Method for making a heat dissipating device

Method for making a heat dissipating device

METHOD FOR MAKING A HEAT PIPE

Manufacturing system for making a heat dissipating device

Use of electrical power multiplication for power smoothing in power distribution

System for monitoring and controlling a semiconductor manufacturing apparatus using prediction model equation

Wireless local loop antenna

Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method

Semiconductor device and manufacturing process therefor

Re-assembly process for MEMS structures

Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure

Method for forming a ruthenium metal layer on a patterned substrate

Structure and process for packaging RF MEMS and other devices

Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN

Very large scale immobilized polymer synthesis

Method of fabricating a package for a micro component

Light emitting module and related light source device

Processor/memory module with foldable substrate

Pad structure of wiring board and wiring board

Electronic assembly for switching electric power

Carbon nanotubes with controlled diameter, length, and metallic contacts

Semiconductor chip

Top via pattern for bond pad structure

Routing configuration for high frequency signals in an integrated circuit package

Thermal interface structure and process for making the same

Semiconductor cooling system and process for manufacturing the same

Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices

Support elements for semiconductor devices with peripherally located bond pads

Flat-shaped battery

Semiconductor device and MIM capacitor

Films deposited at glancing incidence for multilevel metallization

Semiconductor device having super junction structure

Selectable open circuit and anti-fuse element

High performance tunneling-biased MOSFET and a process for its manufacture

Semiconductor storage device and manufacturing method therefor, semiconductor device, portable electronic equipment and IC card

Semiconductor device having stacked decoupling capacitors

MOS image sensor

Electrical fuse for silicon-on-insulator devices

Method to accommodate increase in volume expansion during solder reflow

High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits

Electronic component housing structural body

Micro liquid cooling device

Cooling apparatus and electronic equipment

Isothermal plate heat-dissipating device

Cooling assembly with impingement cooled heat sink

Method for forming a semiconductor device

Structure and method for forming semiconductor wiring levels using atomic layer deposition

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Enhanced barrier liner formation for vias

Electric device and method for fabricating the same

Method for manufacturing a superjunction device with wide mesas

Method for forming plural kinds of wells on a single semiconductor substrate

Fabricating die with separate test pads selectively coupled to cores

Electrical connector structure of circuit board and method for fabricating the same

Twin insulator charge storage device operation and its fabrication method

Heat sink for memory strips

Torsion spring force and vertical shear pin retention of heat sink to CPU

Heat dissipation apparatus with second degree curve shape heat pipe

High density maze capacitor

Micro-electro-mechanical system (MEMS) capacitors, inductors, and related systems and methods

Electrochromic rearview mirror assembly incorporating a display/signal light

On die RFID tag antenna

Method for the production of a book cover insert and book-type security document and book cover insert and book-type security document

Electrically decoupled integrated transformer having at least one grounded electric shield

Pole-zero elements and related systems and methods

Apparatus and methods for adjusting performance characteristics and power consumption of programmable logic devices

APPARATUS AND METHODS FOR ADJUSTING PERFORMANCE CHARACTERISTICS OF CIRCUITRY IN PROGRAMMABLE LOGIC DEVICES

Semiconductor device featuring overlay-mark used in photolithography process

Wired circuit board

Semiconductor device and method of manufacturing the same

Barrier layer for conductive features

Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures

Semiconductor device, and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Integrated interconnect arrangement

Semiconductor device and method of fabricating a semiconductor device

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Semiconductor module

Power semiconductor package

Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties

Integrated circuit with temperature-controlled component

Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs

Adjustable self-aligned air gap dielectric for low capacitance wiring

Electrochemical device including a channel of an organic material, a gate electrode, and an electrolyte therebetween

Metal silicide adhesion layer for contact structures

Semiconductor device and a method of manufacturing the same and designing the same

Wireless chip and electronic appliance having the same

Field effect transistor with metal source/drain regions

D/A converter circuit, semiconductor device incorporating the D/A converter circuit, and manufacturing method of them

Semiconductor integrated circuit and semiconductor integrated circuit manufacturing method

Wavelength-converted semiconductor light emitting device

METHODS FOR REMOVING EXTRANEOUS AMOUNTS OF MOLDING MATERIAL FROM A SUBSTRATE

Treatment of the working layer of a multilayer structure

Flip chip mounting substrate

Fan and cooling apparatus

Heat-Dissipating Fin Set in Combination with Thermal Pipe

HEAT PIPE SUITABLE FOR APPLICATION IN ELECTRONIC DEVICE WITH LIMITED MOUNTING SPACE

Cooling device for electronic component using thermo-electric conversion material

Method of making circuitized substrate with signal wire shielding

Modified cycloolefin copolymer, process for producing the same, and use of the polymer

THERMAL INTERFACE MATERIAL AND FILLER USED THEREIN

Fastening structure

Particle Distribution Interposer and Method of Manufacture Thereof

Anisotropic conductive connector and circuit-device electrical-inspection device

LOCAL MULTILAYERED METALLIZATION

Manufacturing method for semiconductor device

Interconnect arrangement and associated production methods

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance

ANTIFUSE HAVING TANTALUM OXYNITRIDE FILM AND METHOD FOR MAKING SAME

High thermal conductive compounds

System for reviewing defects, a computer implemented method for reviewing defects, and a method for fabricating electronic devices

Semiconductor device having voltage output function trim circuitry and method for same

Photo-imaged stress management layer for semiconductor devices

Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film

Manufacture of porous diamond films

Ceramic circuit substrate and manufacturing method thereof

Semiconductor laser module and a method for manufacturing the same

Nano memory, light, energy, antenna and strand-based systems and methods

Twin insulator charge storage device operation and its fabrication method

Multi-resistive integrated circuit memory

Heat sink assembly

Method and apparatus for cooling a circuit component

Embedded multilayer chip capacitor and printed circuit board having the same

Variable inductor technique

Mold cleaning sheet and method of producing semiconductor devices using the same

Semiconductor device and semiconductor wafer

Electronic device components including protective layers on surfaces thereof

Backend metallization method and device obtained therefrom

Semiconductor device and manufacturing method thereof

Electrically conductive line, method of forming an electrically conductive line, and method of reducing titanium silicide agglomeration in fabrication of titanium silicide over polysilicon transistor gate lines

Method of fabricating a multilayered dielectric diffusion barrier layer

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Integrated circuit chip

Leadframe, coining tool, and method

Superconductor wires for back end interconnects

THREE-DIMENSIONAL MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF

Dense semiconductor fuse array

Electrical fuses with redundancy

Electronic subassembly having conductive layer, conductive film and method of making the same

Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same

MIM capacitor including ground shield layer

Suspended transmission line structures in back end of line processing

White light source and illumination apparatus using the same

Substrate with refractive index matching

Printed circuit board with embedded capacitors therein and manufacturing process thereof

Aerogel/PTFE composite insulating material

Aerogel/PTFE composite insulating material

Integrated circuit coolant microchannel with compliant cover

Cooling system and electronic apparatus

Fluidic pump for heat management

VAPOR CHAMBER WITH BOILING-ENHANCED MULTI-WICK STRUCTURE

Heatsink assembly

System and method for thermal management using distributed synthetic jet actuators

HEAT SINK

Cooling mechanism

Full coverage spray and drainage system and method for orientation-independent removal of high heat flux

Cooling device for multiple heat-generating components

Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit

Semiconductor memory device and stress testing method thereof

Configurable voltage regulator

Iso/nested control for soft mask processing

Thermally conductive adhesive composition and process for device attachment

Oxygen-scavenging packaging

Technique to radiation-harden trench refill oxides

Plasma nitridization for adjusting transistor threshold voltage

High-k dielectric film, method of forming the same and related semiconductor device

Plasma Treatment of an Etch Stop Layer

Plasma nitridization for adjusting transistor threshold voltage

Metal interconnect structure and method

Semiconductor device with wirings having varying lengths

Control of wafer warpage during backend processing

Interconnecting process and method for fabricating complex dielectric barrier layer

Method of forming multilayer film

Process for the aligned manufacture of electronic semiconductor devices in a SOI substrate

Method for manufacturing a semiconductor device having an alignment feature formed using an N-type dopant and a wet oxidation process

MIS-type semiconductor device

Semiconductor device and method of manufacturing the same

Micro-component packaging process and set of micro-components resulting from this process

Method of manufacturing a flexible electronic device and flexible device

Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same

Microlens manufacturing method and solid-state image pick-up unit manufacturing method

Semiconductor device, method of manufacturing the same, and phase shift mask

Light emitting diode having conductive reflecting layer

Vehicle headlamp

Liquid-cooling heat dissipation module

Thin multi-terminal capacitor and method of manufacturing the same

Power semiconductor apparatus provided with power controlling semiconductor modules connected in parallel to each other

Surface inspection apparatus and surface inspection method

Methods and systems for thermal-based laser processing a multi-material device

Lead frame for surface mount-type piezoelectric vibrator

System and method for reducing voltage drops in integrated circuits

Chip carrier and system including a chip carrier and semiconductor chips

Semiconductor integrated device and method of providing shield interconnection therein

Semiconductor device

Method for producing a plurality of electronic devices

Method of forming an encapsulation layer on a back side of a wafer

Semiconductor wafer assemblies

Method of forming electronic devices

Interface module for connecting LSI packages, and LSI-incorporating apparatus

Semiconductor integrated circuit device and process for manufacturing the same

Inductor fabricated with dry film resist and cavity and method of fabricating the inductor

System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference

Contact assembly and socket for use with semiconductor packages

Process for packaging micro-components using a matrix

Self-aligned semiconductor contact structures

Semiconductor light emitting device and surface light emitting device

Light emitting device and light emitting system

Wavelength-convertible light emitting device

Electro-optical device and electronic device

Semiconductor circuit and arrangement and method for monitoring fuses of a semiconductor circuit

Electric range

High-speed, precise, laser-based material processing method and system

Multilayer printed wiring board and a process of producing same

Printed circuit board, flip chip ball grid array board and method of fabricating the same

Liquid-cooled heat dissipation module

Radiator

Liquid-cooled heat dissipation module

Apparatus for spin coating semiconductor substrates

INSULATED GLAZING UNITS AND METHODS

System and process for manufacturing custom electronics by combining traditional electronics with printable electronics

Building metal pillars in a chip for structure support

Systems and methods for power smoothing in power distribution

Method for producing particulate alumina and composition containing particulate alumina

Epoxy resin composition, process for providing latency to the composition and a semiconductor device

Solution for etching copper surfaces and method of depositing metal on copper surfaces

Method of forming damascene filament wires and the structure so formed

Trench interconnect structure and formation method

Reliable BEOL integration process with direct CMP of porous SiCOH dielectric

Method of manufacturing semiconductor device and semiconductor device

Method and system for laser hard marking

Method for fabricating a metal-insulator-metal capacitor

Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor

High-density nonvolatile memory

Structure and method for integrating MIM capacitor in BEOL wiring levels

High reliability multilayer circuit substrates and methods for their formation

Process for assembling a double-sided circuit component

Method for efficient annealing of plated semiconductor package leads

Wafer having alternating design structure and method for manufacturing semiconductor package using the same

MEMS heat pumps for integrated circuit heat dissipation

Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating apparatus used for the same

Method for improving design window

Arrangement and method for cooling a power semiconductor

LED illumination devices

Structure for heat dissipation of integrated circuit chip and display module including the same

Heat dissipating module with engaging assembly

Insulated glazing units

Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith

Radio frequency label module

On-chip inductor with magnetic core

Circuit apparatus and method for operating the same

Semiconductor device, and method for manufacturing the same

Semiconductor-on-diamond devices and methods of forming

Method of manufacturing semiconductor device and semiconductor device

Light shield for CMOS imager

Delamination reduction between vias and conductive pads

Semi-conductor die mount assembly

Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus

Memory device power distribution in memory assemblies

Semiconductor device and manufacturing method thereof

High frequency unit

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

Semiconductor apparatus and MIS logic circuit

Semiconductor device such as semiconductor laser device and manufacturing method therefor, and optical transmission module and optical disk unit employing the semiconductor laser device

Method and system for qualifying a semiconductor etch process

Semiconductor apparatus and fabrication method of the same

High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby

Power supply system employing conductive fluid

Electronic package and packaging method

Conductive contamination reliability solution for assembling substrates

Heat radiation module with transverse flow fan

Heat exchanger assembly

Cooling plate module

Liquid-cooling heat dissipation apparatus

Heat pipe cooling system and thermal connector thereof

Liquid cooling system

Porous media cold plate

System and method for thermal management using distributed synthetic jet actuators

Thermal dissipation device

Radiator structure

High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials

Method of manufacturing a multilayer wiring board

Etchant composition and manufacturing method for thin film transistor array panel

Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film

Electronic device sealed under vacuum containing a getter and method of operation

Method for manufacturing a ceramic/metal substrate

Manufacturing method for semiconductor device and rapid thermal annealing apparatus

Atomic layer deposition of ZrN/ZrO films as gate dielectrics

Method of forming a wear-resistant dielectric layer

Method of piping defect detection

Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property

Encapsulated thermally conductive electrically insulating assembly and method to prepare same

Interchangeable LED bulb and light string assembly therewith

Etched leadframe for reducing metal gaps

Heat dissipation device and heat dissipation method for electronic equipment

Redundant power beneath circuit board

Microprocessor assembly

Heat sink module for an electronic device