductor device
#30049Method and arrangment for testing a stacked die semiconductor device
#30050Radiation detection device, scintillator panel, method of making the same, making apparatus, and radiation image pick-up system
#30051X-ray detector
#30052Thermal interface materials, methods of preparation thereof and their applications
#30053HEAT DISSIPATION DEVICE
#30054HEAT DISSIPATION DEVICE WITH A HEAT PIPE
#30055Heat collector
#30056Cooling device
#30057Heat-dissipating device with thin fins
#30058Method for manufacturing a CPU cooling assembly
#30059Scheme for spreading and facilitating remote e-services
#30060Method of making copper and carbon nanotube thermal conductor
#30061Fly ash powder and production method thereof and resin composition for semiconductor encapsulation and semiconductor device using the same
#30062Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
#30063Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition
#30064Silicided recessed silicon
#30065Disposable pillars for contact formation
#30066Method for re-forming BGA of a semiconductor package
#30067Methods for forming through-wafer interconnects and structures resulting therefrom
#30068EPI wafer and method of making the same
#30069Stacked chip package using photosensitive polymer and manufacturing method thereof
#30070Process of manufacturing semiconductor device
#30071Dense non-volatile memory array and method of fabrication
#30072Method of manufacturing semiconductor device suitable for forming wiring using damascene method
#30073Method of manufacturing a stacked semiconductor device
#30074Superjunction device with improved ruggedness
#30075Wafer level hermetic bond using metal alloy with raised feature
#30076Conductive through via process for electronic device carriers
#30077Memory device transistors
#30078Method for making integrated circuit chip utilizing oriented carbon nanotube conductive layers
#30079Thermal interface material and method for making the same
#30080Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
#30081Image sensor module, method of manufacturing the same, and camera module using the same
#30082Wiring board, electronic device, and power supply unit
#30083Variable spring rate thermal management apparatus attachment mechanism
#30084Assembly for an electronic component
#30085Fastener with snap-on feature, heat dissipation assembly for central processing unit and method of using the same
#30086Heat sink with twist lock mounting mechanism
#30087Composite heat dissipating apparatus
#30088Monolithic arrangement, especially an integrated circuit, with a floating electrode
#30089Integrated circuit having a switch
#30090Printer CPU with VLIW processor
#30091Method of verifying consistent measurement between a plurality of CD metrology tools
#30092Methods, systems, and apparatus for integrated circuit capacitors in capacitor arrays
#30093MEMS acoustic filter and fabrication of the same
#30094Circuitry and method for programming an electrically programmable fuse
#30095Method and apparatus to select a parameter/mode based on a time measurement
#30096Display device comprising a conductive barrier body in direct contact with a sealing material
#30097Quartz crystal vibrator, oscillator and electronic apparatus
#30098Surface mount type piezoelectric vibrator and its fabricating method, oscillator, electronic apparatus and radio wave timepiece
#30099Automotive alternator with rectifier having high-strength heat sinks
#30100Integration of evaporative cooling within microfluidic systems
#30101Method for forming alignment mark
#30102LSI package provided with interface module
#30103Reinforcements, baffles and seals with malleable carriers
#30104Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiOlayer
#30105Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#30106Devices including sloped vias in a substrate and devices including spring-like deflecting contacts
#30107Mixed metal nitride and boride barrier layers
#30108Method for forming a double embossing structure
#30109Method of manufacturing an insulating layer and method of manufacturing a semiconductor device using the insulating layer
#30110Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device
#30111Metal interconnect structure for integrated circuits and a design rule therefor
#30112Semiconductor structure having selective silicide-induced stress and a method of producing same
#30113Substrate for a ball grid array and a method for fabricating the same
#30114Stacked chip package using warp preventing insulative material and manufacturing method thereof
#30115Dynamic voltage and power management by temperature monitoring
#30116THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS
#30117Heat sink packaging assembly for electronic components
#30118Printed circuit board with dual type inner structure
#30119High permeability layered films to reduce noise in high speed interconnects
#30120Electronic package with improved current carrying capability and method of forming the same
#30121Multichip sensor
#30122STRUCTURE OF AN ULTRA-THIN WAFER LEVEL STACK PACKAGE
#30123Method for manufacturing semiconductor device
#30124Semiconductor chip package and application device thereof
#30125Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#30126Buried photodiode for image sensor with shallow trench isolation technology
#30127Tape carrier for TAB
#30128Continuous plating system and method with mask registration
#30129Semiconductor device having electrical fuse
#30130Methods of forming blind wafer interconnects
#30131Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure
#30132Integrated electronic device and method of making the same
#30133Fuse structure for a semiconductor device
#30134Semiconductor devices employing poly-filled trenches
#30135Integrated circuit chip stack employing carbon nanotube interconnects
#30136Semiconductor device and method of manufacturing the same
#30137Integrated circuit having a transistor level top side wafer contact and a method of manufacture therefor
#30138Stacked bit line dual word line nonvolatile memory
#30139Method for manufacturing semiconductor device
#30140Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
#30141Method for manufacturing a thin-film transistor
#30142Organic light emitting display
#30143Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
#30144Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
#30145Heat sink and information processing device
#30146Methods of forming integrated circuit devices having metal interconnect layers therein
#30147Cooling apparatus of electric device
#30148Water-cooled cooler for CPU of PC
#30149Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same
#30150Radiator module structure
#30151Liquid cooling device
#30152Bottom plate of a radiator for a CPU
#30153Heatsink having porous fin
#30154Cooling systems
#30155Conformable interface device for improved electrical joint
#30156HEAT SINK MADE FROM A SINGLY EXTRUDED HEATPIPE
#30157Fixture for attaching a heat sink to a heat generating device
#30158Semiconductor device, layout method and apparatus and program
#30159Semiconductor device with multiple wiring layers and moisture-protective ring
#30160Epoxy resin composition for encapsulating semiconductor chip and semiconductor device
#30161Heat sink made from diamond-copper composite material containing boron, and method of producing a heat sink
#30162Method of forming an interconnect structure for a semiconductor device
#30163Packaging of electronic chips with air-bridge structures
#30164Semiconductor device and method of manufacturing the same
#30165Signal routing on redistribution layer
#30166Method of forming metal plate pattern and circuit board
#30167ION IMPLANTED INSULATOR MATERIAL WITH REDUCED DIELECTRIC CONSTANT
#30168Single crystal based through the wafer connections technical field
#30169Semiconductor device and production method thereof
#30170Method for fabricating an interconnect arrangement with increased capacitive coupling and associated interconnect arrangement
#30171Microelectronic package optionally having differing cover and device thermal expansivities
#30172Aluminum/ceramic bonding substrate and method for producing same
#30173Heat spreader for emissive display device
#30174Tape substrate having reinforcement layer for tape packages
#30175Process for assembling passive and active components and corresponding integrated circuit
#30176Defect source analysis method, defect source analysis apparatus, and method of manufacturing semiconductor device
#30177Preset welding spot structure of a backlight module
#30178Heat dissipating apparatus
#30179Heat sink fastening system
#30180Circuit with a capacitive element with method for testing the same
#30181Display device
#30182Display device
#30183Print roll unit with ink storage core
#30184Heat dissipating grease
#30185Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
#30186Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application
#30187Interconnect of group III-V semiconductor device and fabrication method for making the same
#30188Method of packaging and interconnection of integrated circuits
#30189Integrated circuit package
#30190Electronic device and carrier substrate
#30191Device package and methods for the fabrication and testing thereof
#30192Flexible substrate capable of preventing lead thereon from fracturing
#30193Semiconductor device, method of authentifying and system
#30194Touch pad module with electrostatic discharge protection
#30195Anisotropic conductive sheet, manufacturing method thereof, and product using the same
#30196Semiconductor device and method for manufacturing the same
#30197Integrated BEOL thin film resistor
#30198COIL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE
#30199Trench gate field effect devices
#30200Photodiode array and production method thereof, and radiation detector
#30201Contact or via hole structure with enlarged bottom critical dimension
#30202Source/drain electrodes, transistor substrates and manufacture methods, thereof, and display devices
#30203Column suction-holding head and column mounting method
#30204Copper-containing pvd targets and methods for their manufacture
#30205Fin for a heat sink, heat sink and method for manufacturing a heat sink
#30206System and method for convective heat transfer utilizing a particulate solution in a time varying field
#30207Radial flow micro-channel heat sink with impingement cooling
#30208Heat exchanger unit and method of manufacturing the same
#30209Heat dissipating unit
#30210Copper base for electronic component, electronic component, and process for producing copper base for electronic component
#30211Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
#30212Oct-based imaging method
#30213Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
#30214Process of forming socket contacts
#30215Lanthanum hafnium oxide dielectrics
#30216Methods of forming metal-insulator-metal (MIM) capacitors with passivation layers on dielectric layers
#30217Method for using a Cu BEOL process to fabricate an integrated circuit (IC) originally having an al design
#30218Method for processing IC designs for different metal BEOL processes
#30219Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
#30220Method for forming metal pad in semiconductor device
#30221Semiconductor memory devices having contact pads with silicide caps thereon
#30222Semiconductor device and its manufacturing method
#30223Method and apparatus for integrating III-V semiconductor devices into silicon processes
#30224Method of forming align key in well structure formation process and method of forming element isolation structure using the align key
#30225Semiconductor device and method for fabricating the same
#30226Silicone metalization
#30227Molding compositions containing quaternary organophosphonium salts
#30228Carbon nanotube reinforced metal composites
#30229Mounting a heat sink in thermal contact with an electronic component
#30230Electronic system
#30231HEAT SINK WITH EMI SHIELDING WALLS
#30232Cooling system
#30233Heat dissipating device with enhanced boiling/condensation structure
#30234Heat sink assembly
#30235Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps
#30236Nozzle arrangement incorporating a lever based ink displacement mechanism
#30237Integrated circuit having electrically isolatable test circuitry
#30238Alignment error measuring mark and method for manufacturing semiconductor device using the same
#30239Overlay marker for use in fabricating a semiconductor device and related method of measuring overlay accuracy
#30240System and method for improved auto-boating
#30241Semiconductor device having aerial wiring and manufacturing method thereof
#30242Via in semiconductor device
#30243Damascene processing using dielectric barrier films
#30244Semiconductor device with improved contacts
#30245Circuit substrate
#30246Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
#30247Three-dimensional stack manufacture for integrated circuit devices and method of manufacture
#30248Chip module and chip card
#30249Insulating film-forming composition, insulating film and production method thereof
#30250Metal-Insulator-Metal (MIM) Capacitors Formed Beneath First Level Metallization and Methods of Forming Same
#30251Semiconductor device and method of manufacturing the same
#30252ESD protection structure using contact-via chains as ballast resistors
#30253Method of manufacturing semiconductor device having impurity region under isolation region
#30254Semiconductor device and method of manufacturing the same
#30255Multiple die LED and lens optical system
#30256Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip
#30257Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture
#30258Calibrated LED light module
#30259Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same
#30260Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
#30261Tab tape for tape carrier package
#30262Integrated liquid cooling system for electronic components
#30263Heat dissipation device
#30264Cooling systems incorporating heat exchangers and thermoelectric layers
#30265HEAT-DISSIPATION STRUCTURE AND METHOD THEREOF
#30266Heat dissipation system
#30267Integrated liquid cooling system for electronic components
#30268Cross-over of conductive interconnects and a method of crossing conductive interconnects
#30269HEAT DISSIPATION DEVICE HAVING POWER WIRES FIXTURE
#30270Fuse guard ring for semiconductor device
#30271Printable semiconductor structures and related methods of making and assembling
#30272Suspension for filling via holes in silicon and method for making the same
#30273Semiconductor device and method for manufacturing same
#30274Semiconductor device and method of manufacturing the same
#30275Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#30276Dual-damascene metal wiring patterns for integrated circuit devices
#30277Methods of forming through-wafer interconnects and structures resulting therefrom
#30278Dry etchback of interconnect contacts
#30279Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
#30280Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
#30281Method for high performance inductor fabrication using a triple damascene process with copper BEOL
#30282Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
#30283Semiconductor device and manufacturing method of the same
#30284Method for fabricating protective caps for protecting elements on a wafer surface
#30285Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
#30286Alignment and alignment marks
#30287Thermally conductive grease
#30288Thermally conductive grease
#30289Light-emitting diode module for flash and auto-focus application
#30290Thermal transfer device
#30291Impingement cooled heat sink with uniformly spaced curved channels
#30292Heat dissipation modules and assembling methods thereof
#30293Anisotropic thermal solution
#30294Heat sink mount
#30295Light emitting device having protection element and method of manufacturing the light emitting device
#30296ESD protection circuit
#30297Offset dependent resistor for measuring misalignment of stitched masks
#30298Signature circuit, semiconductor device having the same and method of reading signature information
#30299Device for defeating reverse engineering of integrated circuits by optical means
#30300Semiconductor device