Light-generating unit, display device having the same, and method of driving the same

Epoxy resin composition and semiconductor device

Interconnection structure

Integral charge storage basement and wideband embedded decoupling structure for integrated circuit

Integrated circuit with low-stress under-bump metallurgy

Integrated circuit chip and method for cooling an integrated circuit chip

Semiconductor device having termination circuit line

Semiconductor package and package stacking structure and method using the same

Plastic lead frame with snap-together circuitry

High permeability layered films to reduce noise in high speed interconnects

Electro-optical device and electronic apparatus

Semiconductor device

Method for making an edge intensive antifuse

Semiconductor ESD device and methods of protecting a semiconductor device

Multi-channel transistor structure and method of making thereof

Semiconductor image sensor and method for fabricating the same

PROGRAMMABLE SEMICONDUCTOR DEVICE CONTAINING A VERTICALLY NOTCHED FUSIBLE LINK REGION AND METHODS OF MAKING AND USING SAME

Edge-emitting LED light source

Interconnected high speed electron tunneling devices

Heat dissipation device

Thermal module

Sheet type fluid circulating apparatus and electronic device cooler structure using the same

Water-cooling heat dissipation device

Heat sink

Active cooling device

Apparatus for making electronic devices

Methods for optimizing die placement

Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material

Resin composition for thermal conductive material and thermal conductive material

Semiconductor device having a multilayer interconnection structure and fabrication process thereof

Post last wiring level inductor using patterned plate process

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices

Metal pad or metal bump over pad exposed by passivation layer

Doped single crystal silicon silicided eFuse

Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure

Integrated circuit and method for manufacturing

Heat-dissipating device and method for radiating heat via natural convection

ELECTRONIC DEVICE WITH SLIDING TYPE HEATSINK

Heat sink

Frame of a heat sink for a CPU in a computer

Retaining tool with rotational locating device

Microchannel heat sink

Blade-thru condenser having reeds and heat dissipation system thereof

Semiconductor device

Post and tip design for a probe contact

White light emitting diode using phosphor excitation

Wafer, reticle, and exposure method using the wafer and reticle

Bonding pad on IC substrate and method for making the same

Semiconductor device having multilayer wiring lines and manufacturing method thereof

Electromigration resistant metallurgy device and method

Enhanced via structure for organic module performance

System including self-assembled interconnections

Method and apparatus for electrical isolation of semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor stack block comprising semiconductor chips and methods for producing the same

Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production

Single unit heat sink, voltage regulator, and package solution for an integrated circuit

Chip on flex tape with dimension retention pattern

Fuse structure window

Contact fuse which does not touch a metal layer

Semiconductor structure with improved on resistance and breakdown voltage performance

Protruding spacers for self-aligned contacts

Structure and method of applying localized stresses to the channels of PFET and NFET transistors for improved performance

Field effect transistor and application device thereof

Stacked semiconductor device and related method

Optoelectronic chip

Acicular ITO for LED array

Semiconductor device and manufacturing method thereof

Conductor composition for use in LTCC photosensitive tape on substrate applications

Molding resin tablet feeding apparatus having weighing unit

Heat dissipating member

Apparatus for cooling electronic components

Integrated liquid cooling system for electronic components

Heat-dissipating device and method

Vapor chamber and manufacturing method thereof

Edge intensive antifuse and method for making the same

Semiconductor device and method for manufacturing the same

Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy

MMIC having back-side multi-layer signal routing

Circuit substrate and method of manufacturing the same

Method of forming solder bump with reduced surface defects

Method for forming high reliability bump structure

Method for manufacturing semiconductor device

Method for controlling dislocation positions in silicon germanium buffer layers

LDMOS transistor

Method of producing a chip-type solid electrolytic capacitor

Atomic layer deposition of CeO/AlOfilms as gate dielectrics

Image sensor with optical guard ring and fabrication method thereof

Systems and methods for alignment of laser beam(s) for semiconductor link processing

Method and monitor structure for detecting and locating IC wiring defects

Controlling system for gate formation of semiconductor devices

Cooling fan and shroud with modified profiles

Centrifugal fan

Encompassing Heat Sink

Heat-dissipating device

Cooling arrangement for a computer system

Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

Electrical device with integrally fused conductor

Transient voltage protection device, material, and manufacturing methods

Substrate sheet, manufacturing method of circuit substrate, and ink jet head

Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias

High frequency electronic component

Method for impedance matching between differential vias and transmission lines

Circuit arrangement having a transistor component and a freewheeling element

Concept for compensating piezo-influences on an integrated semiconductor circuit

Contact etching utilizing partially recessed hard mask

Interconnection having dual-level or multi-level capping layer and method of forming the same

Semiconductor device guard ring

Semiconductor device and method for fabricating the same

Means of integrating a microphone in a standard integrated circuit process

Electrode, method for producing same and semiconductor device using same

Integrated circuit chip module

Planar light source device and display device provided with the same

High-capacity memory card and method of making the same

Device containing isolation regions with threading dislocations

Dummy buried contacts and vias for improving contact via resistance in a semiconductor device

Antifuse structure and system for closing thereof

Protection layer for preventing laser damage on semiconductor devices

Power semiconductor device with current sense capability

Semiconductor structure and method

Initial-on SCR device for on-chip ESD protection

Semiconductor wafer and process for producing a semiconductor wafer

Electromagnetic interference shield apparatus

Electronic apparatus, and heat sink incorporated in the electronic apparatus

Thermal module and method for controlling heat-dissipation wind amount thereof

Normal-flow heat exchanger

Heatsink with adapted backplate

Self-cleaning protective coatings for use with photovoltaic cells

Method of making an interposer with contact structures

Method of forming metal plate pattern and circuit board

Method of reducing silicon damage around laser marking region of wafers in STI CMP process

Process for making a semiconductor device having a roughened surface

Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount

Methods and systems for characterizing semiconductor materials

Copper alloy for electronic machinery and tools and method of producing the same

Method and apparatus for cooling heat-generating structure

Radiator unit for an electronic component

Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same

Temperature compensation for internal inductor resistance

Semiconductor device having super junction structure and method for manufacturing the same

Semiconductor integrated circuit device

Contactor, contact structure provided with contactors, probe card, test apparatus, method of production of contact structure, and production apparatus of contact structure

Test structure design for reliability test

Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control

Flexible micro-electro-mechanical transducer

Voltage regulators and systems containing same

Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate

Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate

Semiconductor device and method of manufacturing thereof

Method and structure for reduction of soft error rates in integrated circuits

Wiring structure and method for manufacturing the same

Electronic component unit

Thermal tunneling gap diode with integrated spacers and vacuum seal

Semiconductor device and method for manufacturing a semiconductor device

Enhanced PGA Interconnection

Electronic module assembly with heat spreader

Monolithic integrated circuit with integrated interference suppression device

Semiconductor device and method for manufacturing the same

Semiconductor device and MIM capacitor

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device with multi-trench separation region and method for producing the same

Imaging device and method of manufacture

Semiconductor device having guard ring and manufacturing method thereof

Semiconductor device with a super-junction

Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same

Semiconductor device and method having capacitor and capacitor insulating film that includes preset metal element

Radiation-emitting optoelectronic semiconductor chip with a diffusion barrier

Silicon nitride passivation layers having oxidized interface

Micro-package, multi-stack micro-package, and manufacturing method therefor

Heat Transfer Device

Heat dissipation device with heat pipe

Heat exchange module

Liquid cooling jacket and liquid cooling device

Heat radiating fin

Fixing device for a radiator

CPU heat sink mount attachment structure

Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area

Semiconductor processing methods

Metal-substituted transistor gates

Metal-substituted transistor gates

Method of manufacturing a semiconductor using a rigid substrate

Deposition stop time detection apparatus and methods for fabricating copper using the same

Method for producing an electronic component passivated by lead free glass

Anisotropic heat spreading apparatus and method for semiconductor devices

Load port module

Heat spreader, semiconductor package module and memory module having the heat spreader

Extendable heat dissipation apparatus

Heat-dissipating device

Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing

Two-dimensional position sensor

RFID device and method of making

LSI inspection method and defect inspection data analysis apparatus

Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded

Reworkable bond pad structure

Method of manufacturing interconnecting structure with vias

Semiconductor device

Metal line of semiconductor device and method for forming thereof

Interconnects with improved reliability

Substrate processing apparatus, substrate holder, and manufacturing method of semiconductor device

Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption

Self aligned metal gates on high-k dielectrics

Integrated circuit power supply network

Method to fabricate horizontal air columns underneath metal inductor

Fuse breakdown method adapted to semiconductor device

Fuse box of semiconductor device

Semiconductor device

Semiconductor structure with via structure

System and method for ESD protection

Semiconductor device with effective heat-radiation

Semiconductor component with a channel stop zone

Semiconductor substrate and production process thereof

Metal-substituted transistor gates

Semiconductor device and test method of semiconductor device

Circuits and methods for failure prediction of parallel MOSFETs

Methods for manufacturing RFID tags and structures formed therefrom

Tin electrodeposits having properties or characteristics that minimize tin whisker growth

Heat sink structure

LOOP-TYPE HEAT EXCHANGE DEVICE

FLAT TYPE HEAT PIPE

Loop-type heat exchange module

Nanostructured materials and photovoltaic devices including nanostructured materials

Socket features for aligning and orienting components

Laser thermal processing chuck with a thermal compensating heater module

Formation of assemblies with a diamond heat spreader

HDP-based ILD capping layer

Method of fabricating a sleeve insulator for a contact structure

Shielded capacitor structure

Methods for creating electrophoretically insulated vias in semiconductive substrates

Metal interconnection of a semiconductor device and method of fabricating the same

Method for fabricating semiconductor device

Tunable semiconductor diodes

Nonvolatile semiconductor memory device

Semiconductor device and manufacturing method thereof

CMOS device with dual polycide gates and method of manufacturing the same

Method for containing a device and a corresponding device

Electronic assembly with backplate having at least one thermal insert

Stacked memory and manufacturing method thereof

Laser separation of encapsulated submount

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Method for manufacturing a thermal interface material

Hermetic seals for micro-electromechanical system devices

Test structures for evaluating a fabrication of a die or a wafer

Method of measuring alignment of measurement pattern

Method for regulating temperature and circuit therefor

MOSFET temperature sensing

Tunable alignment geometry

Method of manufacturing semiconductor device

Image input apparatus for forming a composite image based on a photoelectric conversion signal and a saturation signal

Heat-radiating sheet and heat-radiating structure

Method for fabricating a protection circuit located under fuse window

Power interconnect structure for balanced bitline capacitance in a memory array

Semiconductor package board having dummy area with copper pattern

Enhanced flow channel for component cooling in computer systems

Cooling device and electronic apparatus

Chamber sealing valve

Cooling device and electronic apparatus

Cooling device and electronic apparatus

Cooling apparatus and method

Method of and apparatus for in-situ monitoring of crystallization state

Liquid crystal display device

Camera and method having optics and photo detectors which are adjustable with respect to each other

Protective circuit for a thin film transistor and a liquid crystal display device

INFORMATION PROCESSING APPARATUS AND DECODING CONTROL METHOD

Carrier for test, burn-in, and first level packaging

Movement sensor and method for producing a movement sensor

Substrate for device bonding, device bonded substrate, and method for producing same

Semiconductor chip and method of manufacturing the same

Semiconductor device

Semiconductor device having multiple-layered interconnect

Semiconductor device

Interconnect structure for integrated circuits

Circuit substrate

Semiconductor device and fabrication method thereof

Hermetic cavity package

Lead frame and method of manufacturing the lead frame

Communication board

High-hardness and corrosion-tolerant integrated circuit packing mold

Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion

Thin film capacitors and methods of making the same

Seal ring for mixed circuitry semiconductor devices

Semiconductor device and manufacturing method thereof

Systems and methods for reducing IR-drop noise

Semiconductor device

Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program

Semiconductor device and method of manufacturing the same

Method of fabricating substrate for package of semiconductor light-emitting device

Semiconductor light emitting device

Integrated light-emitting diode system

Conductive paste for multilayer electronic components and multilayer electronic component using same

Seal ring for mixed circuitry semiconductor devices

Printed circuit board

Method for forming multilayer substrate

Cooling device for heat-generating elements

Once-through forced air-cooled heat sink for a projection display apparatus

Systems for low cost coaxial liquid cooling

Systems for integrated cold plate and heat spreader

HEAT DISSIPATION DEVICE WITH HEAT PIPE

Heat exchange module for electronic components

Microchannel cooling device for small heat sources