212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Memory-module board layout for use with memory chips of different data widths
#30902Flashless lead frame with horizontal singulation
#30903Semiconductor wafer, and semiconductor device formed therefrom
#30904Scribe seal structure for improved noise isolation
#30905Method and structure to prevent circuit network charging during fabrication of integrated circuits
#30906INTEGRATED CIRCUIT (IC) WITH ON-CHIP PROGRAMMABLE FUSES
#30907Integrated circuit with improved signal noise isolation and method for improving signal noise isolation
#30908Thyristor with integrated resistance and method for producing it
#30909Electrostatic discharge protection networks for triple well semiconductor devices
#30910SEMICONDUCTOR DEVICE
#30911Nonvolatile semiconductor memory
#30912Crosstalk reduction in electrical interconnects using differential signaling
#30913Light emitting diode package
#30914Light-emitting diode arrangement
#30915Method and system for determining a positioning error of an electron beam of a scanning electron microscope
#30916Method and system for on-line controlling of solder bump deposition
#30917Through-hole arrangement for a ball grid array package
#30918Heat dissipating apparatus
#30919Cooling device of hybrid-type
#30920LIQUID COOLING SYSTEM SUITABLE FOR REMOVING HEAT FROM ELECTRONIC COMPONENTS
#30921High performance integrated MLC cooling device for high power density ICS and method for manufacturing
#30922Method and apparatus for dissipating heat
#30923Semiconductor devices having gallium nitride epilayers on diamond substrates
#30924Supercritical fluid-assisted direct write for printing integrated circuits
#30925Temperature-adjusting unit, substrate processing apparatus with the unit, and method of regulating temperature in the apparatus
#30926Inter-metal dielectric fill
#30927Thermal sensing for integrated circuits
#30928Connector including an integrated circuit powered by a connection to a conductor terminating in the connector
#30929Superconductive wire material, superconductive multi-conductor wire using the same method for producing the same
#30930Planar heat dissipating device
#30931Sacrificial styrene benzocyclobutene copolymers for making air gap semiconductor devices
#30932Method of forming an interconnect structure diffusion barrier with high nitrogen content
#30933Method of manufacturing semiconductor device and semiconductor device
#30934Interconnect structure including a silicon oxycarbonitride layer
#30935Line level air gaps
#30936Semiconductor device having multiple wiring layers
#30937Dual damascene patterning method
#30938Wire structure and forming method of the same
#30939Low inductance via structures
#30940Energy beam treatment to improve the hermeticity of a hermetic layer
#30941Air gap interconnect structure and method thereof
#30942Stacked semiconductor device and method of manufacturing the same
#30943Methods of forming fusible devices
#30944Semiconductor device
#30945Atomic layer deposition of ZrN/ZrOfilms as gate dielectrics
#30946Methods of forming fusible devices
#30947Recessed gate dielectric antifuse
#30948Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device
#30949Leadframe alteration to direct compound flow into package
#30950Device and method for including passive components in a chip scale package
#30951Use of configurable mixed-signal building block functions to accomplish custom functions
#30952Semiconductor device manufacturing method and apparatus used in the semiconductor device manufacturing method
#30953Systems and methods for maintaining performance at a reduced power
#30954Methods for forming arrays of small, closely spaced features
#30955Thermal lamination module
#30956Method for mounting a light emitting device on a circuit board
#30957Semiconductor device
#30958On-die coupled inductor structures for improving quality factor
#30959Heat sink assembly
#30960Water-cooling heat dissipator
#30961Heat dissipation device
#30962Cooling system for a substrate
#30963Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
#30964Three-dimensional photonic crystal and optical device including the same
#30965Periodic patterns and technique to control misalignment between two layers
#30966Method for producing bridge modules
#30967Method to chemically remove metal impurities from polycide gate sidewalls
#30968Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
#30969Electrode material and semiconductor element
#30970Semiconductor device including interconnection structure in which lines having different widths are connected with each other
#30971Electronic apparatus having polynorbornene foam insulation
#30972Semiconductor device and method for manufacturing the same
#30973Method of fabricating strained channel field effect transistor pair having underlapped dual liners
#30974Barrier layer stack to prevent Ti diffusion
#30975Method of forming contact for dual liner product
#30976Electronic device package with an integrated evaporator
#30977Package cap with bypass capacitance
#30978Circuit board with trace configuration for high-speed digital differential signaling
#30979Stacking system and method
#30980Package for an integrated circuit
#30981Structural unit and method for the production of a structural unit
#30982Semiconductor device with non-intersecting power and ground wiring patterns
#30983Memory module system and method
#30984Semiconductor memory device with high permeability lines interposed between adjacent transmission lines
#30985Backside method for fabricating semiconductor components with conductive interconnects
#30986CAPACITOR STRUCTURE
#30987CAPACITIVE TECHNIQUES TO REDUCE NOISE IN HIGH SPEED INTERCONNECTIONS
#30988Methods of forming electromigration and thermal gradient based fuse structures
#30989Boron incorporated diffusion barrier material
#30990Method to chemically remove metal impurities from polycide gate sidewalls
#30991Process and electrostatic discharge protection device for the protection of a semiconductor circuit
#30992Semiconductor wafer, semiconductor device and manufacturing method of semiconductor device
#30993High-voltage transistor fabrication with trench etching technique
#30994Semiconductor fabrication using a collar
#30995Capacitor structure
#30996SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#30997Structure and method for RESURF diodes with a current diverter
#30998ELECTRICAL COUPLING STACK AND PROCESSES FOR MAKING SAME
#30999High current electrical switch and method
#31000Multichip light emitting diode package
#31001Nitride semiconductor device
#31002Two-phase silicate-based yellow phosphor
#31003Photoelectric conversion device and manufacturing method thereof
#31004Structure of heat dissipating fins
#31005Flattened contact cooling module
#31006Heat sink
#31007Microjet module assembly
#31008Methods for application of adhesive tape to semiconductor devices
#31009NANO IC
#31010R-cells containing CDM clamps
#31011Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
#31012Method for forming insulation film
#31013Methods for forming an enriched metal oxide surface
#31014Method of manufacturing semiconductor device
#31015Multi-layered copper line structure of semiconductor device and method for forming the same
#31016Oxygen bridge structures and methods to form oxygen bridge structures
#31017Method of manufacturing a semiconductor device
#31018Method of forming closed air gap interconnects and structures formed thereby
#31019Method of reducing process steps in metal line protective structure formation
#31020Nanotube fuse structure
#31021METHOD OF BLOWING THE FUSE STRUCTURE
#31022Process for producing an integrated circuit comprising a capacitor
#31023Formation of deep trench airgaps and related applications
#31024Surface-mounted device with leads
#31025Method for producing free-standing carbon nanotube thermal pads
#31026RTV silicone rubber composition for electric and electronic part protection, circuit boards, silver electrodes, and silver chip resistors
#31027Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
#31028Alternating current light-emitting device
#31029Heat dissipation device
#31030Thermal solution with isolation layer
#310313D multi-layer heat conduction diffusion plate
#31032Air Blown Chip Dissipation Device and Manufacturing Method Thereof
#31033Fan and heat sink combination
#31034Semiconductor superjunction device
#31035Method and apparatus for characterizing features formed on a substrate
#31036Light emitting apparatus, liquid crystal display apparatus and lighting apparatus
#31037Flexible diode connection for pressfit bridge rectifier
#31038LSI internal signal observing circuit
#31039Method and casting mold for producing a protective layer on integrated components
#31040Systems and methods for nanowire growth and harvesting
#31041Materials and method to seal vias in silicon substrates
#31042Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
#31043ZrAlxOy DIELECTRIC LAYERS
#31044Semiconductor device and method of fabricating the same
#31045Carbon containing silicon oxide film having high ashing tolerance and adhesion
#31046Semiconductor device and method of manufacturing the same
#31047Electrical interconnection, and image sensor having the electrical interconnection
#31048Structures and methods to enhance copper metallization
#31049Reliability and improved frequency response package for extremely high power density transistors
#31050Tightly engaged heat dissipating apparatus and method for manufacturing the same
#31051Cooling devices that use nanowires
#31052Terminal connection structure for semiconductor device
#31053Memory modules including SIMM and DIMM-type connection structures and related memory systems
#31054Forming semiconductor structures
#31055Semiconductor wafer
#31056Structure for preventing leakage of a semiconductor device
#31057Semiconductor device and a method of manufacturing the same
#31058Low crosstalk substrate for mixed-signal integrated circuits
#31059Ultra-violet protected tamper resistant embedded EEPROM
#31060Hard mask technique in forming a plug
#31061Manufacturing process and structure of power junction field effect transistor
#31062Light emitting diode light source model
#31063High power AllnGaN based multi-chip light emitting diode
#31064Multi element, multi color solid state LED/laser
#31065Bonded intermediate substrate and method of making same
#31066Method for production of a card with a double interface and microcircuit card obtained thus
#31067Orientation independent electroosmotic pump
#31068Substrate precursor structures
#31069Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit
#310703-dimensional high performance heat sinks
#31071Radiation board
#31072FLEXIBLE LOOP THERMOSYPHON
#31073Radiator and heatsink apparatus having the radiator
#31074Heat-emitting element cooling apparatus and heat sink
#31075Method for manufacturing a power bus on a chip
#31076Curable polycyclic compounds and process for the production thereof
#31077Wiring-connecting material and wiring-connected board production process using the same
#31078Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding
#31079Semiconductor device and manufacturing method thereof
#31080Aligned dummy metal fill and hole shapes
#31081Electroless deposition processes and compositions for forming interconnects
#31082Process for forming a dielectric on a copper-containing metallization and capacitor arrangement
#31083Circuit device and method of manufacturing thereof
#31084Method of fabricating wafer level package
#31085Integrated circuit on high performance chip
#31086Intermediate semiconductor device structures
#31087Method for fabricating a MIM capacitor high-K dielectric for increased capacitance density and related structure
#31088Method of manufacturing semiconductor device having conductive thin films
#31089Method for a low profile multi-IC chip package connector
#31090Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
#31091Anisotropic electrically conductive film and method of producing the same
#31092Thermal interface composit structure and method of making same
#31093In-situ silicidation metallization process
#31094Contact metallization scheme using a barrier layer over a silicide layer
#31095Imaging apparatus
#31096Display structures for light-emitting diodes
#31097Apparatus for absorbing and dissipating excess heat generated by a system
#31098Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method
#31099Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
#31100Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
#31101Liquid DIMM Cooler
#31102Method and apparatus for increasing natural convection efficiency in long heat sinks
#31103Electronic circuit apparatus
#31104System and method for electrostatic discharge protection in an electronic circuit
#31105Light-emitting device with enhanced homogeneity of image quality and operating speed of the driver circuit
#31106Semiconductor ground shield method
#31107Terminal pad structures and methods of fabricating same
#31108Electrical programmable metal resistor
#31109Semiconductor device
#31110Integrated circuit cooling and insulating device and method
#31111Metallization scheme including a low modulus structure
#31112Molded lead frame connector with one or more passive components
#31113Lead frame having contacting pins of different thickness
#31114Inductor with plural coil layers
#31115Anti-fuse one-time-programmable nonvolatile memory
#31116Reprogrammable electrical fuse
#31117Solid-state imaging device and method of manufacturing solid-state imaging device
#31118Semiconductor device and method of manufacturing the same
#31119Nonlinear via arrays for resistors to reduce systematic circuit offsets
#31120Interconnect structure encased with high and low k interlevel dielectrics
#31121Semiconductor device for non-volatile memory and method of manufacturing the same
#31122Buried guard ring and radiation hardened isolation structures and fabrication methods
#31123High voltage field effect device and method
#31124Electronic device
#31125Methods of and apparatuses for measuring electrical parameters of a plasma process
#31126Acrylic-based thermally conductive composition and thermally conductive sheet
#31127Visible light and IR combined image camera
#31128Methods for preparing ball grid array substrates via use of a laser
#31129Methods for preparing ball grid array substrates via use of a laser
#31130Methods for preparing ball grid array substrates via use of a laser
#31131Methods for preparing ball grid array substrates via use of a laser
#31132Heat exchanger
#31133Electronic device with improved cooling mechanism
#31134Method and apparatus for electronics cooling
#31135Liquid cooling system suitable for removing heat from electronic components
#31136Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler
#31137Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica
#31138Methods for the deposition of electrocatalyst particles
#31139MAKING CONTACT WITH THE EMITTER CONTACT OF A SEMICONDUCTOR
#31140Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity
#31141INTER-METAL DIELECTRIC FILL
#31142Technique for forming self-aligned vias in a metallization layer
#31143Method of forming a conductive contact
#31144Signal and/or ground planes with double buried insulator layers and fabrication process
#31145Product and method for integration of deep trench mesh and structures under a bond pad
#31146Semiconductor power device with passivation layers
#31147Dynamic metal fill for correcting non-planar region
#31148System and method for forming serial numbers on HDD wafers
#31149Light display structures
#31150Elastic secure device of a heat radiation module
#31151Airflow generating device and electronic apparatus
#31152Heat dissipation device for heat-generating electronic component
#31153Temperature control method and temperature control device
#31154Image device
#31155Semiconductor device and display device
#31156E-fuse circuit using leakage current path of transistor
#31157Flat panel display device
#31158OBLIQUE RECESS FOR INTERCONNECTING CONDUCTORS IN A SEMICONDUCTOR DEVICE
#31159Semiconductor device
#31160Semiconductor device including multi-layered interconnection and method of manufacturing the device
#31161Bow control in an electronic package
#31162Solder bumps in flip-chip technologies
#31163Design structure for coupling noise prevention
#31164Memory module
#31165Leadless leadframe electronic package and sensor module incorporating same
#31166PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#31167Capacitive techniques to reduce noise in high speed interconnections
#31168Semiconductor apparatus
#31169Split-channel antifuse array architecture
#31170Device for electrostatic discharge protection and method of manufacturing the same
#31171Semiconductor device including metal-oxide-silicon field-effect transistor as a trigger circuit
#31172Contacts to semiconductor fin devices
#31173Trench gate type semiconductor device
#31174Metal-poly integrated capacitor structure
#31175Semiconductor device and method of manufacture thereof
#31176High power light-emitting diode package and methods for making same
#31177Nitride semiconductor element having a silicon substrate and a current passing region
#31178Organic light emitting display device and method of fabricating the same
#31179Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device
#31180Electrical apparatus, cooling system therefor, and electric vehicle
#31181Heat pipe heat sink and method for fabricating the same
#31182INTEGRATED CIRCUIT HEAT PIPE HEAT SPREADER WITH THROUGH MOUNTING HOLES
#31183Liquid-cooled semiconductor unit for cooling high-power semiconductor elements that are enclosed in modules
#31184MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME
#31185Heat-dissipation device and electronic apparatus utilizing the same
#31186Semiconductor encapsulating epoxy resin composition and semiconductor device
#31187SEMICONDUCTOR STUCTURE AND METHOD OF MANUFACTURING THE SAME
#31188Method for fabricating semiconductor device
#31189Manufacturing process of semiconductor device
#31190Semiconductor device with robust polysilicon fuse
#31191Method to align mask patterns
#31192Underlayer for reducing surface oxidation of plated deposits
#31193Aerogel/PTFE composite insulating material
#31194Jet generating device and electronic apparatus
#31195Optical manifold for light-emitting diodes
#31196Heat dissipating assembly using liquid as a heat dissipating medium
#31197Thermal dissipation device with thermal compound recesses
#31198Power semiconductor module
#31199Heat dissipation device for multiple heat-generating components
#31200Heat-dissipation device with elastic member and heat-dissipation method thereof