212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Cooling device incorporating boiling chamber
#31202Heat-dissipating structure with air-guiding device
#31203Method of detecting an edge bead removal line on a wafer
#31204Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#31205Thin film resistor and dummy fill structure and method to improve stability and reduce self-heating
#31206Zoned thermal monitoring
#31207Active interconnects and control points in integrated circuits
#31208PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#31209Semiconductor device and temperature detection method using the same
#31210Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
#31211Substrate for producing a soldering connection to a second substrate
#31212Cobalt tungsten phosphate used to fill voids arising in a copper metallization process
#31213Semiconductor device and related method of manufacture
#31214Electronic device, method of manufacture of the same, and sputtering target
#31215Semiconductor device having a leading wiring layer
#31216Integrated circuit interconnect
#31217Method of manufacturing a field effect transistor comprising an insulating film including metal oxide having crystallinity and different in a lattice distance from semiconductor substrate
#31218Method for forming an electric device comprising power switches around a logic circuit and related apparatus
#31219Method and system for a semiconductor package with an air vent
#31220Leadframe designs for plastic overmold packages
#31221Semiconductor device
#31222Fuse structure of semiconductor device and method for fabricating same
#31223Isolation of a high-voltage diode between a high-voltage region and a low-voltage region of an integrated circuit
#31224Method for providing a programmable electrostatic discharge (ESD) protection device
#31225IGBT with injection regions between MOSFET cells
#31226Semiconductor device using solid phase epitaxy and method for fabricating the same
#31227Method for automated testing of the modulation transfer function in image sensors
#31228LED lamps
#31229Light emitting diode and backlight module having light emitting diode
#31230High-efficiency light extraction structures and methods for solid-state lighting
#31231Peltier cooler with integrated electronic device(s)
#31232Semiconductor devices having thin film transistors and methods of fabricating the same
#31233Fan module and fan duct thereof
#31234Counter-stream-mode oscillating-flow heat transport apparatus
#31235Water-cooling heat exchanger and heat-dissipating device for the same
#31236Jet generating device and electronic apparatus
#31237Aerodynamically enhanced cooling fan
#31238Air mover with thermally coupled guide vanes
#31239MEMS heat pumps for integrated circuit heat dissipation
#31240MEMS heat pumps for integrated circuit heat dissipation
#31241Memory module that is capable of controlling input/output in accordance with type of memory chip
#31242Implantable device using ultra-nanocrystalline diamond
#31243Imaging device and mobile terminal using this imaging device
#31244Modular sockets using flexible interconnects
#31245Interconnect structure and method of fabrication of same
#31246Method for manufacturing a semiconductor device, as well as a semiconductor substrate
#31247Method for fabricating an integrated circuit comprising a three-dimensional capacitor
#31248SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#31249MIM capacitor and method of fabricating same
#31250Alignment mark and alignment method for the fabrication of trench-capacitor dram devices
#31251Methods of implementing and enhanced silicon-on-insulator (SOI) box structures
#31252WAT process to avoid wiring defects
#31253Norbornene-type polymers, compositions thereof and lithographic process using such compositions
#31254Photosensitive epoxy resin adhesive composition and use thereof
#31255Integrated electronic component
#31256Thermal interface material and method for making the same
#31257Mounting device for heat dissipating apparatus
#31258Heat dissipating device for electronic component
#31259Heat sink and the method for making the same
#31260Fastening device for heat sink
#31261Protective cover for heat-conductive material of heat sink
#31262Integrated heat sink device
#31263Heat sink for multiple components
#31264Supply voltage independent sensing circuit for electrical fuses
#31265Light emitting device
#31266Integrated circuit arrangement
#31267Display device and electronic device using the same
#31268Double-sided electroluminescene display
#31269Managing method of building material and wireless chip applied to the method
#31270Method for manufacturing a thermal interface material
#31271Semiconductor device and method of manufacturing the same
#31272Memory card with connecting portions for connection to an adapter
#31273Systems and methods for reducing simultaneous switching noise in an integrated circuit
#31274Nanotube surface coatings for improved wettability
#31275Heat dissipation for heat generating element of semiconductor device and related method
#31276High density direct connect LOC assembly
#31277Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element
#31278Semiconductor device and chip-stack semiconductor device
#31279Inductor for semiconductor integrated circuit and method of fabricating the same
#31280Gate dielectric antifuse circuit to protect a high-voltage transistor
#31281Micro fuse
#31282MIM capacitor structure and method of fabrication
#31283Process for high voltage superjunction termination
#31284SOI SRAM products with reduced floating body effect
#31285White-light emitting semiconductor device
#31286Display device
#31287Surge voltage protection diode with controlled p-n junction density gradients
#31288Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
#31289Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
#31290Microfabricated beam modulation device
#31291Light emitting diode element
#31292Methods of forming semiconductor constructions
#31293Methods of producing a composite substrate
#31294Battery cooler
#31295Integrated thermal exchange systems and methods of fabricating same
#31296Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks
#31297Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
#31298Graphite base for heat sink, method of making graphite base and heat sink
#31299Implantable substrate sensor with back-to-back electrodes
#31300Method and system for magnetic shielding in semiconductor integrated circuit
#31301Curable resin composition for sealing LED element
#31302Conductive materials for low resistance interconnects and methods of forming the same
#31303Socket for semiconductor device
#31304Socket for semiconductor device
#31305Socket for semiconductor device
#31306Unidirectionally conductive materials for interconnection
#31307Thin film resistor head structure and method for reducing head resistivity variance
#31308Fabrication method of image scan module
#31309Leadframe semiconductor package stand and method for making the same
#31310Multifunctional metallic bonding
#31311Method of overlay measurement for alignment of patterns in semiconductor manufacturing
#31312Method of writing identifying information on wafer
#31313Thick film paste via fill composition for use in LTCC applications
#31314Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
#31315Thermal interface material having spheroidal particulate filler
#31316Semiconductor laser device and heat sink used therein
#31317Inductor
#31318Controlling biological fluids in microelectromechanical machines
#31319Microfluidic cooling of integrated circuits
#31320Heat sink conduction apparatus
#31321Heat sink assembly
#31322Apparatus for cooling computer parts and method of manufacturing the same
#31323Heat-dissipating module of electronic device
#31324Ink jet printhead with active and passive nozzle chamber structures arrayed on a substrate
#31325Magnetically differential inductors and associated methods
#31326Multiple circuit blocks with interblock control and power conservation
#31327Multiple circuit blocks with interblock control and power conservation
#31328Semiconductor device and manufacturing method thereof
#31329Integrated circuit device and method of producing the same
#31330Molybdenum-based electrode with carbon nanotube growth
#31331Semiconductor device and fabricating method thereof
#31332Integrated circuit coolant microchannel assembly with targeted channel configuration
#31333Via connection structure with a compensative area on the reference plane
#31334Semiconductor device and manufacturing method thereof
#31335Miniature inductor suitable for integrated circuits
#31336Integrated circuit transformer devices for on-chip millimeter-wave applications
#31337Antifuse element and electrically redundant antifuse array for controlled rupture location
#31338SEMICONDUCTOR DEVICE HAVING PATTERNS FOR PROTECTING FUSES AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#31339Fuse structure having a tortuous metal fuse line
#31340Semiconductor device having field stabilization film and method
#31341Solid-state image pickup device and the manufacture method thereof
#31342Power semiconductor device and method therefor
#31343Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same
#31344Smart card and method for manufacturing a smart card
#31345Method for mounting an electronic component on a substrate
#31346Enhancement of performance of a conductive wire in a multilayered substrate
#31347High frequency heating apparatus
#31348Methods for forming backside alignment markers useable in semiconductor lithography
#31349Routing vias in a substrate from bypass capacitor pads
#31350METHOD OF MAKING A HEAT DISSIPATING MICRODEVICE
#31351Sandwiched thermal article
#31352Cooling fin assembly
#31353Trans-thermoelectric device
#31354Manufacturing method of heat pipe
#31355Device and method for manufacturing the same
#31356Method of adding fabrication monitors to integrated circuit chips
#31357Semiconductor device and method for testing semiconductor device
#31358Network chip design for grid communication
#31359Radiation curable cycloaliphatic barrier sealants
#31360Techniques for partitioning radios in wireless communication systems
#31361Techniques for partitioning radios in wireless communication systems
#31362Ball assignment system
#31363Method of forming a semiconductor device having asymmetric dielectric regions and structure thereof
#31364Semiconductor device and pattern generating method
#31365Formation of deep via airgaps for three dimensional wafer to wafer interconnect
#31366Integrated circuit and methods of redistributing bondpad locations
#31367Method of manufacturing semiconductor device and semiconductor device
#31368Manufacturing structure
#31369MIM capacitor structure and fabricating method thereof
#31370Method for manufacturing a semiconductor device
#31371Method of manufacturing semiconductor device
#31372Method of fabricating a semiconductor device having CMOS transistors and a bipolar transistor
#31373Method of fabricating isolated semiconductor devices in epi-less substrate
#31374Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses
#31375Method of making substrate for integrated circuit
#31376Method of dicing a semiconductor substrate into a plurality of semiconductor chips by forming two cutting grooves on one substrate surface and forming one cutting groove on an opposite substrate surface that overlaps the two cutting grooves
#31377Body bias compensation for aged transistors
#31378Semiconductor manufacture method
#31379Semiconductor device and fabricating method of the same
#31380Process for producing a multifunctional dielectric layer on a substrate
#31381Recording and reproducing device
#31382Optical module and optical system
#31383Radiation-emitting semiconductor component
#31384Integrated circuit that uses a dynamic characteristic of the circuit
#31385Packaging substrate having adhesive-overflowing prevention structure
#31386Interposable heat sink for adjacent memory modules
#31387Thermal conductor and use thereof
#31388Cooling device for heat-generating electronic component
#31389Heat dissipating structure of interface card
#31390Information processing blade and information processing apparatus using the same
#31391Capacitor with nanotubes and method for fabricating the same
#31392Circuit for detecting and measuring noise in semiconductor integrated circuit
#31393Integrated smart power switch
#31394Apparatus for attaching an electronic component to a rubber article
#31395Spiral transformers and associated methods of operation
#31396Alignment mark for semiconductor device, and semiconductor device
#31397Method, storage media storing program, and component for avoiding increase in delay time in semiconductor circuit having plural wiring layers
#31398Semiconductor device with a multilevel interconnection connected to a guard ring and alignment mark
#31399Crack stop and moisture barrier
#31400Low-temperature chemical vapor deposition of low-resistivity ruthenium layers
#31401Method for producing flexible printed wiring board, and flexible printed wiring board
#31402Analytic structure for failure analysis of semiconductor device
#31403LGA socket with EMI protection
#31404Electronic substrate
#31405Semiconductor device with power module and an insulating member provided between a conductive casing and a non-insulating portion
#31406Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area
#31407High precision connector member and manufacturing method thereof
#31408Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#31409Structure of memory card packaging and method of forming the same
#31410Substrate for IC package
#31411Semiconductor substrate, substrate for semiconductor crystal growth, semiconductor device, optical semiconductor device, and manufacturing method thereof
#31412Heatsink moldlocks
#31413E-Fuse and anti-E-Fuse device structures and methods
#31414Coating of copper and silver air bridge structures to improve electromigration resistance and other applications
#31415Semiconductor transistor (DMOS) device for use as a power amplifier
#31416Semiconductor device and method of manufacturing the same
#31417Semiconductor device
#31418P-channel MOS transistor, semiconductor integrated circuit device and fabrication process thereof
#31419Semiconductor device
#31420METHOD OF FORMING A CONTACT STRUCTURE INCLUDING A VERTICAL BARRIER STRUCTURE AND TWO BARRIER LAYERS
#31421Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same
#31422Semiconductor device having a dummy gate
#31423Micromirror array device with compliant adhesive
#31424Light emitting device having light emission and microstructure layers between electrode layers
#31425Techniques for facilitating identification updates in an integrated circuit
#31426Test key having a chain circuit and a kelvin structure
#31427System and method for identification of a reference integrated circuit for a pick-and-place equipment
#31428Thin film transistors for imaging system and method of making the same
#31429Spread illuminating apparatus of side light type having electrode patterns
#31430Lens assembly having focal length adjustable by a spacer for obtaining an image of an object
#31431Wavelength stabilization for broadband light sources
#31432Thermal interface material and method for making the same
#31433Method for increasing wiring channels/density under dense via fields
#31434Lamination-type cooler
#31435Heat dissipating apparatus
#31436Cooling jacket
#31437Heat dissipating assembly with composite heat dissipating structure
#31438Refrigeration system
#31439Method for reducing dielectric overetch when making contact to conductive features
#31440Methods and systems for processing a device, methods and systems for modeling same and the device
#31441Semiconductor integrated circuit device and a method of manufacturing the same
#31442Integrated circuit fabrication
#31443Integrated circuit fabrication
#31444Method for manufacturing a through conductor
#31445Method for fabricating semiconductor device and semiconductor device
#31446Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
#31447Direct cooling of LEDs
#31448Semiconductor encapsulating epoxy resin composition and semiconductor device
#31449Semiconductor encapsulating epoxy resin composition and semiconductor device
#31450Heat sink, laser module, laser device, and laser-processing device
#31451Light emitting assembly, backlight unit and display having the same
#31452Attaching heat sinks to printed circuit boards using preloaded spring assemblies
#31453Dissipating apparatus for integrated circuit chip and display module including the same
#31454Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
#31455Fixed pillar with heat loss
#31456Heat radiating device and electronic equipment mounted on vehicle
#31457Heat-dissipating module and electronic apparatus having the same
#31458Method and apparatus for thermal dissipation in an information handling system
#31459Apparatus, system, and method for removing excess heat from a component
#31460Heatsink for high-power microprocessors
#31461Electric power conversion device
#31462Linear actuator comprising velocity sensor
#31463Aluminum cap with electroless nickel/immersion gold
#31464Integrated circuit and methods of redistributing bondpad locations
#31465Semiconductor device having oxidized metal film and manufacture method of the same
#31466Memory device with improved data retention
#31467Organic-framework zeolite interlayer dielectrics
#31468Connection device with actuating element for changing a conductive state of a via
#31469Circuit board and manufacturing method thereof
#31470Gallium nitride material-based monolithic microwave integrated circuits
#31471Integrated circuit package
#31472Leadframe for semiconductor device
#31473Semiconductor device with a multilevel interconnection connected to a guard ring
#31474Device and method for manufacturing the same
#31475Integrated circuit with capacitor and method for the production thereof
#31476Anti-fuse circuit for improving reliability and anti-fusing method using the same
#31477Semiconductor device having fuse pattern and methods of fabricating the same
#31478Semiconductor device and method of manufacturing the same
#31479Multi-gate enhancement mode RF switch and bias arrangement
#31480Semiconductor device and manufacturing method thereof
#31481System and method for noise reduction in multi-layer ceramic packages
#31482Process for forming a planar diode using one mask
#31483Semiconductor apparatus with semiconductor devices and cooling heat sinks
#31484Cooling method and apparatus
#31485Light emitting diodes and methods of fabrication
#31486Semiconductor light-emitting element and light-emitting device
#31487Versatile system for charge dissipation in the formation of semiconductor device structures
#31488Light emitting device
#31489Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing ploybenzoxazoles, and processes for producing an electronic component
#31490Memory device and manufacturing method the same
#31491Cavity structure for semiconductor structures
#31492Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
#31493Method for manufacturing heat dissipation apparatus
#31494Heat dissipating device
#31495Integral liquid cooling unit for a computer
#31496Cooling apparatus and electronic equipment
#31497Heat sink
#31498RFID label technique
#31499Fiber adhesive material
#31500Systems for improved passive liquid cooling