Heat sink

Seal of fluid port

Systems for integrated pump and reservoir

Localized microelectronic cooling

Electrical apparatus with a foamed stiffener and manufacturing method thereof

Method and apparatus for cooling with a phase change material and heat pipes

Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices

Method of encapsulating an assembly with a low temperature silicone rubber compound

Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method

Semiconductor device

Method for making integrated circuit chip having carbon nanotube composite interconnection vias

Techniques to create low K ILD forming voids between metal lines

Current-aligned auto-generated non-equiaxial hole shape for wiring

Back end interconnect with a shaped interface

Ultrathin semiconductor circuit having contact bumps

Silver barrier layers to minimize whisker growth in tin electrodeposits

Dynamic random access memory device and electronic systems

Flip chip die assembly using thin flexible substrates

Tunable antifuse element and method of manufacture

Antifuse element and method of manufacture

Technique for manufacturing an overmolded electronic assembly

Manufacturing method for packaged semiconductor device

Method and apparatus to boost high-speed I/O signal performance using semi-interleaved transmitter/receiver pairs at silicon die bump and package layout interfaces

Methods of flip-chip image sensor package fabrication

Method of manufacturing organic EL displays incorporating adhesion escape grooves surrounding an adhesion region of each display

FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME

Method for fabricating a metal-insulator-metal capacitor

Mechanical integrity evaluation of low-k devices with bump shear

Nano-Reflectors for Thin, Flat Display Devices

Fiber mixed R-G-B white emitting LED package

Embedding thin film resistors in substrates in power delivery networks

Optical transponder with active heat transfer

Heat dissipation device

Heat dissipating module and heat sink assembly using the same

Thermal structure for electric devices

Apparatus for cooling electronic components

Lock for notebook computer or other personal electronic device

Lock for portable music player or other personal electronic device

Security clamp lock for notebook computer or other personal electronic device

Plasma display module

Providing accurate detection of chip overheat and local overheat conditions in integrated circuits

Semiconductor integrated circuit device with independent power domains

Post passivation structure for a semiconductor device and packaging process for same

RFID tire label

Integration of thin film resistors having different TCRs into single die

Integrated microelectronics component for filtering electromagnetic noise and radio frequency transmission circuit comprising same

Multi-substrate RF module for wireless communication devices

Image display device

SMT passive device noflow underfill methodology and structure

Flip chip die assembly using thin flexible substrates

Substrate structure and manufacturing method of the same

Composite metal layer formed using metal nanocrystalline particles in an electroplating bath

Selective copper alloy interconnections in semiconductor devices and methods of forming the same

Interconnection device including one or more embedded vias and method of producing the same

Multi-level interconnections for an integrated circuit chip

Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow

Apparatus and method for high density multi-chip structures

Integrated circuit with heat conducting structures for localized thermal control

Bridge modules for smart labels

Through-wafer vias and surface metallization for coupling thereto

Memory cell, semiconductor memory device, and method of manufacturing the same

TRANSISTOR COMPONENT

Field effect transistor and method for producing a field effect transistor

Structure and method for forming laterally extending dielectric layer in a trench-gate FET

Low resistance peripheral local interconnect contacts with selective wet strip of titanium

Semiconductor device

Semiconductor devices having fuses and methods of forming the same

Semiconductor device and fuse blowout method

Semiconductor device

Semiconductor device and method for fabricating the same

Display device and manufacturing method thereof

Method of forming a high impedance antifuse

Semiconductor device evaluation method

Systems and methods for thermal sensing

Visible light and IR combined image camera with a laser pointer

Compact heat exchanging device based on microfabricated heat transfer surfaces

Drive circuit board and flat panel display apparatus having the same

Stacked microvias and method of manufacturing same

Heat dissipation device

Heat dissipating device with heat reservoir

Heat dissipation device having low melting point alloy coating and a method thereof

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Method of preparing an antenna

Electrical connection structure having elongated carbon structures with fine catalyst particle layer

Interlayer insulating film formation method and film structure of interlayer insulating film

Cap for semiconductor device package, and manufacturing method thereof

Method of manufacturing semiconductor device and semiconductor device

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Method of fabricating conductive lines

Methods for making microwave circuits

Semiconductor device and manufacturing method thereof

Integrated circuitry and method for manufacturing the same

Method for the formation of an integrated electronic circuit having a closed cavity

Substrates and method of manufacturing same

Color-mixing lighting system

Cooled electronic assembly and method for cooling a printed circuit board

Heat dissipation structure for interface card

Heat sink and its fabrication method

Modular heat sink assembly

Heat sink and its fabrication method

Heat-dissipating device and a housing thereof

Heat dissipating structure of integrated circuit chip of plasma display module and plasma display module including the same

Information processing apparatus with a chassis for thermal efficiency and method for making the same

Composite distributed dielectric structure

Thermal processing equipment calibration method

Rotating rectifier module

Method for preventing the overflowing of molding compound during fabricating package device

Power-up and power-down circuit for system-on-a-chip integrated circuit

Chip size package

Offset via on pad

Flashless molding of integrated circuit devices

High voltage semiconductor devices with JFET regions containing dielectrically isolated junctions

CMOS image sensor and method for fabrication thereof

Fabrication method of semiconductor device

Display substrate and apparatus and method for testing display panel having the same

Memory utilizing oxide nanolaminates

Light emitting device package

Packaging technique for the fabrication of polarized light emitting diodes

Electronic component comprising electrodes and ring residue

Light emitting diodes with reflective electrode and side electrode

Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and method of manufacturing thin-film semiconductor device

Arrangement for testing semiconductor chips while incorporated on a semiconductor wafer

Laser processing

Method of direct plating of copper on a ruthenium alloy

Selective plating apparatus and selective plating method

Method and apparatus for providing hermetic electrical feedthrough

Integrated liquid cooled heat sink for electronic components

Loop-type heat exchange device

Heat transfer surface for electronic cooling

Method for encapsulating electronic devices and a sealing assembly for the electronic devices

Capillary tube bubble containment in liquid cooling systems

Test structure for automatic dynamic negative-bias temperature instability testing

Electronic switching circuit, switching circuit test arrangement and method for determining the operativeness of an electronic switching circuit

Carbon nanotube interconnect contacts

Method of manufacturing a semiconductor device including a silicide layer having an NiSi phase provided on source and drain regions

Semiconductor substrate and method of fabricating semiconductor device

Methods of manufacturing semiconductor devices and structures thereof

Method of forming a penetration electrode and substrate having a penetration electrode

Semiconductor device and method of manufacturing the same

Method of aligning deposited nanotubes onto an etched feature using a spacer

Charge balance field effect transistor

Method for molding a small form factor digital memory card

Compliant passivated edge seal for low-k interconnect structures

Methods for fabricating phase changeable memory devices

Method and system for using pattern matching to process an integrated circuit design

Method and apparatus for completely covering a wafer with a passivating material

Verifying a process margin of a mask pattern using intermediate stage models

LED junction temperature tester

Light emitting device

Cooling structure using rigid movable elements

Compliant thermal interface structure utilizing spring elements

Electronic device package heat sink assembly

Heat dissipating device with back plate for electronic assembly

Compliant thermal interface structure utilizing spring elements with fins

CPU heat sink mount attachment structure

Cooling apparatus of liquid-cooling type

Computer having a heat discharging unit

Application of 2-dimensional photonic crystals in alignment devices

Power amplifier having high heat dissipation

Mask-programmable logic macro and method for programming a logic macro

Method of interconnect for multi-slot metal-mask programmable relocatable function placed in an I/O region

Apparatus and method of measuring defects in an ion implanted wafer by heating the wafer to a treatment temperature and time to substantially stabilize interstitial defect migration while leaving the vacancy defects substantially unaltered.

Flat panel display having non-evaporable getter material

Fabrication of high thermal conductivity arrays of carbon nanotubes and their composites

Techniques for forming passive devices during semiconductor back-end processing

Substrate for pre-soldering material and fabrication method thereof

Etch stop in a damascene interconnect structure

INTEGRATED CIRCUIT HAVING A PROGRAMMABLE CONDUCTIVE PATH ON EACH CONDUCTIVE LAYER AND RELATED METHOD OF MODIFYING A VERSION NUMBER ASSIGNED TO THE INTEGRATED CIRCUIT

Semiconductor device, method and manufacturing same, identification label and information carrier

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same

Semiconductor wafer with non-rectangular shaped dice

SEMICONDUCTOR MEMORY DEVICE

Semiconductor device having first and second insulation separation regions

Semiconductor integrated circuit device

Sealing structure for mounting a semiconductor device to a substrate

Semiconductor device and manufacturing method of the same

Secure electrically programmable fuse

In-chip structures and methods for removing heat from integrated circuits

Reprogrammable fuse structure and method

Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same

Power lamp package

Arranging and/or supporting an image pickup device in an image pickup apparatus

Semiconductor device, method of manufacturing the same, and information managing system for the same

Heat radiation member usable with a card type electronic component and display apparatus having the same

Heat sink apparatus with operating fluid in base thereof

Heat dissipation device

Microchannel cooling device with magnetocaloric pumping

Heat dissipation device

Compliant thermal interface structure with vapor chamber

Heat spreader for cooling electronic components

Mold core having a temperature control apparatus

Compositions for the currentless deposition of ternary materials for use in the semiconductor industry

System and method for product yield prediction

Nanotube articles with adjustable electrical conductivity and methods of making the same

Adhesion of tungsten nitride films to a silicon surface

Semiconductor device and method for manufacturing same

Method of manufacturing semiconductor device

Interconnects with harmonized stress and methods for fabricating the same

Method for manufacturing semiconductor device

Semiconductor wafer marking apparatus having marking interlock system and semiconductor wafer marking method using the same

Low OHMIC layout technique for MOS transistors

Semiconductor integrated circuit including a DRAM and an analog circuit

Method for producing a contact and electronic component comprising said type of contact

Fabricating nanoscale and atomic scale devices

COPPER STRIKE PLATING METHOD

Silicon wafer having through-wafer vias

Methods for manufacturing microelectronic imagers

Semiconductor device, function setting method thereof, and evaluation method thereof

Barrier films for plastic substrates fabricated by atomic layer deposition

Semiconductor device

B-stageable film, electronic device, and associated process

Peelable tape carrier

TRANSPARENT CONDUCTIVE FILM AND METHOD FORMING THEREOF, ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS

LED luminaire and arrangement comprising a luminaire body and an LED operating device

Method and apparatus for heat sink and card retention

Heat dissipation device

Heat sink clip with cammed handle

Electronic package with direct cooling of active electronic components

Heat radiating structure for CPU

DRAM cells and electronic systems

Low loss thin film capacitor and methods of manufacturing the same

Display device, method of manufacturing the same and mask for manufacturing the same

Volumetric three-dimensional display panel and system using multi-layered organic light emitting devices

Fully differential, high Q, on-chip, impedance matching section

Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit

High current switching circuit for a motor drive three phase inverter for mobile equipment

Adhesion of tungsten nitride films to a silicon surface

Semiconductor device and manufacturing method therefor

System and method based on field-effect transistors for addressing nanometer-scale devices

Structure for determining thermal cycle reliability

Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry

Electronic packaging including die with through silicon via

Heat sink and display panel including heat sink

Semiconductor structures having electrophoretically insulated vias

Stacking apparatus and method for stacking integrated circuit elements

Interconnects having sealing structures to enable selective metal capping layers

Vertical metal-insulator-metal (MIM) capacitors

High density capacitor structure

Semiconductor device

3-D inductor and transformer devices in MRAM embedded integrated circuits

Semiconductor device and method for patterning

Semiconductor device and method of manufacture

Semiconductor device and method of manufacturing same

Semiconductor light emitting device

Semiconductor device using partial SOI substrate and manufacturing method thereof

Light emitting nanowires for macroelectronics

IC packaging technique

Thermal electromagnetic radiation detector with alveolate structure

Heat dissipation device with heat pipes

Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring

Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins

Loop-type heat exchange device

Cooling device for an electric component

Mixed-signal functions using R-cells

Reliable generation of a device-specific value

Data protection and cryptographic functions using a device-specific value

Fluorine-containing material

Semiconductor device and method of fabricating the same

Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same

Method of forming metal pattern using selective electroplating process

Silicon carbide semiconductor device fabrication method

Semiconductor device and method for fabricating the same

Methods of making semiconductor fuses

III group nitride semiconductor substrate, substrate for group III nitride semiconductor device, and fabrication methods thereof

Methods of forming semiconductor devices and electrical interconnect structures in semiconductor devices and intermediate structures formed thereby

Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device

Triple alignment substrate method and structure for packaging devices

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Capacitive array

Method of making chip type solid electrolytic capacitor having a small size and a simple structure

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method to fabricate passive components using conductive polymer

High performance integrated inductor

Creamic substrate and production method thereof

Substrate for optical semiconductor

Semiconductor memory device

Display module

Semiconductor module and semiconductor module heat radiation plate

Heat sink for memory

Grease protecting apparatus for heat sink

Method and stacked memory structure for implementing enhanced cooling of memory devices

Grease cover for heat dissipating apparatus

Pixel electrode, method for forming the same, electrooptical device, and electronic apparatus

System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps

Circuit for blowing an electrically blowable fuse in SOI technologies

First die indicator for integrated circuit wafer

Systems and methods for controlling of electro-migration

Radio frequency identification label and method of labeling

CHIP WITH EMBEDDED ELECTROMAGNETIC COMPATIBILITY CAPACITORS AND RELATED METHOD

High-frequency semiconductor device and method of manufacturing the same

Method of forming closed air gap interconnects and structures formed thereby

Integrated circuit arrangement with layer stack

Method of manufacturing a semiconductor device including separation by physical force

Semiconductor device and manufacturing method thereof

Technique for forming copper-containing lines embedded in a low-k dielectric by providing a stiffening layer

Semiconductor device manufacturing method including forming a metal silicide layer on an indium-containing layer

Carrier tape

Use of solder paste for heat dissipation

Heat sink arrangement for electrical apparatus